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Número de pieza | CMM1110 | |
Descripción | GaAs MMIC Low Noise Amplifier | |
Fabricantes | Mimix Broadband | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CMM1110 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
No Preview Available ! 2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
May 2006 - Rev 01-May-06
Features
Self Bias Architecture
16.0 dB Small Signal Gain
2.5 dB Noise Figure
+13.0 dBm P1dB Compression Point
100% Visual Inspection to MIL-STD-883
Method 2010
CMM1110
Chip Device Layout
General Description
Mimix Broadband’s two stage 2.0-18.0 GHz GaAs MMIC
low noise amplifier has a small signal gain of 16.0 dB
with a noise figure of 2.5 dB across the band.This MMIC
uses Mimix Broadband’s 0.3 µm GaAs PHEMT device
model technology, and is based upon optical beam
lithography to ensure high repeatability and uniformity.
The chip has surface passivation to protect and provide
a rugged part with backside via holes and gold
www.DataSheet4U.commetallization to allow either a conductive epoxy or
eutectic solder die attach process.This device is well
suited for fiber optic, microwave radio, military, space,
telecom infrastructure, test instrumentation and VSAT
applications.
Absolute Maximum Ratings
Supply Voltage (Vd)
Supply Current (Id)
Input Power (Pin)
Storage Temperature (Tstg)
Operating Temperature (Ta)
Channel Temperature (Tch)
+9.0 VDC
110 mA
+20 dBm
-65 to +165 OC
-55 to MTTF Table1
MTTF Table1
(1) Channel temperature affects a device's MTTF. It is
recommended to keep channel temperature as low as
possible for maximum life.
Electrical Characteristics (Ambient Temperature T = 25 oC)
Parameter
Frequency Range (f )
Input Return Loss (S11)
Output Return Loss (S22)
Small Signal Gain (S21)
Gain Flatness ( S21)
Reverse Isolation (S12)
Noise Figure (NF)
Output Power for 1 dB Compression (P1dB)
Output Second Order Intercept Point (OIP2)
Output Third Order Intercept Point (OIP3)
Drain Bias Voltage (Vd1,2)
Supply Current (Id) (Vd1,2=8.0V)
Units Min. Typ. Max.
GHz 2.0
- 18.0
dB - 9.0 -
dB - 10.0 -
dB - 16.0 -
dB - +/-1.0 -
dB - 30.0 -
dB - 2.5 -
dBm - +13.0 -
dBm - +31.0 -
dBm - +22.0 -
VDC - +8.0 +8.5
mA - 70 90
100% on-wafer DC testing and 100% RF wafer qualification. Wafer qualification includes sample testing from each quadrant
with an 80% pass rate required.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 7
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
1 page 2.0-18.0 GHz GaAs MMIC
Low Noise Amplifier
May 2006 - Rev 01-May-06
Mechanical Drawing 0.091
(0.036)
1.100
(0.043)
1.009
(0.040)
2
0.949
(0.037)
3
1.908
(0.075)
4
CMM1110
0.520
(0.021)
1
5 0.520
(0.021)
0.0
0.0
12 11 10
0.869
(0.034)
0.759 0.979
(0.030) (0.039)
9 876
1.688 1.908
(0.067) (0.075)
1.383
1.798 2.000
(0.054)
(0.071) (0.079)
(Note: Engineering designator is M420)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.080 x 0.080 (0.003 x 0.003). All RF Bond Pads are 0.180 x 0.080 (0.007 x 0.003).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.364 mg
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bond Pad #4 (Vd2)
Bond Pad #7 (Rs2-20.0 )
Bond Pad #5 (RF Out) Bond Pad #8 (Rs2-15 )
Bond Pad #6 (Rs2-32 ) Bond Pad #9 (Vg2)
Bond Pad #10 (Rs1-32 )
Bond Pad #11 (Rs1-20 )
Bond Pad #12 (Rs1-15 )
Bias Arrangement
Vd1,2
Bypass Capacitors - See App Note [2]
23
4
RF In 1
5 RF Out
12 11 10
9 876
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 7
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
5 Page |
Páginas | Total 7 Páginas | |
PDF Descargar | [ Datasheet CMM1110.PDF ] |
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