|
|
PDF ISL6529A Data sheet ( Hoja de datos )
| Número de pieza | ISL6529A | |
| Descripción | Dual Regulator.Synchronous Rectified Buck PWM and Linear Power Controller | |
| Fabricantes | Intersil Corporation | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de ISL6529A (archivo pdf) en la parte inferior de esta página. Total 15 Páginas | ||
|
No Preview Available !
®
Data Sheet
October 2003
ISL6529A
FN9127
Dual Regulator–Synchronous Rectified
Buck PWM and Linear Power Controller
The ISL6529A provides the power control and protection for
two output voltages in high-performance graphics cards and
other embedded processor applications. The dual-output
controller drives two N-Channel MOSFETs in a synchronous
rectified buck converter topology and one N-Channel
MOSFET in a linear configuration. The ISL6529A provides
both a regulated high current, low voltage supply and an
independent, lower current supply integrated in an 14-lead
SOIC package. The controller is ideal for graphic card
applications where regulation of both the graphics
processing unit (GPU) and memory supplies is required.
The synchronous rectified buck converter incorporates
simple, single feedback loop, voltage-mode control with fast
transient response. Both the switching regulator and linear
regulator provide a maximum static regulation tolerance of
±1% over line, load, and temperature ranges for the
ISL6529AC and ±2% for the ISL6529C. Each output is user-
adjustable by means of external resistors.
An integrated soft-start feature brings both supplies into
regulation in a controlled manner. Each output is monitored
via the FB pins for undervoltage events. If either output
drops below 51.5% of the nominal output level, both
converters are shutdown.
Ordering Information
PART
NUMBER TEMP. RANGE (oC) PACKAGE
PKG.
DWG. #
ISL6529ACB
0 to 70
14 Ld SOIC M14.15
ISL6529ACB-T 14 Ld SOIC Tape and Reel
ISL6529ACR
0 to 70
16 Ld 5x5 QFN L16.5x5B
ISL6529ACR-T 16 Ld 5x5 Tape and Reel
ISL6529EVAL1 Evaluation Board
Features
• Provides two regulated voltages
- One synchronous rectified buck PWM controller
- One linear controller
• Both controllers drive low cost N-Channel MOSFETs
• 12V direct drive saves external components
• Small converter size
- 600kHz constant frequency operation
- Small external component count
• Excellent output voltage regulation
- Both outputs: ±1% over temperature - ISL6529AC
- Both outputs: ±2% over temperature - ISL6529C
• 5V down conversion
• PWM and linear output voltage range: down to 0.8V
• Simple single-loop voltage-mode PWM control design
• Fast PWM converter transient response
- High-bandwidth error amplifier
- Full 0–100% duty ratio
• Linear controller drives N-Channel MOSFET pass transistor
• Fully-adjustable outputs
• Undervoltage fault monitoring on both outputs
• QFN Package:
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat
No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Applications
• Graphics–GPU and memory supplies
• ASIC power supplies
• Embedded processor and I/O supplies
• DSP supplies
Related Literature
• Technical Brief TB363 Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL6529A
Absolute Maximum Ratings
UGATE, LGATE, DRIVE2,. . . . . . . . . . . . . . . GND - 0.3V to 12VCC
5VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to +7V
12VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to +14V
FB, FB2, COMP, . . . . . . . . . . . . . . . . . GND - 0.3V to 5VCC + 0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 4kV
Operating Conditions
Supply Voltage on 5VCC . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±10%
Supply Voltage on 12VCC . . . . . . . . . . . . . . . . . . . . . . . +12V ±10%
Supply Voltage to drain of Upper MOSFETs . . . +3.3V to +5V ±10%
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . 0oC to 70oC
Junction Temperature Range . . . . . . . . . . . . . . . . . . 0oC to 125oC
Thermal Information
Thermal Resistance
θJA (oC/W) θJC
SOIC Package (Note 1) . . . . . . . . . . . . . . 68
N/A
QFN Package (Note 2, 3). . . . . . . . . . . . . . 36
6
Maximum Junction Temperature
(Plastic Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . -65oC to 150oC
Maximum Lead Temperature
(Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. Refer to Block and Simplified Power System
Diagrams, and Typical Application Schematic
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Nominal Supply Current 12VCC
Nominal Supply Current 5VCC
POWER-ON RESET
ICC UGATE, LGATE and DRIVE2 Open
ICC UGATE, LGATE and DRIVE2 Open
- 2.7 3.0 mA
- 3.5 4.5 mA
Rising 5VCC Threshold
12VCC = 12V
4.25 4.4 4.5 V
Falling 5VCCThreshold
12VCC = 12V
3.75 3.82
4.0
V
Rising 12VCC Threshold
5VCC = 5V
9.6 10.3 10.8 V
Falling 12VCCThreshold
5VCC = 5V
9.3 9.6 10.2 V
OSCILLATOR AND SOFT-START
Free Running Frequency
Ramp Amplitude
Soft-Start Interval
REFERENCE VOLTAGE
FOSC
DVOSC
TSS
550 600 650 kHz
- 1.5 - VP-P
3.1 3.45 3.75 ms
Reference Voltage
System Accuracy
VREF
For the ISL6529AC
