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PDF PMD4002K Data sheet ( Hoja de datos )
| Número de pieza | PMD4002K | |
| Descripción | MOSFET Driver | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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PMD4002K
MOSFET driver
Rev. 01 — 3 November 2006
Product data sheet
1. Product profile
1.1 General description
NPN switching transistor and high-speed switching diode to protect the base-emitter
junction in reverse direction in a SOT346 (SC-59A/TO-236) small Surface-Mounted
Device (SMD) plastic package.
1.2 Features
I Switching transistor and high-speed switching diode as driver
I High-speed switching diode to protect the base-emitter junction
I Application-optimized pinout
I Internal connections to minimize layout effort
I Space-saving solution
I Reduces component count
1.3 Applications
I Power MOSFET driver
1.4 Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
NPN transistor
VCEO
IC
ICM
Diode
collector-emitter voltage
collector current
peak collector current
open base
single pulse;
tp ≤ 1 ms
- - 40 V
- - 0.6 A
- - 1A
IF forward current
VF forward voltage
- - −0.2 A
IF = −200 mA [1] - - −1.1 V
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
1 page  
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NXP Semiconductors
PMD4002K
MOSFET driver
103
Zth(j-a)
(K/W)
102
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
10 0.02
0.01
006aaa871
0
1
10−5
10−4
10−3
10−2
10−1
1
10 102 103
tp (s)
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103
Zth(j-a)
(K/W)
102
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
10 0.02
0.01
0
006aa872
1
10−5
10−4
10−3
10−2
10−1
1
10 102 103
tp (s)
FR4 PCB, mounting pad for collector 1 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMD4002K_1
Product data sheet
Rev. 01 — 3 November 2006
© NXP B.V. 2006. All rights reserved.
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NXP Semiconductors
11. Soldering
PMD4002K
MOSFET driver
0.70
(3x)
3.15
3.30
1.00
0.70 (3x)
0.60 (3x)
3
12
0.95
1.55 3.40
0.95
solder lands
solder paste
Fig 13. Reflow soldering footprint
5.20 4.60 1.20
1.20
2.60
2.90
solder resist
occupied area
4.70
2.80
3
sot346
Dimensions in mm
solder lands
solder resist
occupied area
Dimensions in mm
12
1.20 (2x)
sot346
3.40
preferred transport direction during soldering
Fig 14. Wave soldering footprint
PMD4002K_1
Product data sheet
Rev. 01 — 3 November 2006
© NXP B.V. 2006. All rights reserved.
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| PDF Descargar | [ Datasheet PMD4002K.PDF ] | |
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