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PDF CYRS1545AV18 Data sheet ( Hoja de datos )

Número de pieza CYRS1545AV18
Descripción 72-Mbit QDR II+ SRAM Four-Word Burst Architecture
Fabricantes Cypress Semiconductor 
Logotipo Cypress Semiconductor Logotipo



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CYRS1543AV18
CYRS1545AV18
72-Mbit QDR® II+ SRAM Four-Word
Burst Architecture with RadStop™ Technology
72-Mbit QDR® II+ SRAM Four-Word Burst Architecture with RadStop™ Technology
Radiation Performance
Radiation Data
Total Dose =300 Krad
Soft error rate (both Heavy Ion and proton)
Heavy ions 1 × 10-10 upsets/bit-day with an external SECDED
EDAC Controller
Neutrons = 2.0 × 1014 N/cm2
Dose rate = 2.0 × 109 rad(Si)/sec
Dose rate survivability (rad(Si)/sec) = 1.5 × 10^11 (rad(Si)/sec
Latch up immunity = 120 MeV.cm2/mg (125 °C)
Prototyping
Non-qualified CYPT1543AV18, and CYPT1545AV18 devices
with same functional and timing characteristics in a
165-ball Ceramic Column Grid Array (CCGA) package
Features
Separate independent read and write data ports
Supports concurrent transactions
250 MHz clock for high bandwidth
Four-word burst for reducing address bus frequency
Double data rate (DDR) interfaces on both read and write ports
at 250 MHz (data transferred at 500 MHz)
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR® II+ operates with 2.0 cycle read latency when the delay
lock loop (DLL) is enabled
Available in × 18, and × 36 configurations
Full data coherency, providing most current data
Core VDD = 1.8 (± 0.1 V); I/O VDDQ = 1.4 V to VDD
Available in 165-ball CCGA (21 × 25 × 2.83 mm)
HSTL inputs and variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
DLL for accurate data placement
Configurations
CYRS1543AV18 – 4 M × 18
CYRS1545AV18 – 2 M × 36
Functional Description
The CYRS1543AV18 and CYRS1545AV18 are synchronous
pipelined SRAMs, equipped with 1.8 V QDR II+ architecture with
RadStop™ technology. Cypress’s state-of-the-art RadStop
Technology is radiation hardened through proprietary design and
process hardening techniques.
The QDR II+ architecture consists of two separate ports: the read
port and the write port to access the memory array. The read port
has dedicated data outputs to support read operations and the
write port has dedicated data inputs to support write operations.
QDR II+ architecture has separate data inputs and data outputs
to completely eliminate the need to turnaround the data bus that
exists with common I/O devices. Each port can be accessed
through a common address bus. Addresses for read and write
addresses are latched on alternate rising edges of the input (K)
clock. Accesses to the QDR II+ read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with four 18-bit
words (CYRS1543AV18) or 36-bit words (CYRS1545AV18) that
burst sequentially into or out of the device. Because data can be
transferred into and out of the device on every rising edge of both
input clocks (K and K), memory bandwidth is maximized while
simplifying system design by eliminating bus turnarounds.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
For a complete list of related resources, click here.
Selection Guide
Description
Maximum operating frequency
Maximum operating current (125 °C,
concurrent R/W)
× 18
× 36
250 MHz
250
1275
1275
Unit
MHz
mA
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-60007 Rev. *L
• San Jose, CA 95134-1709 • 408-943-2600
Revised January 9, 2015

