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PDF HS9-26C32RH Data sheet ( Hoja de datos )

Número de pieza HS9-26C32RH
Descripción Radiation Hardened Quad Differential Line Receiver
Fabricantes Intersil Corporation 
Logotipo Intersil Corporation Logotipo



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HS-26C32RH
August 1995
Radiation Hardened
Quad Differential Line Receiver
Features
Pinouts
• 1.2 Micron Radiation Hardened CMOS
- Total Dose Up to 300K RAD (Si)
• Latchup Free
• EIA RS-422 Compatible Outputs
• CMOS Compatible Inputs
• Input Fail Safe Circuitry
• High Impedance Inputs when Disabled or Powered
Down
• Low Power Dissipation 138mW Standby (Max)
• Single 5V Supply
• Full -55oC to +125oC Military Temperature Range
HS1-26C32RH 16 LEAD CERAMIC SIDEBRAZE DIP
MIL-STD-1835: CDIP2-T16
TOP VIEW
AIN 1
AIN 2
AOUT 3
ENABLE 4
COUT 5
CIN 6
CIN 7
GND 8
16 VDD
15 BIN
14 BIN
13 BOUT
12 ENABLE
11 DOUT
10 DIN
9 DIN
Description
The Intersil HS-26C32RH is a differential line receiver
designed for digital data transmission over balanced lines
and meets the requirements of EIA standard RS-422.
Radiation hardened CMOS processing assures low power
consumption, high speed, and reliable operation in the most
severe radiation environments.
The HS-26C32RH has an input sensitivity typically of 200mV
over the common mode input voltage range of ±7V. The
receivers are also equipped with input fail safe circuitry, which
causes the outputs to go to a logic “1” when the inputs are
open. Enable and Disable functions are common to all four
AIN
AIN
AOUT
ENABLE
COUT
CIN
CIN
GND
HS9-26C32RH 16 LEAD FLATPACK
MIL-STD-1835: CDFP4-F16
TOP VIEW
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
VDD
BIN
BIN
BOUT
ENABLE
DOUT
DIN
DIN
Logic Diagram
ENABLE ENABLE DIN DIN
CIN CIN
BIN BIN AIN AIN
+-
+-
+-
+-
DOUT
COUT
BOUT
AOUT
TRUTH TABLE
DEVICE
POWER
ON/OFF
ON
ON
ON
ON
ON
ON
ON
ENABLE
0
1
1
X
X
1
X
INPUTS
ENABLE
1
X
X
0
0
X
0
INPUT
X
VID VTH (Max)
VID VTH (Min)
VID VTH (Max)
VID VTH (Min)
Open
Open
OUTPUT
OUT
HI-Z
1
0
1
0
1
1
Ordering Information
PART NUMBER
HS1-26C32RH-8
HS1-26C32RH-Q
HS9-26C32RH-8
HS9-26C32RH-Q
HS1-26C32RH/Sample
HS1-26C32RH/Proto
HS9-26C32RH/Sample
HS9-26C32RH/Proto
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
-55oC to +125oC
-55oC to +125oC
+25oC
-55oC to +125oC
+25oC
-55oC to +125oC
SCREENING LEVEL
Intersil Class B Equivalent
Intersil Class S Equivalent
Intersil Class B Equivalent
Intersil Class S Equivalent
Sample
Prototype
Sample
Prototype
PACKAGE
16 Lead Sideboard DIP
16 Lead Sideboard DIP
16 Lead Flatpack
16 Lead Flatpack
16 Lead Sideboard DIP
16 Lead Sideboard DIP
16 Lead Flatpack
16 Lead Flatpack
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
407-727-9207 | Copyright © Intersil Corporation 1999
774
Spec Number 518790
File Number 3402.2

1 page




HS9-26C32RH pdf
HS-26C32RH
Intersil Space Level Product Flow -Q
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Die Attach (Note 1)
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
CSI and/or GSI Pre-Cap (Note 7)
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 24 Hours Min,
+125oC Min, Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% Static Burn-In 2, Method 1015, Condition A or B, 24
Hours Minimum, +125oC Minimum
100% Interim Electrical Test 1 (T2)
100% Delta Calculation (T0-T2)
100% PDA 1, Method 5004 (Note 2)
100% Dynamic Burn-In, Condition D, 240 Hours, +125oC or
Equivalent, Method 1015
100% Interim Electrical Test 2(T3)
100% Delta Calculation (T0-T3)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test (T4)
100% Fine/Gross Leak, Method 1014
100% Radiographic (X-Ray), Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
Sample - Group B, Method 5005 (Note 5)
Sample - Group D, Method 5005 (Notes 5 and 6)
100% Data Package Generation (Note 8)
CSI and/or GSI Final (Note 7)
NOTES:
1. Silver glass die attach shall be permitted.
2. Failures from subgroup 1, 7 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004. Per method 5004, 1 view
only is supplied on flat packages and leadless chip carriers, 2 views are supplied in all other cases.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Group B and D inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for Group B Test, Group B Samples, Group D Test and Group D Samples.
6. Group D Generic Data, as defined by MIL-I-38535, is optional and will not be supplied unless required by the P.O. When required, the
P.O. should include a separate line item for Group D Generic Data. Group D Generic Data. Generic data is not guaranteed to be available
and is therefore not available in all cases.
7. CSI and/or GSI inspections are optional and will not be performed unless required by the P.O. When required, the P.O. should include
separate line items for CSI PreCap inspection, CSI Final Inspection, GSI PreCap inspection, and/or GSI Final Inspection.
8. Data Package Contents:
• Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
• Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
• GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
• X-Ray report and film. Includes penetrometer measurements.
• Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
• Lot Serial Number Sheet (Good units serial number and lot number).
• Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
• Group B and D attributes and/or Generic data is included when required by the P.O.
• The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number 518790
778

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