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PDF CXA2500N Data sheet ( Hoja de datos )
| Número de pieza | CXA2500N | |
| Descripción | Dual REC/PB Preamplifier | |
| Fabricantes | Sony Corporation | |
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Dual REC/PB Preamplifier
CXA2500M/N
Description
The CXA2500M/N is a dual recording/playback pre-
amplifier system bipolar IC which has been developed
for the low voltage operating cassette tape recorder.
CXA2500M
24 pin SOP (Plastic)
CXA2500N
24 pin SSOP (Plastic)
Features
• Low quiescent current (VCC = 2V)
PB: ICC = 3.2mA (typ.)
REC: ICC = 5.2mA (typ.)
• Very few external parts
• Built-in Metal/Normal selection switch
• Small switching noise due to internal transient
muting
Applications
3V headphone radio cassette recorders
Structure
Bipolar silicon monolithic IC
Bock Diagram
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltage
VCC
7
V
• Operating temperature Topr –20 to +75 °C
• Storage temperature Tstg –65 to +150 °C
• Allowable power dissipation PD
CXA2500M
600 mW
CXA2500N
470 mW
Operating Conditions
Supply voltage PB
REC
VCC
VCC
1.2 to 3.5
1.6 to 3.5
V
V
24 23 22 21 20 19
MIC GCA
AGC
PB
AMP
MIC
6dB
12
GCA
22dB
3
AMP
12dB
PB
45
6
18 17 16 15 14 13
LINE
REC
PB/
REC
REF
AGC
DET
NORM/
METAL
LINE
–0.3dB
78
REC
20.5dB
9 10
TAPE/
TUNER
11 12
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94806B8Y
1 page  
CXA2500M/N
–5–
5 Page 
Package Outline
Unit: mm
CXA2500M
24
24PIN SOP (PLASTIC)
+ 0.4
15.0 – 0.1
13
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 – 0.05
CXA2500M/N
CXA2500N
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
∗SOP024-P-0300-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY / 42ALLOY
PACKAGE WEIGHT
0.3g
24PIN SSOP(PLASTIC)
∗7.8 ± 0.1
24 13
A
+ 0.2
1.25 – 0.1
0.1
1
b
B
0.13 M
12
0.65
0.1 ± 0.1
+ 0.1
b=0.22 – 0.05
(0.22)
b=0.22 ± 0.03
0° to 10°
DETAIL B : SOLDER
DETAIL B : PALLADIUM
NOTE: Dimension “∗” does not include mold protrusion.
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-24P-L01
SSOP024-P-0056
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
PACKAGE MASS
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 11 –
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet CXA2500N.PDF ] | |
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