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PDF CXB1810FN Data sheet ( Hoja de datos )

Número de pieza CXB1810FN
Descripción Post Amplifier for Optical Fiber Communication Receiver
Fabricantes Sony Corporation 
Logotipo Sony Corporation Logotipo



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CXB1810FN
Post Amplifier for Optical Fiber Communication Receiver
Description
The CXB1810FN achieves 2R optical fiber
communication receiver functions (Reshaping and
Regenerating) on a single chip.
This IC is equipped with a signal detection function,
and outputs at TTL level.
16 pin HSOF (plastic)
Features
Auto-offset canceler circuit
Signal interruption alarm output
Single 3.3V or 5.0V power supply
Applications
SONET/SDH
Absolute Maximum Ratings
Supply voltage
VCC – VEE
Input voltage difference
| VD – VDN |
ECL/TTL output current (Continuous)
(Surge)
Storage temperature
Tj
–0.3 to +6.0
2.5
50
70
–65 to +150
V
V
mA
mA
°C
Recommended Operating Conditions
Supply voltage
VCC – VEE
3.14 to 5.25
Termination voltage (for Q/QB)
Vt1
VCC – 1.8 to Vcc – 2.2
Termination resistance (for Q/QB) Rt
46 to 56
Operating temperature
Ta –40 to +85
V
V
°C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E99801D26-PS

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CXB1810FN pdf
CXB1810FN
Electrical Characteristics
DC Characteristics
(VCC = 3.14 to 5.25V, Ta = 40 to +85°C, unless otherwise specified)
Item
Symbol
Conditions
Q/QB high output voltage
Q/QB low output voltage
VOH1 51terminated to VCC 2V
VOL1 51terminated to VCC 2V
Q/QB output amplitude
Vp 51terminated to VCC 2V
SDC/SDCB high output voltage VOHT IOH = 0.2mA
SDC/SDCB low output voltage VOLT IOL = 2.1mA
Min. Typ. Max. Unit
VCC 1100
VCC 1800
VCC 650 mV
VCC 1300 mV
500 1000 mVp-p
2.4 V
0.5 V
SW high input voltage
SW low input voltage
VIHT
VILT
VCC 0.3
VEE
VCC
V
VEE + 0.3 V
Maximum input voltage
amplitude
D/DB input resistance
Supply current
Vmax During single-phase input
Rin
ICC All outputs open
1000
33
50
40
mVp-p
69
55 mA
AC Characteristics
(VCC = 3.14 to 5.25V, Ta = 40 to +85°C, unless otherwise specified)
Item
Symbol
Conditions
Min. Typ. Max. Unit
Limiting amplifier gain
GL
45 dB
Signal detection threshold voltage
Vth During single ended input
34 mVp-p
Signal detection hysteresis width
Signal detection response assert time1
Signal detection response deassert time1
P
Tas
Tdas
3 6 8 dB
0 100 µs
2.3 100 µs
Q/QB rise time (20 to 80%)
Q/QB fall time (20 to 80%)
TR 51terminated to VCC 2V
TF 51terminated to VCC 2V
130
110
ps
ps
1 Data = PN23 1 pattern, 100mVp-p single ended, Rd = open, CAP2/CAP3 = 470pF
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CXB1810FN arduino
CXB1810FN
3. Substrate layout
The exposed metal portions on the rear surface of the package used for the CXB1810FN are electrically
connected to the silicon substrate. Superior thermal radiation characteristics can be obtained by connecting
the rear surface of the package and these exposed metal portions to the ground surface on the PCB.
Providing lands directly below the package as shown in the figure below and connecting as many thermal vias
as possible to the inner layer ground surface is recommended.
0.4mm
0.25mm
1.45mm 0.75mm 2.0mm
4. Other
Be careful when handling this IC as its electrostatic discharge strength is weak.
Be sure to connect all power supply pins (VCCO, VCC) and ground pins (VEEO, VEE) to power supplies or
grounds, respectively. For example, if only VCCO is left open and power is supplied to the other pin, the IC
may malfunction.
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