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PDF MC10EP101 Data sheet ( Hoja de datos )
| Número de pieza | MC10EP101 | |
| Descripción | Quad 4-Input OR/NOR | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC10EP101
Quad 4-Input OR/NOR
The MC10EP101 is a Quad 4–input OR/NOR gate. The device is
functionally equivalent to the E101. With AC performance faster than
the E101 device, the EP101 is ideal for applications requiring the
fastest AC performance available. All VCC and VEE pins must be
externally connected to power supply to guarantee proper operation.
• 250ps Typical Propagation Delay
• High Bandwidth to 3 Ghz Typical
• PECL mode: 3.0V to 5.5V VCC with VEE = 0V
• ECL mode: 0V VCC with VEE = –3.0V to –5.5V
• 75kΩ Internal Input Pulldown Resistors
• ESD Protection: >4KV HBM, >100V MM
• Moisture Sensitivity Level 2
For Additional Information, See Application Note AND8003/D
• Flammability Rating: UL–94 code V–0 @ 1/8”,
Oxygen Index 28 to 34
• Transistor Count = 173 devices
LOGIC DIAGRAM
D0a
D0b Q0
D0c Q0
D0d
D1a
D1b Q1
D1c Q1
D1d
D2a
D2b Q2
D2c Q2
D2d
D3a
D3b Q3
D3c Q3
D3d
http://onsemi.com
32–LEAD TQFP
FA SUFFIX
CASE 873A
MARKING DIAGRAM*
MC10
EP101
AWLYYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
32
1
*For additional information, see Application Note
AND8002/D
PIN DESCRIPTION
PIN FUNCTION
D0a–D3d
ECL Data Inputs
Q0–Q3, Q0–Q3
ECL Data Outputs
VCC
Positive Supply
VBB
Reference Voltage Output
VEE
Negative, 0 Supply
TRUTH TABLE
Dna Dnb Dnc Dnd Qn Qn
L LLL LH
H XXX HL
X HXX HL
X XHX HL
X XXH HL
H HHH HL
© Semiconductor Components Industries, LLC, 1999
March, 2000 – Rev. 1
ORDERING INFORMATION
Device
Package
Shipping
MC10EP101FA
TQFP 250 Units/Tray
MC10EP101FAR2 TQFP 2000 Tape & Reel
1 Publication Order Number:
MC10EP101/D
1 page  
MC10EP101
PACKAGE DIMENSIONS
TQFP
FA SUFFIX
32–LEAD PLASTIC PACKAGE
CASE 873A–02
ISSUE A
A1
32
A
4X
0.20 (0.008) AB T–U Z
25
1
–T–
B
B1
8
9
DETAIL Y
–U–
V
17 V1
9
–Z– 4X
S1 0.20 (0.008) AC T–U Z
S
–AB–
SEATING
PLANE
–AC–
G
0.10 (0.004) AC
8X M_
CE
R
DETAIL AD
BASE
METAL
FÉÉÉÉJNÉÉÉÉ D
SECTION AE–AE
W
H
K
X
Q_
DETAIL AD
AE
P
DETAIL Y
AE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE
DETERMINED AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL
BE 0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.300 0.450
E 1.350 1.450
F 0.300 0.400
G 0.800 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M 12_ REF
N 0.090 0.160
P 0.400 BSC
Q 1_ 5_
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
X 1.000 REF
INCHES
MIN MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055 0.063
0.012 0.018
0.053 0.057
0.012 0.016
0.031 BSC
0.002 0.006
0.004 0.008
0.020 0.028
12_ REF
0.004 0.006
0.016 BSC
1_ 5 _
0.006 0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MC10EP101.PDF ] | |
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