- 0.800 -
-1.0 - +1.0
V
%
PWM CONTROLLER ERROR AMPLIFIER
DC Gain
Gain-Bandwidth Product
Slew Rate
FB Input Current
COMP High Output Voltage
COMP Low Output Voltage
COMP High Output, Source Current
COMP Low Output, Sink Current
Undervoltage Level (VFB/VREF)
GBWP
SR
II
VOUT High
VOUT Low
IOUT High
IOUT Low
VUV
RL = 10k, CL = 10pf
RL = 10k, CL = 10pf
RL = 10k, CL = 10pf
VFB = 0.8V
- 80 - dB
- 15 - MHz
- 6 - V/µs
- 20 150 nA
3.0 4.5 - V
- 0.5 1.0 V
-2.5 -3.3
- mA
3.5 5.0
- mA
- 51.5 -
%
5
5 Page 
ISL6529A
A multi-layer printed circuit board is recommended. Figure 8
shows the connections of the critical components in the
converter. Note that capacitors CIN and COUT could each
represent numerous physical capacitors. Dedicate one solid
layer, usually a middle layer of the PC board, for a ground
plane and make all critical component ground connections
through vias to this layer. Dedicate another solid layer as a
power plane and break this plane into smaller islands of
common voltage levels. Keep the metal runs from the
PHASE terminal to the output inductor short. The power
plane should support the input and output power nodes. Use
copper filled polygons on the top and bottom circuit layers for
the phase node. Use the remaining printed circuit layers for
small signal wiring. The wiring traces from the UGATE pin to
the MOSFET gate should be kept short and wide enough to
easily handle the 1A of drive current.
The switching components should be placed close to the
ISL6529A first. Minimize the length of the connections
between the input capacitors, CIN, and the power switches
by placing them nearby. Position both the ceramic and bulk
input capacitors as close to the upper MOSFET drain as
possible. Position the output inductor and output capacitors
between the upper MOSFET and lower diode and the load.
+3.3 VIN
+5 VCC
5VCC
CBP
GND
CIN
+12 VCC
12VCC
CBP
PGND
UGATE
ISL6529A
Q1
LOUT
PHASE
VOUT1
LGATE
COMP
FB
Q2 COUT1
C2
R2
C1
R1
R4 C3 R3
+3.3 VIN
DRIVE2
FB2
R5
R6
Q3
VOUT2
COUT2
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 8. PRINTED CIRCUIT BOARD POWER PLANES
AND ISLANDS
The critical small signal components include any bypass
capacitors, feedback components, and compensation
components. Position the bypass capacitors, CBP, close to
the VCC pin with a via directly to the ground plane. Place the
PWM converter compensation components close to the FB
and COMP pins. The feedback resistors for both regulators
should also be located as close as possible to the relevant
FB pin with vias tied straight to the ground plane as required.
Component Selection Guidelines
Output Capacitor Selection
Output capacitors are required to filter the output and supply
the load transient current. The filtering requirements are a
function of switching frequency and output current ripple.
The load transient requirements are a function of the
transient load current slew rate (di/dt) and magnitude. These
requirements are generally met with a mix of capacitors and
careful layout.
PWM Regulator Output Capacitors
Modern digital ICs can produce high transient load slew
rates. High frequency capacitors initially supply the transient
current and slow the load rate-of-change seen by the bulk
capacitors. The bulk filter capacitor selection is generally
determined by the effective series resistance (ESR) and
voltage rating requirements rather than actual capacitance
requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements.
Specialized low-ESR capacitors intended for switching-
regulator applications are recommended for the bulk
capacitors. The bulk capacitor’s ESR determines the output
ripple voltage and the initial voltage drop following a high
slew-rate transient edge. Aluminum electrolytic, tantalum,
and special polymer capacitor ESR values are related to the
case size with lower ESR available in larger case sizes.
However, the equivalent series inductance (ESL) of these
capacitors increases with case size and can reduce the
usefulness of the capacitor to high slew-rate transient
loading. Unfortunately, ESL is not a specified parameter.
Work with your capacitor supplier and measure the
capacitor’s impedance with frequency to select a suitable
component. In most cases, multiple electrolytic capacitors of
small case size perform better than a single large case
capacitor.
PWM Output Inductor Selection
The PWM converter requires an output inductor. The output
inductor is selected to meet the output voltage ripple
requirements and sets the converter response time to a load
transient. The inductor value determines the converter’s
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet ISL6529A.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ISL6529 | Dual Regulator.Synchronous Rectified Buck PWM and Linear Power Controller | Intersil Corporation |
| ISL6529A | Dual Regulator.Synchronous Rectified Buck PWM and Linear Power Controller | Intersil Corporation |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |