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PDF STG4159 Data sheet ( Hoja de datos )

Número de pieza STG4159
Descripción Low voltage 0.3 Ohm max single SPDT switch
Fabricantes ST Microelectronics 
Logotipo ST Microelectronics Logotipo



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STG4159
Low voltage 0.3max single SPDT switch with
break-before-make feature and 10kV contact ESD protection
Features
Wide operating voltage range:
VCC (OPR) = 1.65V to 4.8V
Low power dissipation:
ICC = 0.2µA (max.) at TA = 85°C
Low "ON" resistance VIN = 0V:
– RON = 0.40(max. TA = 25ºC) at
VCC = 2.25V
– RON = 0.35(max. TA = 25ºC) at
VCC = 3.0V
– RON = 0.30(max. TA = 25ºC) at
VCC = 4.3V
Separate supply voltage for switch and control
pin
Latch-up performance exceeds 100mA per
JESD 78, Class II
ESD performance tested on common channel
(D pin)
– 10kV IEC-61000-4-2 ESD, contact
discharge
– 15kV IEC-61000-4-2 ESD, air discharge
ESD performance test on all other pins
– 10kV IEC-61000-4-2 ESD, contact
discharge
– 500V machine model (JESD22 A115-A)
– 1500V charged-device model
(JESD22 C101)
Flip-Chip7
Description
The STG4159 is a high-speed CMOS low voltage
single analog SPDT (Single Pole Dual Throw)
switch or 2:1 multiplexer/demultiplexer switch
fabricated in silicon gate C2MOS technology. It is
designed to operate from 1.65V to 4.58V, making
this device ideal for portable applications. It offers
low ON-resistance (0.45) at VCC = 4.3V. The
SEL inputs are provided to control the switches.
The switch S1 is ON (connected to common Port
D) when the SEL input is held high and OFF
(high impedance state exists between the two
ports) when SEL is held low; the switch S2 is ON
(it is connected to common Port D) when the SEL
input is held low and OFF (high impedance state
exist between the two ports) when SEL is held
high.
Additional key features are fast switching speed,
break-before-make delay time and ultra low power
consumption. All inputs and outputs are equipped
with protection circuits against static discharge,
giving them ESD immunity and transient excess
voltage.
Table 1.
Device summary
Part number
STG4159
STG4159BJR
April 2007
Package
Flip-Chip7
Flip-Chip7
Rev 3
Packaging
Tube
Tape and reel
1/18
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18

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STG4159 pdf
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STG4159
2 Maximum rating
Maximum rating
Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause
permanent damage to the device. These are stress ratings only and operation of the device at
these or any other conditions above those indicated in the Operating sections of this
specification is not implied. Exposure to Absolute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and
other relevant quality documents.
Table 4. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC Supply voltage
VL Logic supply voltage
VI DC input voltage
VIC DC control input voltage
VO DC output voltage
IIKC DC input diode current on control pin (VSEL < 0V)
IIK DC input diode current (VSEL < 0V)
IOK DC output diode current
IO DC output current
IOP DC output current peak (pulse at 1ms, 10% duty cycle)
ICC or IGND DC VCC or ground current
PD Power dissipation at TA = 70ºC (1)
Tstg Storage temperature
TL Lead temperature (10 sec)
1. Derate above 70ºC by 18.5mW/C
-0.5 to 5.5
-0.5 to 5.5
-0.5 to VCC + 0.5
-0.5 to VL + 0.5
-0.5 to VCC + 0.5
-50
±50
±20
±300
±500
±100
500
-50 to 105
260
V
V
V
V
V
mA
mA
mA
mA
mA
mA
mW
°C
°C
Table 5. Recommended operating conditions
Symbol
Parameter
VCC Supply voltage (1)
VL Logic supply voltage (2)
VI Input voltage
VIC Control input voltage
VO Output voltage
Top Operating temperature
dt/dv Input rise and fall time control input
VL = 1.65V to 2.7V
VL = 3.0V to 4.8V
1. Truth Table guaranteed: 1.65V to 4.8V
2. VL pin should not be left floating.
Value
1.65 to 4.8
1.65 to VCC
0 to VCC
0 to VL
0 to VCC
-40 to 85
0 to 20
0 to 10
Unit
V
V
V
V
V
°C
ns/V
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STG4159 arduino
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STG4159
Figure 11. Switching time and charge injection
(VGEN = 0V, RGEN = 0, RL = 1M, CL = 100pF)
Test circuits
Figure 12. Turn ON, turn OFF delay time
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