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Número de pieza | CXP508L4 | |
Descripción | CMOS 4-bit Single Chip Microcomputer | |
Fabricantes | Sony Corporation | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CXP508L4 (archivo pdf) en la parte inferior de esta página. Total 11 Páginas | ||
No Preview Available ! CXP508L4/508L6
CMOS 4-bit Single Chip Microcomputer
For the availability of this product, please contact the sales office.
Description
The CXP508L4/508L6 is a CMOS 4-bit micro-
64 pin SDIP (Plastic)
64 pin QFP (Plastic)
computer which consists of 4-bit CPU, ROM, RAM,
I/O port, 8-bit timer, 8-bit timer/counter, 18-bit time
base timer, 8-bit serial I/O, vector interruption, and a
liquid crystal displayer (LCD) controller/driver. They
are integrated into a single clip with the standby
function etc. which are to be operated at low power
consumption.
Features
• Instruction cycle 4µs/2MHz (2.4V to 3.5V)
• ROM capacity 4.096 × 8 bits (CXP508L4)
6.144 × 8 bits (CXP508L6)
• RAM capacity 400 × 4 bits
(24 × 4 bits is used in combination
with the LCD display memory)
• 32 general purpose I/O ports
(For 16 segment outputs)
• LCD controller/driver (Direct drive possible)
— Optical specification of 24, 20 or 16 segment
outputs
— 1/2, 1/3, 1/4 duty selectable through program
— 1/3 bias
• 2 external interruption input pins
• 8-bit/4-bit variable serial I/O
• 8-bit timer, 8bit timer/event counter and 18-bit time
base timer are independently controllable
• Arithmetic and logical operations possible between
the entire RAM area, I/O area and the accumulator
by means of memory mapped I/O
• Reference to the entire ROM area is possible with
the table look-up instruction
• 2 types of power down models, sleep and stop
• 64-pin plastic SDIP/QFP available
• Piggy back package (CXP5080) available
Structure
Silicon gate CMOS IC
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E95108-ST
1 page CXP508L4/508L6
Electrical Characteristics
DC characteristics
(Ta = –20 to +75°C, VSS = 0V)
Item Symbol Pin
High level output
voltage
VOH
Low level output
voltage
VOL
PA to PF∗1,
PX0 to PX2,
PY0, PY1,
VL (VOL only)
Condition
VDD = 2.4V, IOH = –0.3mA∗2
VDD = 2.4V, IOH = –0.5mA∗2
VDD = 2.4V, IOH = –5µA∗3
VDD = 2.4V, IOH = –10µA∗3
VDD = 2.4V, IOL = 1.0mA
VDD = 2.4V, IOL = 2.0mA
Min. Typ. Max. Unit
1.8 V
1.4 V
1.8 V
1.4 V
0.4 V
0.6 V
Input current
IIH
IILE
IILR
IIL
High impedance
I/O leakage current
IIZ
EXTAL∗4
RST∗5
PA to PF∗6,
PX0 to PX2∗6,
PX3∗8, PY0∗7,
PY1∗7, PY2∗8,
PY3∗8, INT1∗8,
WP∗8, RST∗5
VDD = 3.5V, VIH = 3.5V
VDD = 3.5V, VIL = 0.4V
VDD = 3.5V
VI = 0, 3.5V
0.3
–0.3
–1.5
20
–20
–200
–1.0
µA
µA
µA
mA
±5 µA
Common output
impedance
Segment output
impedance
RCOM
RSEG
COM0 to COM3
SEG0 to SEG15
SEG16 to SEG23∗1
VDD = 3.5V
VLC1 = 2.65V
VLC2 = 1.75V
VLC3 = 0.88V
3 5 kΩ
5 15 kΩ
Current power
supply
IDD
IDDSP
VDD
VDD = 3.5V During external clock
1MHz operation
Entire output pins open
SLEEP mode
1.3 4 mA
0.6 1.2 mA
IDDS STOP mode
7 µA
Input capacitance CIN
VLC1 to VLC3,
COM0 to COM3,
SEG0 to SEG15,
SEG16 to SEG23∗1,
Other pins than VDD,
VSS
Clock 1MHz
0V other than the measured
pins
10 20 pF
∗1 The PE to PF show when the combined pins are selected as the port, and SEG16 to SEG23 show when
the combined pins are selected as the segment output.
∗2 It is when the respective pins of PA to PF and PX0 to PX2 select the 3-state output circuit, and PY0 and
PY1 are when the inverter output circuit is selected.
∗3 It is when the respective pins of PA to PF, PX0 to PX2, PY0 and PY1 select the pull-up resistance.
∗4 It is when the crystal or ceramic oscillation circuit is selected.
∗5 The RST pin specifies the input current when the pull-up resistance is selected, and specifies leakage
current when non-resistance is selected.
∗6 The respective pins of PA to PF and PX0 to PX2 specify the input current when the pull-up resistance is
selected, and specify the leakage current when in the port state during the 3-state output circuit or standby
is selected at high impedance.
∗7 The respective pins of PY0 and PY1 specify the input current when the pull-up resistance is selected, and
specify the leakage current when in the port state during standby is selected at high impedance.
∗8 The respective pins of PX3, PY2, PY3, INT1 and WP only specify the leakage current.
–5–
5 Page Package Outline
Unit: mm
64
64PIN SDIP (PLASTIC) 750mil
+ 0.4
57.6 – 0.1
33
1 32
1.778
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-64P-01
SDIP064-P-0750-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY / PHENOL RESIN
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
SOLDER PLATING
42 ALLOY
8.6g
51
52
64PIN QFP(PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
33
32
+ 0.1
0.15 – 0.05
0.15
64
1
1.0
20
+ 0.15
0.4 – 0.1
19
+ 0.35
2.75 – 0.15
± 0.12 M
+ 0.2
0.1 – 0.05
SONY CODE
EIAJ CODE
JEDEC CODE
QFP–64P–L01
∗ QFP064–P–1420
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
COPPER /42 ALLOY
PACKAGE WEIGHT
1.5g
– 11 –
CXP508L4/508L6
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet CXP508L4.PDF ] |
Número de pieza | Descripción | Fabricantes |
CXP508L4 | CMOS 4-bit Single Chip Microcomputer | Sony Corporation |
CXP508L6 | CMOS 4-bit Single Chip Microcomputer | Sony Corporation |
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