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PDF MBRB1545CT Data sheet ( Hoja de datos )

Número de pieza MBRB1545CT
Descripción SWITCHMODE Power Rectifier D2PAK Surface Mount Power Package
Fabricantes Motorola Semiconductors 
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No Preview Available ! MBRB1545CT Hoja de datos, Descripción, Manual

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MBRB1545CT/D
Designer's Data Sheet
SWITCHMODEPower Rectifier
D2PAK Surface Mount Power Package
The D2PAK Power Rectifier employs the Schottky Barrier principle with a
platinum barrier metal. These state-of-the-art devices have the following
features:
Center-Tap Configuration
Guardring for Stress Protection
Low Forward Voltage
150°C Operating Junction Temperature
Epoxy Meets UL94, VO at 1/8
Guaranteed Reverse Avalanche
Short Heat Sink Tab Manufactured — Not Sheared!
Similar in Size to the Industry Standard TO-220 Package
Mechanical Characteristics
1
Case: Epoxy, Molded
Weight: 1.7 grams (approximately)
3
Finish: All External Surfaces Corrosion Resistant and Terminal Leads are
Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes: 260°C
Max. for 10 Seconds
Shipped 50 units per plastic tube
Available in 24 mm Tape and Reel, 800 units per 13reel by adding a “T4”
suffix to the part number
Marking: B1545T
MBRB1545CT
Motorola Preferred Device
SCHOTTKY BARRIER
RECTIFIER
15 AMPERES
45 VOLTS
4
41
3
CASE 418B-02
D2PAK
MAXIMUM RATINGS, PER LEG
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM 45 Volts
VRWM
VR
Average Rectified Forward Current
(Rated VR) TC = 105°C
Total Device
IF(AV)
7.5 Amps
15
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 105°C
IFRM
15 Amps
Non-repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150 Amps
Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS, PER LEG
IRRM
Tstg
TJ
dv/dt
1.0
– 65 to +175
– 65 to +150
10000
Amp
°C
°C
V/µs
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
(1) When mounted using minimum recommended pad size on FR-4 board.
RθJC
RθJA
2.0 °C/W
50
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 2
©RMeoctotriofilea,rInDce. 1v9ic96e Data
1

1 page




MBRB1545CT pdf
PACKAGE DIMENSIONS
MBRB1545CT
C
E
BV
4
123
S
–T–
SEATING
PLANE
G
D 3 PL
0.13 (0.005) M T
A
K
J
H
CASE 418B–02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.340 0.380
B 0.380 0.405
C 0.160 0.190
D 0.020 0.035
E 0.045 0.055
G 0.100 BSC
H 0.080 0.110
J 0.018 0.025
K 0.090 0.110
S 0.575 0.625
V 0.045 0.055
MILLIMETERS
MIN MAX
8.64 9.65
9.65 10.29
4.06 4.83
0.51 0.89
1.14 1.40
2.54 BSC
2.03 2.79
0.46 0.64
2.29 2.79
14.60 15.88
1.14 1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
Rectifier Device Data
5

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