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PDF NLAS4684 Data sheet ( Hoja de datos )
| Número de pieza | NLAS4684 | |
| Descripción | Ultra-Low Resistance Dual SPDT Analog Switch | |
| Fabricantes | ON | |
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NLAS4684
Ultra-Low Resistance
Dual SPDT Analog Switch
The NLAS4684 is an advanced CMOS analog switch fabricated in
Sub−micron silicon gate CMOS technology. The device is a dual
Independent Single Pole Double Throw (SPDT) switch featuring
Ultra−Low RON of 0.5 W, for the Normally Closed (NC) switch, and
0.8 W for the Normally Opened switch (NO) at 2.7 V.
The part also features guaranteed Break Before Make switching,
assuring the switches never short the driver.
The NLAS4684 is available in a 2.0 x 1.5 mm bumped die array.
The pitch of the solder bumps is 0.5 mm for easy handling.
Features
• Ultra−Low RON, t0.5 W at 2.7 V
• Threshold Adjusted to Function with 1.8 V Control at
VCC = 2.7−3.3 V
• Single Supply Operation from 1.8−5.5 V
• Tiny 2 x 1.5 mm Bumped Die
• Low Crosstalk, t 83 dB at 100 kHz
• Full 0−VCC Signal Handling Capability
• High Isolation, −65 dB at 100 kHz
• Low Standby Current, t50 nA
• Low Distortion, t0.14% THD
• RON Flatness of 0.15 W
• Pin for Pin Replacement for MAX4684
• High Continuous Current Capability
$300 mA Through Each Switch
• Large Current Clamping Diodes at Analog Inputs
$300 mA Continuous Current Capability
• Pb−Free Packages are Available
Applications
• Cell Phone
• Speaker Switching
• Power Switching
• Modems
• Automotive
http://onsemi.com
MARKING
DIAGRAMS
A1
Microbump−10
CASE 489AA
4684
AYWWG
A1 G
1
DFN10
CASE 485C
1 NLAS
4684
ALYWG
G
Micro10
CASE 846B
4684
AYWG
1G
A = Assembly Location
L = Wafer Lot
Y = Year
WW, W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
IN 1, 2
0
1
FUNCTION TABLE
NO 1, 2
OFF
ON
NC 1, 2
ON
OFF
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 11 of this data sheet.
© Semiconductor Components Industries, LLC, 2008
September, 2008 − Rev. 20
1
Publication Order Number:
NLAS4684/D
1 page  
NLAS4684
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) (Typical characteristics are at 25°C)
Guaranteed Maximum Limit
Symbol
Parameter
Test Conditions
VCC VIS
*555C to 255C
t855C
t1255C
(V) (V) Min Typ Max Min Max Min Max
tON Turn−On Time
RL = 50 W, CL = 35 pF
(Figures 4 and 5)
2.5 1.3
3.0 1.5
5.0 2.8
60 70 70
50 60 60
30 35 35
tOFF
Turn−Off Time
R(FLig=ur5e0sW4,aCnLd=53) 5 pF
2.5 1.3
3.0 1.5
5.0 2.8
50 55 55
40 50 50
30 35 35
tBBM
Minimum Break−Before−Make
Time (Note 6)
VIS = 3.0
RL = 300 W, CL = 35 pF
(Figure 3)
3.0
1.5
2
15
Unit
ns
ns
ns
CNC Off
CNO Off
CNC On
CNO On
NC Off Capacitance, f = 1 MHz
NO Off Capacitance, f = 1 MHz
NC On Capacitance, f = 1 MHz
NO On Capacitance, f = 1 MHz
Typical @ 25, VCC = 5.0 V
102
104
322
330
pF
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
Parameter
Condition
BW Maximum On−Channel −3dB
VIN = 0 dBm
Bandwidth or Minimum Frequency
Response
VIN centered between VCC and GND
(Figure 6)
NC
NO
VONL
Maximum Feed−through On Loss
VIN = 0 dBm @ 100 kHz to 50 MHz
VIN centered between VCC and GND (Figure 6)
VISO
Off−Channel Isolation (Note 7)
f = 100 kHz; VIS = 1 V RMS; CL = 5 nF
VIN centered between VCC and GND(Figure 6)
Q
Charge Injection Select Input to
Common I/O (Figures 10 and 11)
VIN = VCC to GND, RIS = 0 W, CL = 1 nF
Q = CL − DVOUT (Figure 7)
THD
Total Harmonic Distortion THD +
Noise (Figure 9)
FIS = 20 Hz to 100 kHz, RL = Rgen = 600 W, CL = 50 pF
VIS = 1 V RMS
VCT
Channel−to−Channel Crosstalk
f = 100 kHz; VIS = 1 V RMS, CL = 5 pF, RL = 50 W
VIN centered between VCC and GND (Figure 6)
6. −55°C specifications are guaranteed by design.
7. Off−Channel Isolation = 20log10 (Vcom/Vno) (See Figure 6).
VCC
V
3.0
3.0
3.0
3.0
3.0
3.0
3.0
Typical
255C
6.5
9.5
Unit
MHz
−0.05
−65
15
dB
dB
pC
0.14 %
−83 dB
http://onsemi.com
5
5 Page 
NLAS4684
ORDERING INFORMATION
Device
Package
Shipping†
NLAS4684FCT1
Microbump−10
3000 / Tape & Reel
NLAS4684FCT1G
Microbump−10
(Pb−Free)
3000 / Tape & Reel
NLAS4684FCTCG
Microbump−10
(Pb−Free)
3000 / Tape & Reel
NLAS4684MNR2
DFN10
3000 / Tape & Reel
NLAS4684MNR2G
DFN10
(Pb−Free)
3000 / Tape & Reel
NLAS4684MR2
Micro10
4000 / Tape & Reel
NLAS4684MR2G
Micro10
(Pb−Free)
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet NLAS4684.PDF ] | |
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