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PDF TOTX178A Data sheet ( Hoja de datos )
| Número de pieza | TOTX178A | |
| Descripción | FIBER OPTIC TRANSMITTING MODULE | |
| Fabricantes | Toshiba Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de TOTX178A (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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FIBER OPTIC TRANSMITTING MODULE
TOTX178A
FIBER OPTIC TRANSMITTING
MODULE FOR DIGITAL AUDIO
EQUIPMENT
Conforms to JEITA Standard CP−1201
(For Digital Audio Interfaces including
Fiber Optic inter−connections).
TTL interface.
LED is driven by differential circuit.
A Self−tapping hole for easy attachment to
Audio Equipment panels.
TOTX178A
Unit: mm
1. Maximum Ratings (Ta = 25°C)
PARAMETER
SYMBOL
RATING
UNIT
Storage Temperature
Operating Temperature
Supply Voltage
Input Voltage
Soldering Temperature
Tstg
Topr
VCC
VIN
Tsol
−40~70
−20~70
−0.5~7
−0.5~VCC + 0.5
260 (Note 1)
°C
°C
V
V
°C
Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).
1 2001-04-13
1 page  
TOTX178A
(6) Panel attachment
TOTX178A has hole for panel attachment. Please be sure to attach it to panel with self−tapping
screw.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off
using cotton tips.
(8) Protective cap
When the TOTX178A is not in use, attach the protective cap.
(9) Supply voltage
Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure
that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.
(10) Input voltage
If a voltage exceeding the maximum rating value (VCC + 0.5 V) is applied to the transmitters' input,
the internal IC may suffer damage. If there is a possibility that excessive voltage due to surges may
be added to the input terminal, insert a protective circuit.
(11) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(12) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
Compound semiconductors such, as GaAs are used as LED materials in this module. When devices
are disposed of, worker safety and protection of the environment must be taken into account.
(13) Precautions during use
Toshiba is continually working to improve the quality and reliability of their products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity
and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba
products, to observe standards of safety, and to avoid situations in which the malfunction or failure of
a Toshiba product could cause loss of human life, bodily injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
5 2001-04-13
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet TOTX178A.PDF ] | |
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