|
|
PDF HSDL-3210 Data sheet ( Hoja de datos )
| Número de pieza | HSDL-3210 | |
| Descripción | Transceiver | |
| Fabricantes | Hewlett-Packard | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de HSDL-3210 (archivo pdf) en la parte inferior de esta página. Total 20 Páginas | ||
|
No Preview Available !
www.DataSheet4U.com
Agilent HSDL-3210
IrDA® Compliant Low Power
1.15 Mbit/s Infrared
Transceiver
Data Sheet
Description
The HSDL-3210 is one of a new
generation of low-cost Infrared (IR)
transceiver modules from Agilent
Technologies. It features one of the
smallest footprint in the industry at
2.5 H x 8.0 W x 3.0 D mm.
Although the supply voltage can
range from 2.7 V to 3.6 V, the LED
is driven by an internal constant
current source of 60 mA at SIR data
rates and 150 mA at MIR data rates.
The HSDL-3210 incorporates the
capability for adjustable optical
power. The optical power can be
adjusted lower when the nominal
desired link distance is very short.
At 5 cm link distance, only 6% of
the full power is required.
The HSDL-3210 supports the
Serial Interface for Transceiver
Control Specification that
provides a common interface
between the transceiver and
controller. It is also designed to
interface to input/output logic
circuits as low as 1.5 V.
Features
• Fully Compliant to IrDA 1.4 low
power specification from 9.6 kbit/s
to 1.15 Mbit/s
• Ultra small surface mount
package
• Minimal height: 2.5 mm
• VCC from 2.7 to 3.6 volts
• Interface to 1.5 volts input/output
logic circuits
• Withstands 100 mVp-p power
supply ripple typically
• Adjustable optical power for link
distance from 5 to 20 cm
• Low shutdown current – 10 nA
typical
• Complete shutdown – TxD, RxD,
PIN diode
• Three optional external
components
• Temperature performance
guaranteed, -25°C to 85°C
• Integrated EMI shield
• IEC60825-1 class 1 eye safe
• Edge detection input – Prevents
the LED from long turn on time
Applications
• Mobile telecom
– Cellular phones
– Pagers
– Smart phones
• Data communication
– PDAs
– Portable printers
• Digital imaging
– Digital cameras
– Photo-imaging printers
1 page  
www.DataSheet4U.com
Caution: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤50°C/W.
Parameter
Symbol
Min.
Storage Temperature
Operating Temperature
LED Supply Voltage
Supply Voltage
Input/Output Voltage
Input Voltage: TXD, SCLK, SD
Output Voltage: RXD
TS
TA
VLED
VCC
IOVCC
VI
VO
-40
-25
0
0
0
0
-0.5
Max.
100
85
6.5
6.5
VCC
VCC+ 0.5
VCC+ 0.5
Units
°C
°C
V
V
V
V
V
Recommended Operating Conditions
Parameter
Operating Temperature
Supply Voltage
Logic Input Voltage
for TXD ,SCLK, SD
Logic High Receiver
Input Irradiance EIH
Logic High
Logic Low
Logic Low Receiver Input
Input/Output Voltage
Receiver Data Rate
Symbol
TA
VCC
VIH
VIL
EIH
Min.
-25
2.7
2/3 IOVCC
0
0.009
Max.
85
3.6
IOVCC
1/3 IOVCC
500
Units
°C
V
V
V
mW/cm2
0.0225 500
mW/cm2
EIL
IOVCC
1.5
0.0024
0.3
VCC
1.152
µW/cm2
V
Mb/s
Conditions
Notes
1.5 V ≤IOVCC ≤3.6 V
1.5 V ≤IOVCC ≤3.6 V
For in-band signals
≤115.2kb/s (SIR)
0.576 Mb/s ≤ in-band
signals ≤ 1.15 Mb/s (MIR)
For in-band signals.
7
7
5
5 Page 
www.DataSheet4U.com
Reflow Profile
230
200
183
170
150
125
100 R1
R2
MAX. 245°C
R3 R4
90 sec.
MAX.
ABOVE
183°C
R5
50
25
0
P1
HEAT
UP
50 100 150 200
t-TIME (SECONDS)
P2
SOLDER PASTE DRY
P3
SOLDER
REFLOW
250
P4
COOL
DOWN
Figure 12. Reflow graph.
300
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
∆T
25˚C to 125˚C
125˚C to 170˚C
170˚C to 230˚C (245˚C at 10 seconds max.)
230˚C to 170˚C
170˚C to 25˚C
Maximum ∆T/∆time
4˚C/s
0.5˚C/s
4˚C/s
–4˚C/s
–3˚C/s
The reflow profile is a straight
line representation of a nominal
temperature profile for a convec-
tive reflow solder process. The
temperature profile is divided
into four process zones, each
with different ∆T/∆time tempera-
ture change rates. The ∆T/∆time
rates are detailed in the above
table. The temperatures are
measured at the component to
printed circuit board connections.
In process zone P1, the PC board
and HSDL-3210 castellation I/O
pins are heated to a temperature
of 125°C to activate the flux in
the solder paste. The temperature
ramp up rate, R1, is limited to
4°C per second to allow for even
heating of both the PC board and
HSDL-3210 castellation I/O pins.
Process zone P2 should be of
sufficient time duration (> 60
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 170°C
(338°F).
Process zone P3 is the solder
reflow zone. In zone P3, the tem-
perature is quickly raised above
the liquidus point of solder to
230°C (446°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 15 and 90 seconds. It
usually takes about 15 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
connections. Beyond a dwell
time of 90 seconds, the inter-
metallic growth within the solder
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 170°C (338°F), to allow
the solder within the connections
to freeze solid.
Process zone P4 is the cool down
after solder freeze. The cool
down rate, R5, from the liquidus
point of the solder to 25°C (77°F)
should not exceed –3°C per sec-
ond maximum. This limitation is
necessary to allow the PC board
and HSDL-3210 castellation I/O
pins to change dimensions
evenly, putting minimal stresses
on the HSDL-3210 transceiver.
11
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet HSDL-3210.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| HSDL-3210 | Transceiver | Hewlett-Packard |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |