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PDF MC10216 Data sheet ( Hoja de datos )
| Número de pieza | MC10216 | |
| Descripción | High Speed Triple Line Receiver | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MC10216
High Speed Triple Line
Receiver
The MC10216 is a high speed triple differential amplifier designed
for use in sensing differential signals over long lines. The base bias
supply (VBB) is made available at pin 11 to make the device useful as a
Schmitt trigger, or in other applications where a stable reference
voltage is necessary.
Active current sources provide the MC10216 with excellent
common mode noise rejection. If any amplifier in a package is not
used, one input of that amplifier must be connected to VBB (pin 11) to
prevent upsetting the current source bias network.
Complementary outputs are provided to allow driving twisted pair
lines, to enable cascading of several amplifiers in a chain, or simply to
provide complement outputs of the input logic function.
• PD = 100 mW typ/pkg (No Load)
• tpd = 1.8 ns typ (Single ended)
• = 1.5 ns typ (Differential)
• tr, tf = 1.5 ns typ (20%–80%)
LOGIC DIAGRAM
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
4
5
9
10
12
13
2
3
www.DataSheet4U.com
6
7
14
15
11
VBB
*VBB to be used to supply bias to the MC10216 only and
bypassed (when used) with 0.01 µF to 0.1 µF capacitor.
When the input pin with bubble goes positive, it’s
respective output pin with bubble goes positive.
DIP PIN ASSIGNMENT
VCC1
AOUT
AOUT
AIN
AIN
BOUT
BOUT
VEE
1
2
3
4
5
6
7
8
16 VCC2
15 COUT
14 COUT
13 CIN
12 CIN
11 VBB
10 BIN
9 BIN
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
http://onsemi.com
CDIP–16
L SUFFIX
CASE 620
PDIP–16
P SUFFIX
CASE 648
PLCC–20
FN SUFFIX
CASE 775
MARKING
DIAGRAMS
16
MC10216L
AWLYYWW
1
16
MC10216P
AWLYYWW
1
1
10216
AWLYYWW
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC10216L
CDIP–16
25 Units / Rail
MC10216P
PDIP–16
25 Units / Rail
MC10216FN
PLCC–20
46 Units / Rail
© Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7
1
Publication Order Number:
MC10216/D
1 page  
MC10216
PACKAGE DIMENSIONS
CDIP–16
–A– L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
16 9 ISSUE T
–B–
18
CL
–T–
SEATING
PLANE
F
NK
E
G
D 16 PL
0.25 (0.010) M T A S
M
J 16 PL
0.25 (0.010) M T B S
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C --- 0.200 --- 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
–A–
16
1
H
G
9
B
8
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
FC
S
L
–T–
SEATING
PLANE
KJ
D 16 PL
0.25 (0.010) M T A M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC
2.54 BSC
H 0.050 BSC
1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0_ 10_ 0 _ 10 _
S 0.020 0.040 0.51 1.01
http://onsemi.com
5
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| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MC10216.PDF ] | |
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