(PDF) SIDC85D170H Datasheet - Fast switching diode chip in EMCON 3 -Technology

Número de pieza	SIDC85D170H
Descripción	Fast switching diode chip in EMCON 3 -Technology
Fabricantes	Infineon Technologies AG
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No Preview Available ! Preliminary SIDC85D170H Fast switching diode chip in EMCON 3 -Technology FEATURES: • 1700V EMCON 3 technology 200 µm chip • soft, fast switching • low reverse recovery charge • small temperature coefficient This chip is used for: • EUPEC power modules Applications: • resonant applications, drives A C Chip Type SIDC85D170H VR IF Die Size 1700V 150A 9.2 x 9.2 mm2 Package Ordering Code sawn on foil Q67050-A4178- A001 MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization Cathode metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 9.2 x 9.2 84.64 / 67.8 mm2 7.18 x 7.18 200 µm 150 mm 180 deg 160 pcs Photoimide 3200 nm Al Si 1% Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, ≤500µm ∅ 0.65mm; max 1.2mm store in original container, in dry nitrogen, < 6 month Edited by INFINEON Technologies AI PS DD HV3, L 4491A, Edition 1, 22.10.2001 1 page

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PDF SIDC85D170H Data sheet ( Hoja de datos )