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PDF SGA-3363Z Data sheet ( Hoja de datos )
| Número de pieza | SGA-3363Z | |
| Descripción | Cascadable SiGe HBT MMIC Amplifier | |
| Fabricantes | Sirenza Microdevices | |
| Logotipo |  |
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SGA-3363
Product Description
The SGA-3363 is a high performance SiGe HBT MMIC Amplifier.
A Darlington configuration featuring 1 micron emitters provides
high FT and excellent thermal perfomance. The heterojunction
increases breakdown voltage and minimizes leakage current
between junctions. Cancellation of emitter junction non-
linearities results in higher suppression of intermodulation prod-
ucts. Only 2 DC-blocking capacitors, a bias resistor and an
optional RF choke are required for operation.
SGA-3363Z Pb RoHS Compliant
& Green Package
DC-5500 MHz, Cascadable
SiGe HBT MMIC Amplifier
The matte tin finish on Sirenza’s lead-free package utilizes a
post annealing process to mitigate tin whisker formation and is
RoHS compliant per EU Directive 2002/95. This package is also
manufactured with green molding compounds that contain no
antimony trioxide nor halogenated fire retardants
Gain & Return Loss vs. Frequency
20
GAIN
VD= 2.6 V, ID= 35 mA (Typ.)
15
IRL
10
ORL
5
0
-10
-20
-30
0 -40
0123456
Frequency (GHz)
TL=+25ºC
Product Features
• Now available in Lead Free, RoHS
Compliant, & Green Packaging
• High Gain : 15.9 dB at 1950 MHz
• Cascadable 50 Ohm
• Operates From Single Supply
• Low Thermal Resistance Package
Applications
• PA Driver Amplifier
• Cellular, PCS, GSM, UMTS
• IF Amplifier
• Wireless Data, Satellite
Symbol
Parameter
Units Frequency Min. Typ. Max.
G Small Signal Gain
P1dB
OIP3
Output Power at 1dB Compression
Output Third Order Intercept Point
dB
dBm
dBm
850 MHz
1950 MHz
2400 MHz
850 MHz
1950 MHz
850 MHz
1950 MHz
15.5
17.5
15.9
15.3
11.6
10.5
25.4
23.1
19.5
Bandwidth Determined by Return Loss (>10dB)
MHz
5500
IRL Input Return Loss
dB 1950 MHz
20.4
ORL Output Return Loss
dB 1950 MHz
25.5
NF Noise Figure
dB 1950 MHz
3.5
VD Device Operating Voltage
V
ID Device Operating Current
mA
RTH, j-l Thermal Resistance (junction to lead) °C/W
Test Conditions:
VS = 5 V
RBIAS = 68 Ohms
ID = 35 mA Typ.
TL = 25ºC
2.3 2.6 2.9
31 35 39
255
OIP3 Tone Spacing = 1 MHz, Pout per tone = -5 dBm
ZS = ZL = 50 Ohms
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
1 EDS-100634 Rev F
1 page  
SGA-3363 DC-5500 MHz Cascadable MMIC Amplifier
SOT-363 PCB Pad Layout
Dimensions in inches [milliPmreetleimrsi]nary
RF
OUT
RF
IN
Notes:
1. Provide a large ground pad area under device
pins 1, 2, 4, & 5 with many plated via holes as
shown.
2. Dimensions given for 50 Ohm RF I/O lines are for
31 mil thick Getek. Scale accordingly for different
board thicknesses and dielectric contants.
3. We recommend 1 or 2 ounce copper. Measure-
ments for this data sheet were made on a 31 mil
thick Getek with 1 ounce copper on both sides.
SOT-363 Nominal Package Dimensions
Dimensions in inches [millimeters]
A link to the SOT-363 package outline drawing with full dimensions and
tolerances may be found on the product web page at www.sirenza.com.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-100634 Rev F
5 Page | ||
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