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PDF AM79489 Data sheet ( Hoja de datos )
| Número de pieza | AM79489 | |
| Descripción | Subscriber Line Interface Circuit | |
| Fabricantes | Legerity | |
| Logotipo |  |
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Am79489
Subscriber Line Interface Circuit
DISTINCTIVE CHARACTERISTICS
Ideal for low power sensitive applications
Low standby power (normal and reverse)
Automatic on-chip battery switching
On-chip thermal management
On-chip thermal shutdown
–20 V to –60 V battery operation
Programmable current limit
Programmable resistive feed
Programmable loop-detect threshold
Selectable overhead for metering applications
Two-wire impedance set by single external
impedance
On-chip ring and test relay drivers and relay
snubber circuits
Polarity reversal (full transmission)
Loop and ground-key detector
Comparator for ring-trip detection
Ground-start capability
On-hook transmission
BLOCK DIAGRAM
TMG
DA
DB
A(TIP)
HPA
HPB
Two-Wire
Interface
Ring-Trip
Comparator
Ground-Key
Detector
Loop Detector
B(RING)
VBAT2
VBAT1
BGND
Switch Control
Signal
Transmission
Power-Feed
Controller
Test Relay
Driver
Ring Relay
Driver
Input
Decoder
and
Control
TESTOUT
RINGOUT
C1
C2
C3
C4
E1
DET
RD
VTX
RSN
RDC
CAS
OVH
RFA
BSWOUT BSWEN BSWTH
VCC
AGND/DGND
Publication# 080201 Rev: E Amendment: /0
Issue Date: October 1999
1 page  
ABSOLUTE MAXIMUM RATINGS
Storage temperature . . . . . . . . . . . . –55°C to +150°C
With respect to AGND/DGND:
VCC. . . . . . . . . . . . . . . . . . . . . . . . . . .–0.4 V to +7.0 V
VBAT1
Continuous . . . . . . . . . . . . . . . . . . +0.4 V to –70 V
10 ms . . . . . . . . . . . . . . . . . . . . . . +0.4 V to –75 V
VBAT2 and BSWTH . . . . . . . . . . . . . . . +0.4 V to VBAT1
BGND. . . . . . . . . . . . . . . . . . . . . . . . . . . .+3 V to –3 V
A(TIP) or B(RING) with respect to BGND:
Continuous . . . . . . . . . . . . . . . . . . . . VBAT1 to +1 V
10 ms (f = 0.1 Hz) . . . . . . . . . . . . . . . –70 V to +5 V
1 µs (f = 0.1 Hz) . . . . . . . . . . . . . . . . –80 V to +8 V
250 ns (f = 0.1 Hz) . . . . . . . . . . . . . –90 V to +12 V
Current from A(TIP) or B(RING). . . . . . . . . . ±150 mA
TESTOUT/RINGOUT/current. . . . . . . . . . . . . . 80 mA
TESTOUT/RINGOUT/voltage . . . . . . . BGND to +7 V
TESTOUT/RINGOUT/transient . . . . . BGND to +10 V
DA and DB inputs
Voltage on ring-trip inputs . . . . . . . . . . VBAT1 to 0 V
Current on ring-trip inputs . . . . . . . . . . . . . ±10 mA
C4–C1, BSWEN, OVH, E1
Input voltage . . . . . . . . . . . . –0.4 V to VCC + 0.4 V
Maximum power dissipation, continuous
TA = 70°C, No heat sink (see note):
In 32-pin PLCC package. . . . . . . . . . . . . . . . 1.7 W
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .θJA
In 32-pin PLCC package. . . . . . . . . . . .43°C/W typ
ESD immunity/pin (HBM) . . . . . . . . . . . . . . . . . 1500 V
Note: Thermal limiting circuitry on chip will shut down the
circuit at a junction temperature of about 165°C. The device
should never be exposed to this temperature. Operation
above 145°C junction temperature may degrade device
reliability. See the SLIC Packaging Considerations section for
more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to Absolute Maximum
Ratings for extended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient temperature. . . . . . . . . . . . . –40°C to +85°C*
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . 4.75 V to 5.25 V
BAT1 . . . . . . . . . . . . . . . . . . . . . . . . . –40.5 V to –60 V
BAT2 . . . . . . . . . . . . . . . . . . . . . . . . . . .–20 V to BAT1
AGND/DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V
BGND with respect to GND . . . –100 mV to +100 mV
Load resistance on VTX to GND. . . . . . . . . 20 kΩ min
Operating ranges define those limits over which the
functionality of the device is guaranteed by production
testing.
* Functionality of the device from 0°C to +70°C is guaranteed
by production testing. Performance from –40°C to +85°C is
guaranteed by characterization and periodic sampling of
production units.
SLIC Products
5
5 Page 
Table 2. User-Programmable Components (continued)
CBSWEN = 5 µmhos • TD(ms)
RFEED
=
2
•
RFU
SE
+
æ
è
-R----D---C---G-1---D-+----C-R----D----C---2-øö
CBSWEN is connected from BSWEN to GND for automatic
switching. TD is the delay in switching from BAT1 to BAT2.
The delay from BAT2 to BAT1 is about 0.1 TD.
The DC feed resistance can be adjusted with a resistance
(RFA) from the RFA pin to ground.
GDC = 47.9èæ1--4--2-0--0---k-k--Ω--Ω----+--+---R--R--F--F--A--A--øö
Thermal Management Equations (Active, Normal, and Reverse Polarity States)
RTMG
≥
--V-----B---A----T---2-----–-----6----V---
ILOOPmax
(OVH = 1)
RTMG is connected from TMG to VBAT2 and is used to limit
power dissipation within the SLIC in Active states only.
RTMG
≥
--V-----B---A----T---2-----–-----7---.-5-----V---
ILOOPmax
(OVH = 0)
PRTMG
=
(----V-----B---A----T---2------–----6-----V------–----(--I---L----•----R-----L---)--)---2--(---R----T---M-----G----)
(RTMG + 40)2
(OVH = 1)
Power dissipated in the thermal management resistor, RTMG,
during the Active states.
PRTMG
=
(----V-----B---A----T---2------–----7---.--5-----V-----–-----(--I---L----•----R----L----)--)--2---(---R----T---M----G-----)
(RTMG + 40)2
(OVH = 0)
PSLIC = ( VBAT2 • IL ) – PRTMG – RL • (IL)2 + 0.22 W
Power dissipated in the SLIC while in the Active states.
SLIC Products
11
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet AM79489.PDF ] | |
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