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PDF BYV40E-150 Data sheet ( Hoja de datos )
| Número de pieza | BYV40E-150 | |
| Descripción | Rectifier diodes ultrafast/ rugged | |
| Fabricantes | NXP Semiconductors | |
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Philips Semiconductors
Rectifier diodes
ultrafast, rugged
Product specification
BYV40E series
FEATURES
• Low forward volt drop
• Fast switching
• Soft recovery characteristic
• Reverse surge capability
• High thermal cycling performance
• low profile surface mounting
package
SYMBOL
a1
1
k2
a2
3
QUICK REFERENCE DATA
VR = 150 V/ 200 V
VF ≤ 0.7 V
IO(AV) = 1.5 A
IRRM = 0.1 A
trr ≤ 25 ns
GENERAL DESCRIPTION
Dual, common cathode, ultra-fast,
epitaxial rectifier diodes intended
for use as output rectifiers in high
frequency switched mode power
supplies.
The BYV40E series is supplied in
the SOT223 surface mounting
package.
PINNING
PIN DESCRIPTION
1 anode 1
2 cathode
3 anode 2
tab cathode
SOT223
4
123
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
VRRM
VRWM
VR
IO(AV)
IFRM
IFSM
IRRM
IRSM
Tstg
Tj
Peak repetitive reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Tsp ≤ 120˚C
BYV40E
Average rectified output current square wave; δ = 0.5;
(both diodes conducting)1
Tsp ≤ 132˚C
Repetitive peak forward current t = 25 µs; δ = 0.5;
per diode
Non-repetitive peak forward
current per diode
Tsp ≤ 132 ˚C
tp = 10 ms
tp = 8.3 ms
sinusoidal; Tj = 150˚C prior
to surge; with reapplied
VRWM(max)
Repetitive peak reverse current tp = 2 µs; δ = 0.001
per diode
Non-repetitive peak reverse
current per diode
tp = 100 µs
Storage temperature
Operating junction temperature
-
-
-
-
-
-
-
-
-
-65
-
MAX.
-150
150
150
150
-200
200
200
200
1.5
1.5
6
6.6
0.1
0.1
150
150
UNIT
V
V
V
A
A
A
A
A
A
˚C
˚C
1 Neglecting switching and reverse current losses
September 1998
1
Rev 1.300
1 page  
Philips Semiconductors
Rectifier diodes
ultrafast, rugged
Product specification
BYV40E series
MECHANICAL DATA
Dimensions in mm
Net Mass: 0.11 g
0.32
0.24
6.7
6.3
3.1
2.9
4
B
A
0.2 M A
0.10
0.02
3.7 7.3
3.3 6.7
16 13
max
10
max
1.8 1.05
max 0.85
12
2.3 0.80
0.60
4.6
3
0.1 M B
(4x)
Fig.11. SOT223 surface mounting package.
Notes
1. For further information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines".
Order code: 9397 750 00505.
2. Epoxy meets UL94 V0 at 1/8".
September 1998
5
Rev 1.300
5 Page | ||
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| PDF Descargar | [ Datasheet BYV40E-150.PDF ] | |
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