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PDF MAX1702B Data sheet ( Hoja de datos )
| Número de pieza | MAX1702B | |
| Descripción | Triple-Output Power-Management IC for Microprocessor-Based Systems | |
| Fabricantes | Maxim Integrated | |
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19-2448; Rev 0; 4/02
Triple-Output Power-Management IC for
Microprocessor-Based Systems
General Description
The MAX1702B power-management IC supports ARM
Powered® devices such as the Intel® PXA210 and
PXA250 microprocessors based on the Intel XScale™
micro-architecture. These devices include PDAs, third-
generation smart cellular phones, internet appliances,
automotive in-dash Telematics systems, and other appli-
cations requiring substantial computing and multimedia
capability at low power.
The MAX1702B integrates three ultra-high-performance
power supplies with associated supervisory and man-
agement functions. Included is a step-down DC-DC con-
verter to supply 3.3V I/O and peripherals, a step-down
DC-DC converter to supply 0.7V to VIN for the micro-
processor core, and a step-down DC-DC converter to
supply either 1.8V, 2.5V, or 3.3V to power the memory.
Management functions include automatic power-up
sequencing, power-on-reset and manual reset with timer,
and two levels of low-battery detection.
The DC-DC converters use fast 1MHz PWM switching,
allowing the use of small external components. They
automatically switch from PWM mode under heavy loads
to skip mode under light loads to reduce quiescent cur-
rent and maximize battery life. The input voltage range is
from 2.6V to 5.5V, allowing the use of three NiMH cells, a
single Li+ cell, or a regulated 5V input. The MAX1702B is
available in a tiny 6mm x 6mm, 36-pin QFN package and
operates over the -40°C to +85°C temperature range.
Features
o Three Regulators in One Package
Peripherals and I/O Supply: 3.3V at 900mA
µP Core Supply: 0.7V to VIN at 400mA
Memory Supply: 1.8/2.5/3.3V at 800mA
o Supports Intel PXA210 and PXA250
Microprocessors
o Power-On Reset with Manual Reset Input
o Auto Power-Up Sequencing
o 1MHz PWM Switching Allows Small External
Components
o Low 5µA Shutdown Current
o Tiny 6mm ✕ 6mm, 36-Pin QFN Package
PART
MAX1702BEGX
Ordering Information
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
36 6mm x 6mm QFN
Applications
PDA, Palmtop, and Wireless Handhelds
Third Generation Smart Cell Phones
Internet Appliances and Web Books
Automotive In-Dash Telematics Systems
Typical Operating Circuit appears at end of data sheet.
Intel is a registered trademark of Intel Corporation.
XScale is a trademark of Intel Corporation.
ARM and ARM Powered are registered trademarks of ARM
Limited.
TOP VIEW
Pin Configuration
36 35 34 33 32 31 30 29 28
N.C. 1
LBI 2
DBI 3
27 N.C.
26 N.C.
25 INP2
ON2 4
PGM3 5
GND 6
MAX1702B
24 LX2
23 PG2
22 OUTOK
REF 7
21 COMP2
GND 8
20 OUT1
N.C. 9
19 N.C.
10 11 12 13 14 15 16 17 18
6mm x 6mm QFN
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1 page  
Triple-Output Power-Management IC for
Microprocessor-Based Systems
ELECTRICAL CHARACTERISTICS (continued)
(VINP1 = VINP2 = VINP3 = VIN = 3.6V, VLBI = 1.1V, VDBI = 1.35V, MR = ON2 = IN, PGM3 = GND, circuit of Figure 1, TA = -40°C to
+85°C unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
CONDITIONS
MIN TYP MAX UNITS
RSO, LBO, OUTOK
Output Low Level
RSO, LBO, OUTOK
Output High Leakage Current
2.6V ≤ VIN_ ≤ 5.5V, sinking 1mA
VIN_= 1V, sinking 100µA
VRSO = VLBO = VOUTOK = 5.5V
0.4 V
0.1 µA
ON2, MR, Input High Level
ON2, MR, Input Low Level
ON2, MR, PGM3, Input Leakage
Current
2.6V ≤ VIN_ ≤ 5.5V
2.6V ≤ VIN_ ≤ 5.5V
VON2 = V MR = VPGM3 = GND, 5.5V
1.6 V
0.4 V
-1 +1 µA
REG3 target = 1.8V, IN = 2.6V to 5.5V
0.4
PGM3 Selection Threshold
REG3 target = 2.5V, IN = 2.6V to 5.5V
1.1 REF 1.4
V
REG3 target = 3.3V, IN = 2.6V to 5.5V
VIN_ - 0.25
Note 1: Dropout voltage is not tested. Guaranteed by P-channel switch resistance and assumes a 72mΩ (REG1 and
REG3) or 162mΩ (REG2) maximum ESR of inductor.
