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PDF MC12093 Data sheet ( Hoja de datos )
| Número de pieza | MC12093 | |
| Descripción | Low Power Prescaler | |
| Fabricantes | ON Semiconductor | |
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MC12093
÷2, ÷4, ÷8 1.1 GHz Low
Power Prescaler with
Stand‐By Mode
Description
The MC12093 is a single modulus prescaler for low power
frequency division of a 1.1 GHz high frequency input signal.
MOSAIC V™ technology is utilized to achieve low power dissipation
of 6.75 mW at a minimum supply voltage of 2.7 V.
On-chip output termination provides output current to drive a 2.0 pF
(typical) high impedance load. If additional drive is required for the
prescaler output, an external resistor can be added parallel from the
OUT pin to GND to increase the output power. Care must be taken not
to exceed the maximum allowable current through the output.
Divide ratio control inputs SW1 and SW2 select the required divide
ratio of ÷2, ÷4, or ÷8.
Stand-By mode is featured to reduce current drain to 50 mA typical
when the standby pin SB is switched LOW disabling the prescaler.
Features
• 1.1 GHz Toggle Frequency
• Supply Voltage 2.7 V to 5.5 Vdc
• Low Power 3.0 mA Typical
• Operating Temperature = −40°C to 85°C
• Divide by 2, 4 or 8 Selected by SW1 and SW2 Pins
• On-Chip Termination
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
Table 1. FUNCTIONAL TABLE
SW SW2
Divide Ratio
LL
8
HL
4
LH
4
HH
1. SW1 & SW2: H = (VCC − 0.5 V) to VCC; L = Open.
2. SB: H = 2.0 V to VCC, L = GND to 0.8 V.
2
IN
÷2
÷4
÷8
Figure 1. Function Chart
www.onsemi.com
8
1
SOIC−8 NB
D SUFFIX
CASE 751−07
DFN8
MN SUFFIX
CASE 506AA
MARKING DIAGRAM
8
12093
ALYW
G
1
SOIC−8 NB
14
DFN8
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb-Free Package
PIN CONNECTIONS
IN 1
VCC 2
SW2 3
OUT 4
8 IN
7 SB
6 SW1
5 Gnd
(Top View)
A LOW on the Stand-By Pin 7 disables the device.
ORDERING INFORMATION
Device
MC12093DG
MC12093DR2G
MC12093MNR4G
Package
SOIC−8 NB
(Pb-Free)
SOIC−8 NB
(Pb-Free)
DFN8
(Pb-Free)
Shipping
98 Units/Tube
2500 Tape & Reel
1000 Tape & Reel
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 8
1
Publication Order Number:
MC12093/D
1 page  
MC12093
PACKAGE DIMENSIONS
DFN8 2x2, 0.5 P
MN SUFFIX
CASE 506AA
ISSUE F
DA
B
PIN ONE
REFERENCE
ÇÇÇÇ2X 0.10 C
E
2X 0.10 C TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
(A3)
A1
SIDE VIEW
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
L1
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
DETAIL A
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
OPTIONAL
CONSTRUCTIONS
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
EXPOSED Cu
MOLD CMPD
ÉÉÇÉÉÇ ÉÇÇÉÇÇA A1
A3
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 2.00 BSC
D2 1.10 1.30
E 2.00 BSC
E2 0.70 0.90
DETAIL B
ALTERNATE
CONSTRUCTIONS
e 0.50 BSC
K 0.30 REF
L 0.25 0.35
L1 −−− 0.10
C
SEATING
PLANE
DETAIL A
D2
14
8X L
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.30
8X
0.50
E2
K8
e/2
e
5 8X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
0.90 2.30
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MOSAIC V is a trademark of Motorola, Inc., LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
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PUBLICATION ORDERING INFORMATION
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5
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For additional information, please contact your local
Sales Representative
MC12093/D
5 Page | ||
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| PDF Descargar | [ Datasheet MC12093.PDF ] | |
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