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PDF CXA2093S Data sheet ( Hoja de datos )
| Número de pieza | CXA2093S | |
| Descripción | Sharpness for Display | |
| Fabricantes | Sony Corporation | |
| Logotipo |  |
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Sharpness for Display
Description
The CXA2093S is a bipolar IC which performs
contour accentuation for display RGB signals.
Features
• Sharpness time constant selection (50ns/100ns)
• Built-in sync separator for sync on green
• Differential output pins
• Built-in wide-band amplifier (200MHz/–[email protected])
Applications
Display
Structure
Bipolar silicon monolithic IC
Absolute Maximum Ratings (Ta = 25°C, GND = 0V)
• Supply voltage
VCC 7 V
• Operating temperature
Topr –20 to +75 °C
• Storage temperature
Tstg –65 to +150 °C
• Allowable power dissipation PD
1.13 W
Operating Conditions
Supply voltage
VCC 5 ± 0.25 V
CXA2093S
22 pin SDIP (Plastic)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E97680A26-PS
1 page  
CXA2093S
Electrical Characteristics
(Ta = 25°C, VCC = 5V)
No.
Item
Symbol
Measure-
ment pins
Input signals
Measurement contents
Min. Typ. Max. Unit
1
Power
consumption
ICC
6
16
18
Vcc pin inflow current
45 69 95 mA
2 I/O gain R
3 I/O gain G
4 I/O gain B
VGR 21
Input video signal to Pins 1, 3 and
5, input clamp pulse to Pin 13, and
–0.5
0.5
VGG
19
Pins 1, 3, 5: Sig-1
Pin 13: Sig-2
measure the output amplitude of
each output pin. Then calculate
the I/O gain.
–0.5
0.5
VGB 17
VGR = 20 log
output amplitude
0.7
–0.5
0.5
1.5 dB
1.5 dB
1.5 dB
5
Input dynamic
range
Drng
17
19
21
Pins 1, 3, 5: Sig-3
Pin 13: Sig-2
Input video signal to Pins 1, 3 and 5, input
clamp pulse to Pin 13, and measure the
output amplitude of each output pin.
0.9
1.05
1.2 Vp-p
6
Sharpness
gain 1
Pins 1, 3, 5: CW Input 30MHz and 0.1Vp-p sine wave
VSG1 19 Pin 13: 5 V
to Pins 1, 3 and 5, and measure the 60
Pin 12: 0.5 V output amplitude of Pin 19.
110 150 mVp-p
7
Sharpness
gain 2
Input 30MHz and 0.1Vp-p sine wave
to Pins 1, 3 and 5, and measure the
Pins 1, 3, 5: CW output amplitude of Pin 19. Then
VSG2 19 Pin 13: 5 V
calculate the I/O gain.
5.0 7.0 9.0 dB
Pin 12: 2.5 V
VGR = 20 log
output amplitude
0.1
8
Sharpness
gain 3
Pins 1, 3, 5: CW Input 30MHz and 0.1Vp-p sine wave
VSG3 19 Pin 13: 5 V
to Pins 1, 3 and 5, and measure the 60
Pin 12: 3.0 V output amplitude of Pin 19.
110 150 mVp-p
9
Sharpness
gain 4
Input 30MHz and 0.1Vp-p sine wave
VSG4 19
Pins 1, 3, 5: CW
Pin 13: 5 V
Pin 12: 4.5 V
to Pins 1, 3 and 5, and measure the
output amplitude of Pin 19. Then
calculate the I/O gain.
5.0
7.0
9.0 dB
VGR = 20 log
output amplitude
0.1
10
DIFOUT
output level
Pin 1: CW
VDF 15 Pin 13: 5 V
Pin 12: 4.5 V
Input 30MHz and 0.3Vp-p sine
wave to Pin 1, and measure the 290 375 455 mVp-p
output amplitude of Pin 15.
11
SYNCSEP
output high level
VSHi
Input video signal to Pin 7, and
measure the high level of Pin 14.
3.9
4.2
4.5
V
12
SYNCSEP
output low level
VSLo
14
Pin 7: Sig-4
13
SYNCSEP
output delay 1
SDtr
14
SYNCSEP
output delay 1
SDtf
Input video signal to Pin 7, and
measure the low level of Pin 14.
0.1
0.18 0.26
V
Vth = 50%
SDtr
Vth = 50%
SDtf
0 19 40 ns
30 51 70 ns
–5–
5 Page 
Package Outline
Unit: mm
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
22 12
1 11
1.778
0˚ to 15˚
CXA2093S
0.5 ± 0.1
+ 0.15
0.9 – 0.1
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-22P-01
SDIP022-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.95g
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
22 12
1 11
1.778
0˚ to 15˚
0.5 ± 0.1
+ 0.15
0.9 – 0.1
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-22P-01
SDIP022-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.95g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
– 11 –
Sony Corporation
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet CXA2093S.PDF ] | |
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