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PDF CXG1216UR Data sheet ( Hoja de datos )
| Número de pieza | CXG1216UR | |
| Descripción | High Power DP4T Switch | |
| Fabricantes | Sony Electronics | |
| Logotipo |  |
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High Power DP4T Switch with Logic Control
Preliminary
CXG1216UR
Preliminary
Description
The CXG1216UR can be used in wireless communication systems, for example, dual-band and triple-band
CDMA handsets.
This IC has on-chip logic for operation with 4 COMS control inputs.
The Sony JPHEMT process is used for low insertion loss and on-chip logic circuit.
(Applications: Antenna switch for cellular handsets, dual-band and triple-band CDMA)
Features
Low insertion loss: 0.35dB@900MHz, 0.50dB@2GHz
4 CMOS compatible control line
Package
Small package size: 20-pin UQFN
Structure
GaAs JPHEMT MMIC
Absolute Maximum Ratings
(Ta = 25°C)
Input power max. (RF port)
Bias voltage
Control voltage
Operating temperature
Storage temperature
Pin
VDD
Vctl
Topr
Tstg
34
7
5
–35 to +85
–65 to +150
dBm
V
V
°C
°C
This IC is an ESD sensitive device. Special handling precautions are required.
The actual ESD test data will be available later.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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PE06947-CR
1 page  
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CXG1216UR
Package Outline
(Unit: mm)
20PIN UQFN (PLASTIC)
0.55 ± 0.05
2.7
15
16
11
10
x4
0.1 S A-B C
0.4 ± 0.1
1.3
C
4-R0.3
AB
20
1
6
5
PIN 1 INDEX
0.26
0.18
0.4
0.07
0.25
Thermal Die Pad
0.05 M S A-B C
S
Solder Plating
+ 0.09
0.14 – 0.03
0.05 S
+ 0.09
0.25 – 0.03
S
TERMINAL SECTION
Note:Cutting burr of lead are 0.05mm MAX.
SONY CODE
EIAJ CODE
JEDEC CODE
UQFN-20P-01
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.02g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
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Sony Corporation
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet CXG1216UR.PDF ] | |
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