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PDF MC74VHC541 Data sheet ( Hoja de datos )
| Número de pieza | MC74VHC541 | |
| Descripción | Octal Bus Buffer | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC74VHC541
Octal Bus Buffer
The MC74VHC541 is an advanced high speed CMOS octal bus
buffer fabricated with silicon gate CMOS technology. It achieves high
speed operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The MC74VHC541 is a noninverting type. When either OE1 or
OE2 are high, the terminal outputs are in the high impedance state.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output. The
inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V
systems to 3.0 V systems.
Features
• High Speed: tPD = 3.7ns (Typ) at VCC = 5.0 V
• Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
• High Noise Immunity: VNIH = VNIL = 28% VCC
• Power Down Protection Provided on Inputs
• Balanced Propagation Delays
• Designed for 2.0 V to 5.5 V Operating Range
• Low Noise: VOLP = 1.2 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
• ESD Performance: HBM > 2000 V; Machine Model > 200 V
• Chip Complexity: 134 FETs or 33.5 Equivalent Gates
• These Devices are Pb−Free and are RoHS Compliant
DATA
INPUTS
OUTPUT
ENABLES
2
A1
3
A2
4
A3
5
A4
6
A5
7
A6
18
Y1
17
Y2
16
Y3
15
Y4
14
Y5
NONINVERTING
OUTPUTS
13
Y6
8
A7
12
Y7
9
A8
OE1 1
11
Y8
OE2 19
Figure 1. Logic Diagram
http://onsemi.com
20
1
SOIC−20WB
SUFFIX DW
CASE 751D
20
1
TSSOP−20
SUFFIX DT
CASE 948E
PIN ASSIGNMENT
OE1 1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
GND 10
20 VCC
19 OE2
18 Y1
17 Y2
16 Y3
15 Y4
14 Y5
13 Y6
12 Y7
11 Y8
FUNCTION TABLE
Inputs
OE1 OE2 A
Output Y
LLL
L LH
HXX
XHX
L
H
Z
Z
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 8
1
Publication Order Number:
MC74VHC541/D
1 page  
MC74VHC541
PACKAGE DIMENSIONS
0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
C
D
0.100 (0.004)
−T− SEATING
PLANE
TSSOP−20
CASE 948E−02
ISSUE C
20X K REF
0.10 (0.004) M T U S V S
11
B
−U−
10
K
K1
ÍÍÍÍJ J1
ÍÍÍÍÍÍÍÍSECTION N−N
N 0.25 (0.010)
M
AN
−V−
F
DETAIL E
GH
DETAIL E
SOLDERING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
−W−
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
7.06
1
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
http://onsemi.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MC74VHC541.PDF ] | |
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