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Número de pieza | LMH6572 | |
Descripción | Triple 2:1 High Speed Video Multiplexer | |
Fabricantes | National Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de LMH6572 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
No Preview Available ! August 2004
LMH6572
Triple 2:1 High Speed Video Multiplexer
General Description
The LMH™6572 is a high performance analog mulitplexer
optimized for professional grade video and other high fidelity
high bandwidth analog applications. The LMH6572 provides
a 290MHz bandwidth at 2 VPP output signal levels. The 140
MHz of .1 dB bandwidth and a 1500 V/µs slew rate make this
part suitable for High Definition Television (HDTV) and High
Resolution Multimedia Video applications.
The LMH6572 supports composite video applications with its
0.02% and 0.02˚ differential gain and phase errors for NTSC
and PAL video signals while driving a single, back terminated
75Ω load. The LMH6572 can deliver 80 mA linear output
current for driving multiple video load applications.
The LMH6572 has an internal gain of two for driving back
terminated transmission lines at a net gain of one.
The LMH6572 is available in the SSOP package.
Features
n 350 MHz, 250 mV −3 dB bandwidth
n 290 MHz, 2 VPP −3 dB bandwidth
n 10 ns channel switching time
n 90 dB channel to channel isolation @ 5 MHz
n 0.02%, 0.02˚ diff. gain, phase
n .1 dB gain flatness to 140 MHz
n 1400 V/µs slew rate
n Wide supply voltage range: 6V (±3V) to 12V (±6V)
n −78 dB HD2 @ 10MHz
n −75 dB HD3 @ 10MHz
Applications
n RGB video router
n Multi input video monitor
n Fault tolerant data switch
Connection Diagram
16-Pin SSOP
Truth Table
SEL
0
1
X
EN
0
0
1
OUT
CH 1
CH 0
Disable
Top View
20109605
Ordering Information
Package
16-Pin SSOP
Part Number
LMH6572MQ
LMH6572MQX
Package Marking
LH6572MQ
Transport Media
95 Units/Rail
2.5 Units Tape and Reel
NSC Drawing
MQA16
LMH™ is a trademark of National Semiconductor Corporation.
© 2004 National Semiconductor Corporation DS201096
www.national.com
1 page Typical Performance Characteristics Vs = ±5V, RL = 100Ω; unless otherwise specified.
Frequency Response vs. VOUT
Frequency Response vs. VOUT
20109602
Frequency Response vs. Capacitive Load
20109601
Suggested RS vs. Capacitive Load
Load= 1kΩ i CL
20109613
Harmonic Distortion vs. Output Voltage
20109604
Harmonic Distortion vs. Output Voltage
20109611
5
20109612
www.national.com
5 Page Other Applications (Continued)
POWER DISSIPATION
The LMH6572 is optimized for maximum speed and perfor-
mance in the small form factor of the standard SSOP pack-
age. To achieve its high level of performance, the LMH6572
consumes 23 mA of quiescent current, which cannot be
neglected when considering the total package power dissi-
pation limit. To ensure maximum output drive and highest
performance, thermal shutdown is not provided. Therefore, it
is of utmost importance to make sure that the TJMAX is never
exceeded due to the overall power dissipation.
Follow these steps to determine the Maximum power dissi-
pation for the LMH6572:
1. Calculate the quiescent (no-load) power: PAMP = ICC*
(VS), where VS = V+ - V−.
2. Calculate the RMS power dissipated in the output stage:
PD (rms) = rms ((VS - VOUT) * IOUT), where VOUT and
IOUT are the voltage across and the current through the
external load and VS is the total supply voltage.
3. Calculate the total RMS power: PT = PAMP + PD.
The maximum power that the LMH6572, package can dissi-
pate at a given temperature can be derived with the following
equation:
PMAX = (150˚ – TAMB)/ θJA, where TAMB = Ambient tempera-
ture (˚C) and θJA = Thermal resistance, from junction to
ambient, for a given package (˚C/W). For the SSOP package
θJA is 125˚C/W.
ESD PROTECTION
The LMH6572 is protected against electrostatic discharge
(ESD) on all pins. The LMH6572 will survive 2000V Human
Body model and 200V Machine model events. Under normal
operation the ESD diodes have no effect on circuit perfor-
mance. There are occasions, however, when the ESD di-
odes will be evident. If the LMH6572 is driven by a large
signal while the device is powered down the ESD diodes will
conduct. The current that flows through the ESD diodes will
either exit the chip through the supply pins or will flow
through the device, hence it is possible to power up a chip
with a large signal applied to the input pins. Shorting the
power pins to each other will prevent the chip from being
powered up through the input.
11 www.national.com
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet LMH6572.PDF ] |
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