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PDF ADN2820 Data sheet ( Hoja de datos )
| Número de pieza | ADN2820 | |
| Descripción | 10.7 Gbps / 3.3V / Low Noise / TIA with Average Power Moniter | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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FEATURES
Technology: high performance SiGe
Bandwidth: 9 GHz
Input noise current density: 1.0 µA
Optical sensitivity: –19.3 dBm
Differential transimpedance: 5000 V/A
Power dissipation: 200 mW
Input current overload: 2.8 mA p-p
Linear input range: 0.15 mA p-p
Output resistance: 50 Ω/side
Output offset adjustment range: 240 mV
Average input power monitor: 1 V/mA
Die size: 0.87 mm × 1.06 mm
APPLICATIONS
10.7 Gbps optical modules
SONET/SDH OC-192/STM-64 and 10 GbE
receivers, transceivers, and transponders
10.7 Gbps, 3.3 V, Low Noise,
TIA with Average Power Monitor
ADN2820
PRODUCT DESCRIPTION
The ADN2820 is a compact, high performance, 3.3 V power
supply SiGe transimpedance amplifier (TIA) optimized for
10 Gbps Metro-Access and Ethernet systems. It is a single chip
solution for detecting photodiode current with a differential
output voltage. The ADN2820 features low input referred noise
current and high output transimpedance gain, capable of
driving a typical CDR or transceiver directly. A POWMON
output is provided for input average power monitoring and
alarm generation. Low nominal output offset enables dc output
coupling to 3.3 V circuits. The OFFSET control input enables
output slice level adjustment for asymmetric input signals. The
ADN2820 operates with a 3.3 V power supply and is available in
die form.
FUNCTIONAL BLOCK DIAGRAM
3.3V
VCC (1,2,3)
RF
RF = 500Ω
50Ω
50Ω
hυ
IN (13)'
CB
CF
0.85V
AV = 20dB
20mA
OUT (5)
OUTB (6)
OFFSET (14)
POWMON (8)
GND (10, 11)
GND (4,7)
CLF (9)
CLF
Figure 1. Functional Block Diagram/Typical Operating Circuit
03194-0-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703 © 2003 Analog Devices, Inc. All rights reserved.
1 page  
PAD LAYOUT AND FUNCTIONAL DESCRIPTIONS
PAD LAYOUT
1
VCC
14 OFFSET
2
VCC
3
VCC
GND
4
13 IN
12 TEST
OUT 5
0,0'
OUTB 6
11 GND
GND
10
CLF
9
GND 7
POWMON
8
03194-0-002
Figure 2. ADN2820 Pad Layout
DIE INFORMATION
Die Size
0.875 mm × 1.060 mm
Die Thickness
12 mils = 0.3 mm
Passivation Openings
0.08 mm × 0.08 mm
0.12 mm × 0.08 mm
0.08 mm × 0.12 mm
Passivation Composition
5000 Å Si3N4 (Top)
+5000 Å SiO2 (Bottom)
Pad Composition
Al/1% Cu
Backside Contact
P-Type Handle (Oxide Isolated from Active Circuitry)
ADN2820
PAD DESCRIPTIONS
Table 3. Pad Descriptions
Pin No.
Pad
Function
1–3 VCC Positive Supply. Bypass to GND with a 100 pF or greater single-layer capacitor.
4, 7, 10, 11 GND
Ground.
5 OUT Positive Output. Drives 50 Ω termination (ac or dc termination).
6
OUTB
Negative Output. Drives 50 Ω termination (ac or dc termination).
8 POWMON Input Average Power Monitor. Analog signal proportional to average optical input power. Leave open if
unused.
9 CLF Low Frequency Cutoff Setpoint. Connect with a 0.1 μF capacitor to GND for 20 kHz.
12 TEST Test Pad. Leave Floating.
13 IN Current Input. Bond directly to reverse biased PIN or APD anode. Filter PIN or APD anode with 100 pF × 100 Ω
or greater.
14
OFFSET
Output Offset Adjust Input. Leave open if not being used and the input slice threshold will automatically be set
to the eye center.
PAD COORDINATES
Table 4. Pad Coordinates
Pin
No. PAD
X (mm)
1 VCC
–0.20
2 VCC
0.00
3 VCC
0.20
4 GND
0.35
5 OUT
0.35
6 OUTB
0.35
7 GND
0.35
Y (mm)
0.45
0.45
0.45
0.30
0.10
–0.10
–0.30
Pin
No. PAD
8 POWMON
9 CLF
10 GND
11 GND
12 TEST
13 IN
14 OFFSET
X (mm)
0.20
0.00
–0.20
–0.35
–0.35
–0.35
–0.35
Y (mm)
–0.45
–0.45
–0.45
–0.30
–0.10
0.10
0.30
Rev. 0 | Page 5 of 12
5 Page 
BUTTERFLY PACKAGE ASSEMBLY
OFFSET VCC
ADN2820
Rf
Cb
Cf
PD
Clf
7.5mm
OUT
OUTB
5mm
2.5mm
0mm
POWMON
Figure 19. Butterfly Package
Table 8. Bill of Materials
Qty. Description
PD 1
VENDOR SPECIFIC (0.5 mm × 0.5 mm)
TIA 1
ADN2820 (0.87 mm × 1.06 mm)
CB 2
GM250X7R10216 (0.5 mm × 0.5 mm)
CLF 1
GM260Y5V104Z10 (0.8 mm × 0.8 mm)
CF 1
D20BV201J5PX (0.5 mm × 0.5 mm)
RF 1
WMIF0021000AJ (0.4 mm × 0.5 mm)
Source
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Vishay 100 Ω Thin Film Microwave Resistor
Rev. 0 | Page 11 of 12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ADN2820.PDF ] | |
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