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PDF SIA468DJ Data sheet ( Hoja de datos )
| Número de pieza | SIA468DJ | |
| Descripción | MOSFET ( Transistor ) | |
| Fabricantes | Vishay | |
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SiA468DJ
Vishay Siliconix
N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
30
RDS(on) () (MAX.)
0.0084 at VGS = 10 V
0.0114 at VGS = 4.5 V
ID (A) a
37.8
32.5
Qg (TYP.)
8.2 nC
PowerPAK® SC-70-6L Single
D
D6
S5
4
1 2.05 mm
Top View
S
72
3D
G
Bottom View
Marking Code: AX
Ordering Information:
SiA468DJ-T1-GE3 (lead (Pb)-free and halogen-free)
1
D
FEATURES
• TrenchFET® Gen IV power MOSFET
• 100 % Rg tested
• The highest continuous drain current capability
in its class
• Very low RDS-Qg FOM and Qgd elevate efficiency
• Increase power density of your design
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
D
• DC/DC converters and synchronous
buck converters
- Lower ringing voltage from soft turn-on
- High efficiency from fast turn-off
G
- Lower shoot-through possibility
• Battery charging and protection
• Load switch
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) c, d
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
VDS
VGS
ID
IDM
IS
PD
TJ, Tstg
LIMIT
30
+20 / -16
37.8
36.3
16.1 a, b
12.9 a, b
70
15.8
2.9 a, b
19
12
3.5 a, b
2.2 a, b
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient a, e
Maximum Junction-to-Case (Drain)
t5s
Steady state
SYMBOL
RthJA
RthJC
TYPICAL
28
5.3
MAXIMUM
36
6.5
UNIT
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board.
b. t = 5 s.
c. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
e. Maximum under steady state conditions is 80 °C/W.
S16-1266-Rev. A, 27-Jun-16
1
Document Number: 67408
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1 page  
www.vishay.com
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
SiA468DJ
Vishay Siliconix
Axis Title
42 10000
35
Package limited
28
1000
21
14 100
7
0 10
0 25 50 75 100 125 150
TC - Case Temperature (°C)
2nd line
Current Derating a
Axis Title
24 10000
2.20
1.76
18
1000
1.32
12
0.88
100
6
0.44
0 10
0 25 50 75 100 125 150
TC - Case Temperature (°C)
2nd line
Power, Junction-to-Case
0.00
0
25 50 75 100 125
TA - AmbientTemperature(°C)
150
Power, Junction-to-Ambient
Note
a. The power dissipation PD is based on TJ (max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit
S16-1266-Rev. A, 27-Jun-16
5
Document Number: 67408
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet SIA468DJ.PDF ] | |
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