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PDF CXA2039M Data sheet ( Hoja de datos )

Número de pieza CXA2039M
Descripción Base Band Hue/Color Control
Fabricantes Sony Corporation 
Logotipo Sony Corporation Logotipo



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No Preview Available ! CXA2039M Hoja de datos, Descripción, Manual

Base Band Hue/Color Control
CXA2039M
Description
The CXA2039M is a bipolar color difference signal
processing IC for color TVs. This chip enables base
band hue and color control for color difference
signals.
24 pin SOP (Plastic)
Features
2 UV inputs, 1 UV output
3 Y inputs, 2 Y outputs
(1 of the 2 outputs outputs either of 2 inputs.)
Built-in color difference signal delay line circuit
Absolute Maximum Ratings
Supply voltage
VCC
Operating temperature Topr
Storage temperature
Tstg
Allowable power dissipation
PD
12 V
–20 to +75 °C
–65 to +150 °C
780 mW
Applications
Color TVs
Structure
Bipolar silicon monolithic IC
Operating Conditions
Supply voltage
VCC 9 ± 0.5 V
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E96X26C1Y-PS

1 page




CXA2039M pdf
Pin
No.
Symbol Pin voltage
16 COLOR
Equivalent circuit
VCC
60k
16
20k 8k
4.5V
8k
17 HUE
VCC
60k
17
20k 8k
4.5V
8k
18 Y SW
VCC
1.5k
18
VCC
19 TV IN
VCC
VCC VCC
19
1.5k
70k
CXA2039M
Description
Color control.
Control is performed by applying
a voltage of 0 to 9V.
Hue control.
Control is performed by applying
a voltage of 0 to 9V.
Y SW control.
DLY SW 1.4V TV IN signal
selected.
DLY SW 2.2V Y1 IN or Y2
IN signal
selected
(selected by
YUV SW).
Y signal input.
Input the signal via a capacitor.
21 BY2 IN
22 RY2 IN
23 Y2 IN
VCC
21
22
23
VCC VCC
1.5k
70k
Y2, R-Y2 and B-Y2 signal inputs.
Input the signals via capacitors.
5

5 Page





CXA2039M arduino
Package Outline
Unit: mm
24PIN SOP (PLASTIC)
+ 0.4
15.0 0.1
24
13
CXA2039M
+ 0.4
1.85 0.15
0.15
+ 0.2
0.1 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
SOP024-P-0300-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY / 42ALLOY
PACKAGE WEIGHT
0.3g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
11
Sony Corporation

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