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PDF SGA-2463Z Data sheet ( Hoja de datos )

Número de pieza SGA-2463Z
Descripción Cascadable SiGe HBT MMIC Amplifier
Fabricantes Sirenza Microdevices 
Logotipo Sirenza Microdevices Logotipo



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SGA-2463
Product Description
SGA-2463ZThe SGA-2463 is a high performance SiGe HBT MMIC Amplifier. A
Pb RoHS Compliant
& Green Package
Darlington configuration featuring 1 micron emitters provides high
FT and excellent thermal perfomance. The heterojunction in-
DC-5000 MHz, Cascadable
creases breakdown voltage and minimizes leakage current be- SiGe HBT MMIC Amplifier
tween junctions. Cancellation of emitter junction non-linearities
results in higher suppression of intermodulation products. Only 2
DC-blocking capacitors, a bias resistor and an optional RF choke
are required for operation.
The matte tin finish on Sirenza’s lead-free package utilizes a post
annealing process to mitigate tin whisker formation and is RoHS Product Features
compliant per EU Directive 2002/95. This package is also manu- • Now available in Lead Free, RoHS
factured with green molding compounds that contain no antimony Compliant, & Green Packaging
trioxide nor halogenated fire retardants.
• High Gain : 17.1 dB at 1950 MHz
Gain & Return Loss vs. Freq. @TL=+25°C
24
GAIN
18
IRL
12
ORL
6
0
-10
-20
-30
• Cascadable 50 Ohm
• Operates From Single Supply
• Low Thermal Resistance Package
Applications
• PA Driver Amplifier
• Cellular, PCS, GSM, UMTS
0 -40
012345
Frequency (GHz)
• IF Amplifier
• Wireless Data, Satellite
Symbol
Parameter
Units Frequency Min. Typ. Max.
G Small Signal Gain
dB
850 MHz
1950 MHz
18.0
20.0
17.1
22.0
P1dB Output Power at 1dB Compression
dBm
850 MHz
1950 MHz
8.0
7.2
OIP3 Output Third Order Intercept Point
dBm
850 MHz
1950 MHz
20.1
18.0
Bandwidth Determined by Return Loss (>10dB)
MHz
5000
IRL Input Return Loss
dB 1950 MHz
11.1
ORL Output Return Loss
dB 1950 MHz
23.1
NF Noise Figure
dB 1950 MHz
3.0
VD Device Voltage
V 2.4 2.7 3.0
ID Device Operating Current
mA
17 20 23
RTH, j-l Thermal Resistance (junction to lead) °C/W
Test Conditions:
VS = 5 V
ID = 20 mA Typ.
RBIAS = 120 Ohms TL = 25ºC
255
OIP3 Tone Spacing = 1 MHz, Pout per tone = -5 dBm
ZS = ZL = 50 Ohms
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
1 EDS-100630 Rev E

1 page




SGA-2463Z pdf
SGA-2463 DC-5000 MHz Cascadable MMIC Amplifier
SOT-363 PCB Pad Layout
Preliminary
Dimensions in inches [millimeters]
RF
OUT
RF
IN
Notes:
1. Provide a large ground pad area under device
pins 1, 2, 4, & 5 with many plated via holes as
shown.
2. Dimensions given for 50 Ohm RF I/O lines are for
31 mil thick Getek. Scale accordingly for different
board thicknesses and dielectric contants.
3. We recommend 1 or 2 ounce copper. Measure-
ments for this data sheet were made on a 31 mil
thick Getek with 1 ounce copper on both sides.
SOT-363 Nominal Package Dimensions
Dimensions in inches [millimeters]
A link to the SOT-363 package outline drawing with full dimensions and
tolerances may be found on the product web page at www.sirenza.com.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-100630 Rev E

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