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PDF SGA-2263Z Data sheet ( Hoja de datos )

Número de pieza SGA-2263Z
Descripción Cascadable SiGe HBT MMIC Amplifier
Fabricantes Sirenza Microdevices 
Logotipo Sirenza Microdevices Logotipo



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SGA-2263
Product Description
The SGA-2263 is a high performance SiGe HBT MMIC Ampli-
fier. A Darlington configuration featuring 1 micron emitters
provides high FT and excellent thermal perfomance. The
heterojunction increases breakdown voltage and minimizes
leakage current between junctions. Cancellation of emitter
junction non-linearities results in higher suppression of
intermodulation products. Only 2 DC-blocking capacitors, a
bias resistor and an optional RF choke are required for op-
eration.
SGA-2263Z Pb RoHS Compliant
& Green Package
DC-5000 MHz, Cascadable
SiGe HBT MMIC Amplifier
The matte tin finish on Sirenza’s lead-free package utilizes a
post annealing process to mitigate tin whisker formation and
is RoHS compliant per EU Directive 2002/95. This package
is also manufactured with green molding compounds that
contain no antimony trioxide nor halogenated fire retardants.
Product Features
• Now available in Lead Free, RoHS
Compliant, & Green Packaging
• High Gain : 13.8 dB at 1950 MHz
• Cascadable 50 Ohm
Gain & Return Loss vs. Freq. @TL=+25°C
24
0
• Operates From Single Supply
• Low Thermal Resistance Package
18
GAIN
12 IRL
6
ORL
0
0123
Frequency (GHz)
4
-10
-20
-30
-40
5
Applications
• PA Driver Amplifier
• Cellular, PCS, GSM, UMTS
• IF Amplifier
• Wireless Data, Satellite
Symbol
Parameter
Units Frequency Min. Typ. Max.
G Small Signal Gain
850 MHz
13.2 14.7 16.2
dB 1950 MHz
13.5
2400 MHz
13.2
P Output Power at 1dB Compression
1dB
dBm
850 MHz
1950 MHz
7.5
6.1
OIP3 Output Third Order Intercept Point
dBm
850 MHz
1950 MHz
20.2
18.0
Bandwidth Determined by Return Loss (>10dB)
MHz
5000
IRL Input Return Loss
dB 1950 MHz
17.6
ORL Output Return Loss
dB 1950 MHz
25.3
NF Noise Figure
dB 1950 MHz
3.5
VD Device Operating Voltage
V
1.9 2.2 2.5
ID Device Operating Current
mA
17 20 23
RTH, j-l Thermal Resistance (junction to lead) °C/W
255
Test Conditions:
VS = 5 V
ID = 20 mA Typ.
RBIAS = 140 Ohms TL = 25ºC
OIP3 Tone Spacing = 1 MHz, Pout per tone = -10 dBm
ZS = ZL = 50 Ohms
The information provided herein is believed to be reliable at press time. Sirenza Microdevices assumes no responsibility for inaccuracies or omissions. Sirenza Microdevices assumes no responsibility for the use of this
information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or
granted to any third party. Sirenza Microdevices does not authorize or warrant any Sirenza Microdevices product for use in life-support devices and/or systems. Copyright 2001 Sirenza Microdevices, Inc.. All worldwide rights
reserved.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
http://www.sirenza.com
1 EDS-100626 Rev E

1 page




SGA-2263Z pdf
SGA-2263 DC-5000 MHz Cascadable MMIC Amplifier
SOT-363 PCB Pad PLraelyimoiuntary
Dimensions in inches [millimeters]
RF
OUT
RF
IN
Notes:
1. Provide a large ground pad area under device
pins 1, 2, 4, & 5 with many plated via holes as
shown.
2. Dimensions given for 50 Ohm RF I/O lines are for
31 mil thick Getek. Scale accordingly for different
board thicknesses and dielectric contants.
3. We recommend 1 or 2 ounce copper. Measure-
ments for this data sheet were made on a 31 mil
thick Getek with 1 ounce copper on both sides.
SOT-363 Nominal Package Dimensions
Dimensions in inches [millimeters]
A link to the SOT-363 package outline drawing with full dimensions and
tolerances may be found on the product web page at www.sirenza.com.
303 Technology Court, Broomfield, CO 80021
Phone: (800) SMI-MMIC
5
http://www.sirenza.com
EDS-100626 Rev E

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