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PDF MBRS2H100T3G Data sheet ( Hoja de datos )
| Número de pieza | MBRS2H100T3G | |
| Descripción | 2A 100V SCHOTTKY SMB PACKAGE | |
| Fabricantes | ON Semiconductor | |
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MBRS2H100T3G
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal-to-silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
•ăCompact Package with J-Bend Leads Ideal for Automated Handling
•ăHighly Stable Oxide Passivated Junction
•ăGuard-Ring for Overvoltage Protection
•ăLow Forward Voltage Drop
•ăThis is a Pb-Free Device
Mechanical Characteristics
•ăCase: Molded Epoxy
•ăEpoxy Meets UL 94 V-0 @ 0.125 in
•ăWeight: 95 mg (Approximately)
•ăCathode Polarity Band
•ăLead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•ăFinish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•ăESD Ratings: Machine Model = B, Human Body Model = 3B
•ăDevice Meets MSL1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
V
Average Rectified Forward Current
IO 2.0 A
Non-Repetitive Peak Surge Current
IFSM 130 A
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Storage Temperature Range
Tstg -65 to +175 °C
Operating Junction Temperature (Note 1)
TJ -65 to +175 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction-to-Ambient: dPD/dTJ < 1/RqJA.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 100 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
B210G
G
B210 = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBRS2H100T3G SMB 2500 / Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
June, 2007 - Rev. 2
1
Publication Order Number:
MBRS2H100/D
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet MBRS2H100T3G.PDF ] | |
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