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PDF BYV32F-150 Data sheet ( Hoja de datos )
| Número de pieza | BYV32F-150 | |
| Descripción | Rectifier diodes ultrafast/ rugged | |
| Fabricantes | NXP Semiconductors | |
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Philips Semiconductors
Rectifier diodes
ultrafast, rugged
Product specification
BYV32F, BYV32EX series
FEATURES
• Low forward volt drop
• Fast switching
• Soft recovery characteristic
• Reverse surge capability
• High thermal cycling performance
• Isolated mounting tab
SYMBOL
a1
1
k2
a2
3
QUICK REFERENCE DATA
VR = 150 V/ 200 V
VF ≤ 0.85 V
IO(AV) = 12 A
IRRM = 0.2 A
trr ≤ 25 ns
GENERAL DESCRIPTION
Dual, ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power
supplies.
The BYV32F series is supplied in the SOT186 package.
The BYV32EX series is supplied in the SOT186A package.
PINNING
SOT186
SOT186A
PIN DESCRIPTION
1 anode 1 (a)
case
case
2 cathode (k)
3 anode 2 (a)
tab isolated
12 3
12 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
VRRM
VRWM
VR
IO(AV)
IFRM
IFSM
IRRM
IRSM
Tstg
Tj
Peak repetitive reverse voltage
Crest working reverse voltage
Continuous reverse voltage
BYV32F / BYV32EX
Average rectified output current square wave
(both diodes conducting)1
δ = 0.5; Ths ≤ 95 ˚C
Repetitive peak forward current t = 25 µs; δ = 0.5;
per diode
Non-repetitive peak forward
Ths ≤ 95 ˚C
t = 10 ms
current per diode
t = 8.3 ms
sinusoidal; with reapplied
VRWM(max)
Repetitive peak reverse current tp = 2 µs; δ = 0.001
per diode
Non-repetitive peak reverse
current per diode
tp = 100 µs
Storage temperature
Operating junction temperature
-
-
-
-
-
-
-
-
-
-40
-
MAX.
-150
150
150
150
-200
200
200
200
12
20
125
137
0.2
0.2
150
150
UNIT
V
V
V
A
A
A
A
A
A
˚C
˚C
1 Neglecting switching and reverse current losses
October 1998
1
Rev 1.300
1 page  
Philips Semiconductors
Rectifier diodes
ultrafast, rugged
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
Product specification
BYV32F, BYV32EX series
10.2
max
5.7
max
3.2
3.0
0.9
0.5
4.4
4.0
seating
plane
4.4
max
2.9 max
7.9
7.5
17
max
3.5 max
not tinned
0.4 M
12 3
5.08
4.4
13.5
min
0.9
0.7
2.54
top view
0.55 max
1.3
Fig.12. SOT186; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
October 1998
5
Rev 1.300
5 Page | ||
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