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PDF AMMC-3040 Data sheet ( Hoja de datos )
| Número de pieza | AMMC-3040 | |
| Descripción | Double-Balanced Mixer | |
| Fabricantes | AVAGO | |
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AMMC-3040
18 - 36 GHz Double-Balanced Mixer
with Integrated LO Amplifier/Multiplier
Data Sheet
Chip Size: 2520 x 760 µm (99.2 x 29.9 mils)
Chip Size Tolerance: ± 10 µm (± 0.4 mils)
Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils)
Pad Dimensions: 75 x 75 µm (3 ± 0.4 mils)
Description
The AMMC-3040 is a broadband Double-Balanced Mixer
(DBM) with an integrated high-gain LO amplifier. This
MMIC can be used as either an up converter or down
converter in microwave or millimeter wave applications.
If desired, the LO amplifier can be biased to function as a
frequency multiplier to enable second harmonic mixing
of the LO input. The mixer section ofthe AMMC-3040
is fabricated using a suspended metal system to create
a unique, broadside-coupled balun structure (patent
pending) to achieve exceptional bandwidth. The MMIC
provides repeatable conversion loss without tuning, mak-
ing it highly suitable for automated assembly processes.
For improved reliability and moisture protection, the die
is passivated at the active areas.
AMMC-3040 Absolute Maximum Ratings[1]
Symbol Parameters/Conditions
Units Min. Max.
V D1, 2, 3, 4
V G1, 2, 3, 4
Idd
Tch
Tb
Tstg
T max
Positive Drain Voltage
Gate Voltage
Total Drain Current
Operating Channel Temp.
Operating Backside Temp.
Storage Case Temp.
Maximum Assembly Temp.
(60 sec max)
V
V -3.0
mA
°C
°C -55
°C -65
°C
5
0.5
550
+160
+165
+300
Note:
1. Operation in excess of any one of these conditions may result in
permanent damage to this device.
Features
• High IIP3: +23 dBm
• Wide bandwidth
• RF: 18-36 GHz
• LO: 18-36 GHz
• IF: DC-3 GHz
• Fundamental or subharmonic mixing
• Up or down converter
• Conversion loss: 9.5 dB
• P1dB: +17 dBm
• Low LO drive power: +2 dBm
• Usable to 42 GHz
Applications
• Point-to-point radio
• LMDS
• SATCOM
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.
1 page  
0 82
760
420
Vd1
700
Vg2
914
Vd2
1141
Vd3
1475
Vd4
2018
IF
2520
760
480
LO
96
0
Vg1
Vg2 Vg3
0 98
568 894
Figure 15. AMMC-3040 Bond pad locations, dimensions in microns
Vg4
1320
IF
2018
RF 300
1720
To VDD DC Drain
Supply Feed
Gold Plated Shim
(optional)
100 pF
Cb
LO
IF
0.6 pF
~500 µm long
wire
To VDD DC Drain
Supply Feed
Gold Plated Shim
(optional)
100 pF
Cb
LO
RF
IF
0.6 pF
~500 µm long
wire
RF
100 pF
Cb To VGG DC Gate
Supply Feed
To VGG DC Gate
Supply Feed
100 pF
Cb
100 pF
Cb To VGG DC Gate
Supply Feed
(a) Fundamental LO. Single drain and single gate supply assembly
for using the LO amplifier in fundamental frequency mixer applications.
(b) Sub-harmonic LO. Separate first-stage gate bias supply to use
the LO amplifier as a multiplier for application as a sub-harmonic mixer.
Figure 16. AMMC-3040 assembly diagram
(Note: To assure stable operation bias supply feeds should be bypassed to ground with a capacitor, Cb ≥ 100 pF typical.)
Biasing for Fundamental Mixing
The recommended DC bias condition for the AMMC-
3040 LO amplifier when used as a fundamental frequen-
cy mixer is with all four drains connected to a single 3.5
to 4.5 V supply and all four gates connected to an adjust-
able negative supply voltage as shown in Figure 16(a).
The gate voltage is adjusted for a total drain supply cur-
rent of typically 150 to 250 mA.
The second, third, and fourth stage DC drain bias lines
are connected internally and therefore require only a
single bond wire. A separate bond wire is needed for the
first stage DC drain bias, Vd1.
The third and fourth stage DC gate bias lines are con-
nected internally. A total of three DC gate bond wires are
required: one for Vg1, one for Vg2, and one for the Vg3/Vg4
connection. The internal matching circuitry at the RF in-
put creates a 50-ohm DC and RF path to ground. Any
DC voltage applied to the RF input must be maintained
below 1 volt, otherwise, a blocking capacitor should be
used. The RF output is AC coupled.
No ground bond wires are needed since the ground con-
nection is made by means of plated through via holes to
the backside of the chip.
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet AMMC-3040.PDF ] | |
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