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PDF HMC633LC4 Data sheet ( Hoja de datos )
| Número de pieza | HMC633LC4 | |
| Descripción | GaAs PHEMT MMIC DRIVER AMPLIFIER | |
| Fabricantes | Analog Devices | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de HMC633LC4 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
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v03.0514
Typical Applications
The HMC633LC4 is ideal for:
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• LO Driver for Mixers
• Military & Space
Functional Diagram
HMC633LC4
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5.5 - 17 GHz
Features
Gain: 30 dB
P1dB: +23 dBm
Saturated Power: +23.8 dBm @ 24% PAE
Supply Voltage: +5V @180 mA
50 Ohm Matched Input/Output
24 Lead Ceramic 4x4mm SMT Package: 16mm2
General Description
The HMC633LC4 is a GaAs PHEMT MMIC Driver
Amplifier in a leadless 4x4 mm ceramic surface mount
package which operates between 5.5 and 17 GHz.
The amplifier provides up to 30 dB of gain, +30 dBm
Output IP3, and +23 dBm of output power at 1 dB
gain compression, while requiring 180 mA from a +5V
supply. The HMC633LC4 is an ideal driver amplifier
for microwave radio applications from 5.5 to 17 GHz
and may be biased at +5V, 130 mA to provide 2 dB
lower gain with improved PAE. The amplifier’s I/Os are
DC blocked and matched to 50 Ohms with no external
matching required.
Electrical Specifications, TA = +25° C, Vdd1-4= 5V, Idd= 180mA [1]
Parameter
Frequency Range
Gain
Gain Variation Over Temperature
Input Return Loss
Output Return Loss
Output Power for 1 dB Compression (P1dB)
Saturated Output Power (Psat)
Output Third Order Intercept (IP3)
Noise Figure
Supply Current (Idd) (Idd = Idd1 + Idd2 + Idd3 + Idd4)
[1] Adjust Vgg between -2 to 0V to achieve Idd= 180 mA typical.
Min.
26
20
Typ.
5.5 - 9
30
0.030
22
22
23
23.8
30
10
180
Max.
0.040
Min.
25
18
Typ.
9 - 17
28
0.030
17
15
21
22
29
7
180
Max.
0.040
Units
GHz
dB
dB/ °C
dB
dB
dBm
dBm
dBm
dB
mA
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1 page  
v03.0514
Outline Drawing
HMC633LC4
GaAs PHEMT MMIC DRIVER
AMPLIFIER, 5.5 - 17 GHz
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80
MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-
6. ALL GROUND LEADS AND GROUND PADDLE MUST
BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
HMC633LC4
Alumina, White
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
Lead Finish
Gold over Nickel
MSL Rating
MSL3 [1]
Package Marking [2]
H633
XXXX
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5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet HMC633LC4.PDF ] | |
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