Note 2: The maximum output current is guaranteed by the following equation:
IOUT(MAX) =
ILIM
−
VOUT(1 − D)
2× ƒ ×L
1
+
(RN
+
RL
)
(1 −
2׃
D)
×L
where:
D = VOUT + IOUT(MAX)(RN + RL)
VIN + IOUT(MAX)(RN + RP )
and:
RN = N-channel synchronous rectifier RDSON
RP = P-channel power switch RDSON
RL = external inductor ESR
IOUT(MAX) = maximum required load current
ƒ = operating frequency minimum
L = external inductor value
Note 3: Specified resistance is in series with an internal diode to LX2.
Note 4: Specifications to -40°C are guaranteed by design and not production tested.
_______________________________________________________________________________________ 5
5 Page 
Triple-Output Power-Management IC for
Microprocessor-Based Systems
PIN
1, 9, 13, 18,
19, 26, 27,
31, 35
2
3
4
5
6
7
8
10
11
12
14
15
16
17
NAME
FUNCTION
Pin Description
N.C.
No Connection. These pins are not internally connected.
LBI
DBI
ON2
PGM3
GND
REF
GND
IN
RSO
PG1
LX1
INP1
MR
COMP1
Low-Battery Input. Connect a resistive voltage-divider from the battery voltage to LBI to set the low-
battery threshold. LBI threshold voltage is 1.235V.
Dead-Battery Input. Connect a resistive voltage-divider from the battery voltage to DBI to set the
dead-battery voltage threshold. When the voltage at DBI is below the 1.25V threshold, the MAX1702B
is turned off and draws only 5µA from the battery.
REG2 On/Off Input. Drive ON2 high to turn on REG2, drive it low to turn it off. When enabled, the
MAX1702B soft-starts REG2, when disabled, the output of REG2 is internally discharged to PG2.
REG3 Regulation Voltage-Control Input. Connect PGM3 to IN, REF, or GND to set the REG3 output
regulation voltage. Connect PGM3 to GND for 1.8V, REF for 2.5V, and IN for 3.3V.
Connect Pin 6 to Pin 8
Reference Output. Output of the 1.25V reference. Bypass REF to GND with a 0.1µF or greater
capacitor.
Analog Ground. Connect GND to a local analog ground plane with no high-current paths. GND
should be connected to the main ground plane at a single point as close to the IC and the IN bypass
capacitor as possible. Connect the ground of the low-noise components, such as resistive voltage-
dividers and reference bypass capacitor to the analog ground plane.
Analog Supply Input. Bypass IN to GND with a 1µF or greater low-ESR capacitor.
Reset Output. RSO is low (sinks current to GND) during initial startup or while the manual reset input,
MR, is asserted. RSO remains low for 65.5ms after all regulators are in regulation or after MR is
deasserted. RSO is an open-drain output. RSO remains high when REG2 is turned off. The RSO line
maintains a valid low output for IN as low as 1V.
REG1 Power Ground. Connect PG1 directly to a power ground plane. Connect PG1, PG2, PG3 and
GND together at a single point as close to the IC as possible.
REG1 Power-Switching Node. Connect the external inductor of the REG1 output LC filter from LX1 to
OUT1 (see the Inductor Selection section).
REG1 Power Input. Bypass INP1 to PG1 with a 1.0µF or greater low-ESR capacitor. INP1, INP2, INP3,
and IN must be connected together externally. A single 4.7µF capacitor can be used for INP1, INP2,
and INP3.
Manual Reset Input. A momentary low on MR forces RSO to go low. RSO remains low as long as MR
is low, and returns high 65.5ms after MR returns high and all output voltages are in regulation.
REG1 Compensation Node. Connect a series resistor and capacitor from COMP1 to GND in parallel
with a 33pF capacitor to compensate REG1 (see the Compensation and Stability section).
______________________________________________________________________________________ 11
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet MAX1702B.PDF ] | |
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