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PDF APM3048ADU4 Data sheet ( Hoja de datos )
| Número de pieza | APM3048ADU4 | |
| Descripción | Dual Enhancement Mode MOSFET | |
| Fabricantes | Anpec Electronics | |
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APM3048ADU4
Dual Enhancement Mode MOSFET (N-and P-Channel)
Features
• N-Channel
30V/9A,
RDS(ON)=21mΩ (typ.) @ VGS=10V
RDS(ON)=27mΩ
(typ.)
@
V =4.5V
GS
• P-Channel
-30V/-9A,
RDS(ON)=36mΩ (typ.) @ VGS= -10V
RDS(ON)=46mΩ (typ.) @ VGS=-4.5V
• Super High Dense Cell Design
• Reliable and Rugged
• ESD Rating : 2KV HBM
• Lead Free Available (RoHS Compliant)
Applications
Pin Description
D1 D2
S1 G1
S2 G2
Top View of TO-252-4
(3) (3)
D1 D2
(5)
(2) G2
G1
• Power Management in LCD monitor/TV
Ordering and Marking Information
S1
(1)
N MOS
S2
(4)
P MOS
APM3048AD
Lead Free Code
Handling Code
Temp. Range
Package Code
Package Code
U4 : TO-252-4
Operating Junction Temp. Range
C : -55 to 150° C
Handling Code
TU : Tube TR : Tape & Reel
Lead Free Code
L : Lead Free Device
APM3048AD U4 : APM3048A
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish;
which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL
classification at lead-free peak reflow temperature.
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jul., 2006
1
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APM3048ADU4
Typical Characteristics (Cont.)
N-Channel
30
25
Output Characteristics
V = 4, 5, 6, 7, 8, 9, 10V
GS
3.5V
20
15
3V
10
5 2.5V
2V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VDS - Drain-Source Voltage (V)
Drain-Source On Resistance
40
35
30
V =4.5V
GS
25
V =10V
GS
20
15
10
0 5 10 15 20 25 30
ID - Drain Current (A)
Drain-Source On Resistance
50
I =9A
D
45
40
35
30
25
20
15
10
1 2 3 4 5 6 7 8 9 10
VGS - Gate - Source Voltage (V)
Gate Threshold Voltage
1.8
I
DS
=250µA
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25 0 25 50 75 100 125 150
Tj - Junction Temperature (°C)
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jul., 2006
5
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APM3048ADU4
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
TP
TL
Tsmax
tp
Ramp-up
tL
Critical Zone
TL to TP
T s m in
ts
Preheat
Ramp-down
25 t 25 °C to Peak
Classification Reflow Profiles
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
3°C/second max.
100°C
150°C
60-120 seconds
3°C/second max.
150°C
200°C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
183°C
60-150 seconds
See table 1
217°C
60-150 seconds
See table 2
Time within 5°C of actual
Peak Temperature (tp)
10-30 seconds
20-40 seconds
Ramp-down Rate
6°C/second max.
6°C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Jul., 2006
11
www.anpec.com.tw
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| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet APM3048ADU4.PDF ] | |
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