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PDF MC74HC7266A Data sheet ( Hoja de datos )
| Número de pieza | MC74HC7266A | |
| Descripción | Quad 2-Input Exclusive NOR Gate | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input Exclusive
NOR Gate
High–Performance Silicon–Gate CMOS
The MC74HC7266A is identical in pinout to the LS266 and the HC266.
The HC7266 has standard CMOS outputs instead of open–drain outputs.
The device inputs are compatible with standard CMOS outputs; with
pullup resistors, they are compatible with LSTTL outputs.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 56 FETs or 14 Equivalent Gates
A1 1
B1 2
A2 5
B2 6
A3 8
B3 9
A4 12
B4 13
LOGIC DIAGRAM
3 Y1
4 Y2
10 Y3
Y = A B
Y = AB + A B
11 Y4
PIN 14 = VCC
PIN 7 = GND
MC74HC7266A
14
1
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
DT SUFFIX
TSSOP PACKAGE
CASE 948G–01
ORDERING INFORMATION
MC74HCXXXXAN
MC74HCXXXXAD
MC74HCXXXXADT
Plastic
SOIC
TSSOP
PIN ASSIGNMENT
A1 1
B1 2
Y1 3
Y2 4
A2 5
B2 6
GND 7
14 VCC
13 B4
12 A4
11 Y4
10 Y3
9 B3
8 A3
FUNCTION TABLE
Inputs
AB
Output
Y
L LH
LHL
HL
L
HHH
3/97
© Motorola, Inc. 1997
3–1
REV 1
1 page  
14
1
A
F
HG
8
B
7
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
C
N
SEATING
PLANE
D
K
L
J
M
MC74HC7266A
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53
F 0.040 0.070 1.02 1.78
G 0.100 BSC
2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC
7.62 BSC
M 0_ 10_ 0_ 10_
N 0.015 0.039 0.39 1.01
–A–
14
1
G
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
8
–B–
7
P 7 PL
0.25 (0.010) M B M
C R X 45°
F
SEATING
PLANE
D 14 PL
K
0.25 (0.010) M T B S
AS
M
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC
0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0° 7°
0° 7°
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
High–Speed CMOS Logic Data
DL129 — Rev 6
3–5
MOTOROLA
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MC74HC7266A.PDF ] | |
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