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PDF HBNP3946S6R Data sheet ( Hoja de datos )
| Número de pieza | HBNP3946S6R | |
| Descripción | General Purpose NPN / PNP Epitaxial Planar Transistors | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
Spec. No. : C902S6R
Issued Date : 2003.03.18
Revised Date :
Page No. : 1/5
General Purpose NPN / PNP Epitaxial Planar Transistors
(dual transistors)
HBNP3946S6R
Features
• Includes a 2N3904 chip and 2N3906 chip in a SOT-363R package.
• Mounting possible with SOT-323 automatic mounting machines.
• Transistor elements are independent, eliminating interference.
• Mounting cost and area can be cut in half.
Equivalent Circuit
HBNP3946S6R
SOT-363R
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
Pd
Tj
Tstg
Limits
TR1 (NPN)
TR2 (PNP)
60 -40
40 -40
6 -5
200 -200
300(total) *1
150
-55~+150
Note: *1 200mW per element must not be exceeded.
Unit
V
V
V
mA
mW
°C
°C
HBNP3946S6R
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-363R Dimension
Spec. No. : C902S6R
Issued Date : 2003.03.18
Revised Date :
Page No. : 5/5
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
Marking:
46
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
DIM
Inches
Min. Max.
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026BSC
H - 0.004
Millimeters
Min. Max.
DIM
Inches
Min. Max.
1.8 2.2 J 0.004 0.010
1.15 1.35
K 0.004 0.012
0.8 1.1 N
0.008 REF
0.1 0.3 S 0.079 0.087
0.65BSC
Y 0.012 0.016
- 0.1
*:Typical
Millimeters
Min. Max.
0.1 0.25
0.1 0.30
0.20 REF
2.00 2.40
0.30 0.40
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBNP3946S6R
CYStek Product Specification
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