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PDF HSDL-3220 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-3220 | |
| Descripción | Data Compliant Low Power 4.0 Mbit/s Infrared Transceiver | |
| Fabricantes | Agilent | |
| Logotipo |  |
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Agilent HSDL-3220 IrDA®
Data Compliant Low Power
4.0 Mbit/s Infrared Transceiver
www.DataSheet4U.com
Data Sheet
Description
The HSDL-3220 is a new
generation low profile high speed
infrared transceiver module that
provides interface between logic
and IR signals for through-air,
serial, half-duplex IR data-link.
The module is fully compliant to
IrDA Physical Layer specification
version 1.4 low power from
9.6kbit/s to 4.0 Mbit/s (FIR) and
is IEC825-Class 1 Eye Safe.
The HSDL-3220 can be shutdown
completely to achieve very low
power consumption. In the
shutdown mode, the PIN diode
will be inactive and thus produc-
ing very little photocurrent even
under very bright ambient light.
It is also designed to interface to
input/output logic circuits as low
as 1.8V. These features are ideal
for mobile devices that require
low power consumption.
VCC CX2
CX4
IOVCC (7)
SD (5)
VCC (6)
CX1
HSDL-3220
GND (8)
RXD (4)
TXD (3)
LED C (2)
Vled R1 LED A (1)
CX3
TRANSMITTER
Figure 1. Functional block diagram of HSDL-3220.
Features
• Fully compliant to IrDA 1.4 physical
layer low power specification from
9.6 kbit/s to 4.0 Mbit/s (FIR)
• Miniature package
– Height: 2.5 mm
– Width: 8.0 mm
– Depth: 3.0 mm
• Typical link distance > 50 cm
• Guaranteed temperature performance,
-25o to 70oC
• Critical parameters are guaranteed over
temperature and supply voltage
• Low power consumption
– Low shutdown current
– Complete shutdown of TXD, RXD,
and PIN diode
• Excellent EMI performance
• Vcc supply 2.7 to 3.6 Volts
• Interfacing with I/O logic circuits as
low as 1.8 V
• Lead-free package
• LED stuck-high protection
• Designed to accommodate light loss
with cosmetic windows
• IEC 825-class 1 eye safe
• Lead-free and RoHS Compliant
Applications
• Mobile telecom
– Mobile phones
– Smart phones
– Pagers
• Data communication
– Pocket PC handheld products
– Personal digital assistants
– Portable printers
• Digital imaging
– Digital cameras
– Photo-imaging printers
• Electronic wallet
• Small industrial & medical
instrumentation
– General data collection devices
– Patient & pharmaceutical data
collection devices
876 54321
Figure 2. Rear view diagram with pinout.
1 page  
Electrical and Optical Specifications
Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.
Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C, Vcc set to 3.0V
and IOVcc set to 1.8V unless otherwise noted.
Parameter
Symbol Min.
Typ. Max. Units Conditions
Receiver
Viewing Angle
2θ 30
°
Peak Sensitivity Wavelength
λp
880 nm
RXD Output Voltage Logic High
Logic Low
RXD Pulse Width (SIR)[15]
RXD Pulse Width (MIR)[16]
RXD Pulse Width (FIR) [16]
RXD Rise and Fall Times
Receiver Latency Time[17]
Receiver Wake Up Time[18]
Transmitter
VOH
VOL
tPW (SIR)
tPW(MIR)
tPW(FIR)
tr, tf
tL
tW
IOVCC – 0.2
0
1
100
80
60
25
50
IOVCC
0.4
4.0
500
175
50
100
V
V
µs
ns
ns
ns
µs
µs
IOH = -200 µA, EI ≤ 0.3 µW/cm2
IOL = 200 µA, EI ≥ 8.1 µW/cm2
θ ≤ 15°, CL = 9 pF
θ ≤ 15°, CL = 9 pF
θ ≤ 15°, CL = 9 pF
CL = 9 pF
Radiant Intensity
Viewing Angle
IEH 10
2θ 30
45
60
mW/sr
°
ILEDA= 150 mA, θ ≤ 15°, VTXD ≥ VIH,
VSD ≤ VIL, Ta=25°C
Peak Wavelength
Spectral Line Half Width
λp
∆λ
875 nm
35 nm
TXD Input Current
High
Low
LED ON Current
TXD Pulse Width (SIR)
TXD Pulse Width (MIR)
TXD Pulse Width (FIR)
Maximum Optical PW[19]
TXD Rise and fall Time (Optical)
LED Anode On-State Voltage
Transceiver
IH
IL
ILEDA
tPW (SIR)
tPW(MIR)
tPW(FIR)
tPW(max.)
tr, tf
1.5
148
115
VON(LEDA)
10
10
150
1.6 1.8
217 260
125 135
50 100
600
40
1.6 2.1
µA
µA
mA
µs
ns
ns
µs
ns
ns
V
VTXD ≥ VIH
0 ≤ VTXD ≤ VIL
VTXD ≥ VIH, R1=5.6ohm, Vled=3.0V
tPW (TXD) = 1.6 µs at 115.2 kbit/s
tPW (TXD) = 217 ns at 1.152 Mbit/s
tPW(TXD)=125 ns at 4.0 Mbit/s
tPW(TXD) = 1.4 µs at 115.2 kbit/s
tPW (TXD) = 125 ns at 4.0 Mbit/s
ILEDA=150 mA, VTXD≥VIH
Supply Current
Shutdown ICC1
0.1 1
µA VSD ≥ VIH, Ta= 25°C
Idle ICC2
1.8 3.0 mA VSD ≤ VIL, VTXD ≤ VIL, EI=0
Notes:
15. For in-band signals from 9.6 kbit/s to 115.2 kbit/s, where 9 µW/cm2 ≤ EI ≤ 500 mW/cm2.
16. For in-band signals from 0.576 Mbit/s to 4.0 Mbit/s, where 22.5 µW/cm2 ≤ EI ≤ 500 mW/cm2.
17. Latency time is defined as the time from the last TxD light output pulse until the receiver has recovered full sensitivity.
18. Receiver wake up time is measured from Vcc power on or SD pin high to low transition to a valid RXD output.
19. The maximum optical PW is the maximum time the LED remains on when the TXD is constantly high. This is to prevent long turn on time of the LED
for eye safety protection.
5
5 Page 
Appendix A: SMT Assembly Application Note
Solder Pad, Mask and Metal Stencil Aperture
STENCIL APERTURE
METAL STENCIL
FOR SOLDER PASTE
PRINTING
SOLDER MASK
Figure 12. Stencil and PCBA.
LAND PATTERN
PCB
Recommended Land Pattern
CL
1.35
MOUNTING
CENTER
0.10
SHIELD
SOLDER PAD
1.25
2.05
1.75
0.60
UNIT: mm
Figure 13. Stencil and PCBA.
0.475
1.425
2.375
3.325
0.775
FIDUCIAL
11
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| PDF Descargar | [ Datasheet HSDL-3220.PDF ] | |
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