1 page




CYRS1545AV18 pdf
CYRS1543AV18
CYRS1545AV18
Pin Configuration
Pin configurations for CYRS1543AV18 and CYRS1545AV18. [1]
Figure 1. 165-ball CCGA pinout
CYRS1543AV18 (4 M × 18)
12345678
A
CQ NC/144M A
WPS BWS1
K NC/288M RPS
B NC Q9 D9 A NC K BWS0 A
C NC NC D10 VSS A NC A VSS
D NC D11 Q10 VSS VSS VSS VSS VSS
E
NC
NC
Q11
VDDQ
VSS
VSS
VSS
VDDQ
F
NC
Q12
D12
VDDQ
VDD
VSS
VDD
VDDQ
G
NC
D13
Q13
VDDQ
VDD
VSS
VDD
VDDQ
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
VDDQ
J
NC
NC
D14
VDDQ
VDD
VSS
VDD
VDDQ
K
NC
NC
Q14
VDDQ
VDD
VSS
VDD
VDDQ
L
NC
Q15
D15
VDDQ
VSS
VSS
VSS
VDDQ
M NC NC D16 VSS VSS VSS VSS VSS
N NC D17 Q16 VSS A A A VSS
P NC NC Q17 A
A QVLD A
A
R
TDO
TCK
A
A
A NC A
A
9
A
NC
NC
NC
NC
NC
NC
VDDQ
NC
NC
NC
NC
NC
NC
A
10
A
NC
Q7
NC
D6
NC
NC
VREF
Q4
D3
NC
Q1
NC
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
CYRS1545AV18 (2 M × 36)
1234567
A
CQ NC/288M A
WPS BWS2 K BWS1
B Q27 Q18 D18 A BWS3 K BWS0
C D27 Q28 D19 VSS A NC A
D D28 D20 Q19 VSS VSS VSS VSS
E
Q29
D29
Q20
VDDQ
VSS
VSS
VSS
F
Q30
Q21
D21
VDDQ
VDD
VSS
VDD
G
D30
D22
Q22
VDDQ
VDD
VSS
VDD
H
DOFF
VREF
VDDQ
VDDQ
VDD
VSS
VDD
J
D31
Q31
D23
VDDQ
VDD
VSS
VDD
K
Q32
D32
Q23
VDDQ
VDD
VSS
VDD
L
Q33
Q24
D24
VDDQ
VSS
VSS
VSS
M D33 Q34 D25 VSS VSS VSS VSS
N D34 D26 Q25 VSS A A A
P Q35 D35 Q26 A
A QVLD A
R
TDO
TCK
A
A
A NC A
Note
1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level.
8
RPS
A
VSS
VSS
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VDDQ
VSS
VSS
A
A
9
A
D17
D16
Q16
Q15
D14
Q13
VDDQ
D12
Q12
D11
D10
Q10
Q9
A
10
NC/144M
Q17
Q7
D15
D6
Q14
D13
VREF
Q4
D3
Q11
Q1
D9
D0
TMS
11
CQ
Q8
D8
D7
Q6
Q5
D5
ZQ
D4
Q3
Q2
D2
D1
Q0
TDI
Document Number: 001-60007 Rev. *L
Page 5 of 34

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CYRS1545AV18 arduino
CYRS1543AV18
CYRS1545AV18
Truth Table
CYRS1543AV18 and CYRS1545AV18 [2, 3, 4, 5, 6, 7]
Operation
Write cycle:
Load address on the
rising edge of K; input
write data on two
consecutive K and K
rising edges.
Read cycle: (2.0 Cycle
Latency) Load address
on the rising edge of K;
wait two cycles; read
data on two consecutive
K and K rising edges.
NOP: No operation
Standby: Clock stopped
K
L–H
L–H
L–H
Stopped
RPS WPS
DQ
H [8] L [9] D(A) at K(t + 1)
L [9] X Q(A) at K(t + 2)
H H D=X
Q = High Z
X X Previous state
DQ DQ DQ
D(A + 1) at K(t + 1)D(A + 2) at K(t + 2)D(A + 3) at K(t + 2)
Q(A + 1) at K(t + 2)Q(A + 2) at K(t + 3)Q(A + 3) at K(t + 3)
D=X
Q = High Z
Previous state
D=X
Q = High Z
Previous state
D=X
Q = High Z
Previous state
Write Cycle Descriptions
CYRS1543AV18 [2, 10]
BWS0
L
L
L
L
H
H
H
H
BWS1
L
L
H
H
L
L
H
H
KK
Comments
L–H – During the data portion of a write sequence:
CYRS1543AV18 both bytes (D[17:0]) are written into the device.
– L–H During the data portion of a write sequence
CYRS1543AV18 both bytes (D[17:0]) are written into the device.
L–H – During the data portion of a write sequence:
CYRS1543AV18 only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
– L–H During the data portion of a write sequence
CYRS1543AV18 only the lower byte (D[8:0]) is written into the device, D[17:9] remains unaltered.
L–H – During the data portion of a write sequence
CYRS1543AV18 only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
– L–H During the data portion of a write sequence
CYRS1543AV18 only the upper byte (D[17:9]) is written into the device, D[8:0] remains unaltered.
L–H – No data is written into the devices during this portion of a write operation.
– L–H No data is written into the devices during this portion of a write operation.
Notes
2. X = “Don't Care,” H = Logic HIGH, L = Logic LOW, represents rising edge.
3. Device powers up deselected with the outputs in a tristate condition.
4. “A” represents address location latched by the devices when transaction was initiated. A + 1, A + 2, and A +3 represents the address sequence in the burst.
5. “t” represents the cycle at which a read/write operation is started. t + 1, t + 2, and t + 3 are the first, second and third clock cycles respectively succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges.
7. We recommend that K = K = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically.
8. If this signal was LOW to initiate the previous cycle, this signal becomes a “Don’t Care” for this operation.
9. This signal was HIGH on previous K clock rise. Initiating consecutive read or write operations on consecutive K clock rises is not permitted. The device ignores the
second read or write request.
10. Is based on a write cycle that was initiated in accordance with the Write Cycle Descriptions table. BWS0, BWS1, BWS2, and BWS3 can be altered on different portions
of a write cycle, as long as the setup and hold requirements are achieved.
Document Number: 001-60007 Rev. *L
Page 11 of 34

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