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PDF CMM1200 Data sheet ( Hoja de datos )
| Número de pieza | CMM1200 | |
| Descripción | GaAs MMIC Low Noise Amplifier | |
| Fabricantes | Mimix Broadband | |
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2.0-6.0 GHz GaAs MMIC
Low Noise Amplifier
August 2006 - Rev 02-Aug-06
CMM1200
2.0 to 6.0 GHz
GaAs MMIC
Low-Noise Amplifier
Advanced Product Information
May 2005 V1.5
(1 of 5)
Features
Small Size: 1.60 x 1.55 x 0.076 mm
Integrated On-Chip Drain Bias Coil
Integrated On-Chip DC Blocking
Single Bias Operation
Directly Cascadable – Fully Matched, Novel
Feedback & Distributed Amplifier Design
P1dB: 15.5 dBm @ 6 GHz, Typ.
High Linear Gain: 17.5 dB Typ.
Noise Figure: 3.3 dB Typ. @ 6 GHz
pHEMT Technology
Silicon Nitride Passivation
Chip Diagram
www.DataSheet4U.com
Specifications (TA = 25°C, Vdd = 5V) 1
Parameters
Frequency Range
Linear Gain
Gain Variation (over operating frequency)
Power Output (@1 dB Gain Compression)
P1dB Variation (over operating frequency)
Saturated Output Power
Third Order Intercept Point (@ 6 GHz)
Second Order Intercept Point (@ 6 GHz)
Noise Figure (@6 GHz)
Input Return Loss 2
Output Return Loss 2
Current
Thermal Resistance
Stability
Notes: 1. Tested on Celeritek connectorized evaluation board.
2. Measured on wafer.
Units
GHz
dB
±dB
dBm
dBm
dBm
dBm
dBm
dB
dB
dB
mA
°C/W
Min
2.0
16.0
14.0
19.0
85
Unconditionally Stable
Typ
17.5
15.5
25.5
41.0
3.3
100
34.0
Max
6.0
2.0
1.0
23.0
3.8
-9.5
-12.0
115
Absolute Maximum Ratings 1
Parameter
Rating
Drain Voltage
4.5V (min.) / 8.0V (max.)
Drain Current
150 mA
Continuous Power Dissipation
1.2 W
Input Power
Storage Temperature
10 dBm
-50°C to +150°C
Channel Temperature
Operating Backside Temperature 2
175°C
-40°C Min.
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175–(Pdis [W] x 34) [°C].
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over ther-
mosonic bonding. For thermocompression bonding: Stage
Temperature: 250°C; Bond Tip Temperature: 150°C; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
1 page  
2.0-6.0 GHz GaAs MMIC
Low Noise Amplifier
August 2006 - Rev 02-Aug-06
Assembly Example
CMM1200
Ordering Information
The CMM1200-BD is available in bare die and is shipped in Gel Pak.
Part Number for Ordering
Package
CMM1200-BD
Bare Die
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 5
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CMM1200.PDF ] | |
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