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PDF MC74VHCT245A Data sheet ( Hoja de datos )

Número de pieza MC74VHCT245A
Descripción Octal Bus Transceiver
Fabricantes Motorola Semiconductors 
Logotipo Motorola Semiconductors Logotipo



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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Octal Bus Transceiver
The MC74VHCT245A is an advanced high speed CMOS octal bus
transceiver fabricated with silicon gate CMOS technology. It achieves high
speed operation similar to equivalent Bipolar Schottky TTL while maintaining
CMOS low power dissipation.
It is intended for two–way asynchronous communication between data
buses. The direction of data transmission is determined by the level of the
DIR input. The output enable pin (OE) can be used to disable the device, so
that the buses are effectively isolated.
All inputs are equipped with protection circuits against static discharge.
The VHCT inputs are compatible with TTL levels. This device can be used
as a level converter for interfacing 3.3V to 5.0V, because it has full 5V CMOS
level output swings.
The VHCT245A input and output (when disabled) structures provide
protection when voltages between 0V and 5.5V are applied, regardless of
the supply voltage. These input and output structures help prevent device
destruction caused by supply voltage – input/output voltage mismatch,
battery backup, hot insertion, etc.
High Speed: tPD = 4.9ns (Typ) at VCC = 5V
Low Power Dissipation: ICC = 4µA (Max) at TA = 25°C
TTL–Compatible Inputs: VIL = 0.8V; VIH = 2.0V
Power Down Protection Provided on Inputs and Outputs
Balanced Propagation Delays
Designed for 4.5V to 5.5V Operating Range
Low Noise: VOLP = 1.6V (Max)
Pin and Function Compatible with Other Standard Logic Families
Latchup Performance Exceeds 300mA
ESD Performance: HBM > 2000V; Machine Model > 200V
Chip Complexity: 304 FETs or 76 Equivalent Gates
APPLICATION NOTES
1. Do not force a signal on an I/O pin when it is an active output, damage may
occur.
2. All floating (high impedence) input or I/O pins must be fixed by means of
pull up or pull down resistors or bus terminator ICs.
A
DATA
PORT
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
DIR 1
OE 19
LOGIC DIAGRAM
18 B1
17 B2
16 B3
15 B4
14 B5
13 B6
12 B7
11 B8
B
DATA
PORT
MC74VHCT245A
DW SUFFIX
20–LEAD SOIC PACKAGE
CASE 751D–04
DT SUFFIX
20–LEAD TSSOP PACKAGE
CASE 948E–02
M SUFFIX
20–LEAD SOIC EIAJ PACKAGE
CASE 967–01
ORDERING INFORMATION
MC74VHCTXXXADW SOIC
MC74VHCTXXXADT TSSOP
MC74VHCTXXXAM
SOIC EIAJ
PIN ASSIGNMENT
DIR 1
A1 2
A2 3
A3 4
A4 5
A5 6
A6 7
A7 8
A8 9
GND 10
20 VCC
19 OE
18 B1
17 B2
16 B3
15 B4
14 B5
13 B6
12 B7
11 B8
FUNCTION TABLE
Control Inputs
OE DIR
Operation
L L Data Tx from Bus B to Bus A
L H Data Tx from Bus A to Bus B
H X Buses Isolated (High–Z State)
6/97
© Motorola, Inc. 1997
1
REV 0

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MC74VHCT245A pdf
MC74VHCT245A
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
–A–
20 11
–B– 10X P
0.010 (0.25) M B M
1 10
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
20X D
0.010 (0.25) M T A S B S
J
F
18X G
C
–T–
SEATING
PLANE
K
M
R X 45_
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 12.65 12.95 0.499 0.510
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC
0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
C
D
0.100 (0.004)
–T– SEATING
PLANE
20X K REF
0.10 (0.004) M T U S V S
11
B
–U–
10
A
–V–
GH
K
J J1ÍÍÍÍÍÍKÍÍÍ1 ÍÍÍ
SECTION N–N
N 0.25 (0.010)
M
N
F
DETAIL E
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
–W–
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
B 4.30 4.50 0.169 0.177
C ––– 1.20 ––– 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
5
MOTOROLA

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