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PDF HMC208MS8 Data sheet ( Hoja de datos )

Número de pieza HMC208MS8
Descripción GaAs MMIC SMT DOUBLEBALANCED MIXER/ 0.7 - 2.0 GHz
Fabricantes Hittite Microwave Corporation 
Logotipo Hittite Microwave Corporation Logotipo



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v01.0801
MICROWAVE CORPORATION
HMC208MS8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 0.7 - 2.0 GHz
12
Typical Applications
The HMC208MS8 is ideal for:
• Base Stations
• PCMCIA Transceivers
• Cable Modems
• Portable Wireless
Functional Diagram
Features
Ultra Small Package: MSOP8
Conversion Loss: 9 dB
LO / RF Isolation: 24 dB
IP3 (Input): +17 dBm
General Description
The HMC208MS8 is an ultra miniature double-
balanced mixer in an 8 lead plastic surface mount
package (MSOP). This passive MMIC mixer is
constructed of GaAs Schottky diodes and novel
planar transformer baluns on the chip. The device
can be used as an upconverter, downconverter,
biphase (de)modulator, or phase comparator.
The consistent MMIC performance will improve
system operation and assure regulatory compli-
ance.
Electrical Specifications, TA = +25° C, As a Function of LO Drive
Parameter
Frequency Range, RF & LO
Frequency Range, IF
Conversion Loss
Noise Figure (SSB)
LO to RF Isolation
LO to IF Isolation
RF to IF Isolation
IP3 (Input)
1 dB Gain Compression (Input)
LO = +13 dBm
IF = 70 MHz
Min. Typ. Max.
0.7 - 2.0
DC - 0.5
9 10.5
9 10.5
20 24
13 17
10 14
13 17
7 10
LO = +10 dBm
IF = 70 MHz
Min. Typ. Max.
0.8 - 1.2
DC - 0.5
8.5 10.5
8.5 10.5
32 40
22 30
17 22
12 16
58
Units
GHz
GHz
dB
dB
dB
dB
dB
dBm
dBm
12 - 42
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com

1 page




HMC208MS8 pdf
v01.0801
MICROWAVE CORPORATION
HMC208MS8
GaAs MMIC SMT DOUBLE-
BALANCED MIXER, 0.7 - 2.0 GHz
Evaluation PCB
12
List of Material
Item
Description
J1 - J3
PC Mount SMA RF Connector
U1 HMC208MS8 Mixer
PCB*
101828 Evaluation Board
* Circuit Board Material: Rogers 4350
The circuit board used in the final application should
use RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads should be connected directly to the ground
plane similar to that shown. A sufficient number of VIA
holes should be used to connect the top and bottom
ground planes. The evaluation circuit board shown is
available from Hittite upon request.
12 - 46
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com

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