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PDF MIC4600 Data sheet ( Hoja de datos )
| Número de pieza | MIC4600 | |
| Descripción | 28V Half-Bridge MOSFET Driver | |
| Fabricantes | Microchip | |
| Logotipo |  |
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MIC4600
28V Half-Bridge MOSFET Driver
Features
• Adjustable Dead Time Circuitry
• Anti-Shoot-Through Protection
• Internal LDO For Single Supply Operation
• Input Voltage Range: 4.5V to 28V
• Fast Propagation Delay – 20 ns
• Up To 1.5 MHz Operation
• Low Voltage Logic Level Inputs For μC or FPGA
Driven Power Solutions
• Independent Inputs For Low and High Side
Drivers
• 2Ω Gate Drive Capable Of Driving 3000 pF Load
With 15 ns Rise and Fall Times
• Low 450 μA Typical Quiescent Current
• 3 mm × 3 mm VQFN Package
• –40C to +125C Junction Temperature Range
Applications
• Distributed Power Systems
• Communications/Networking Infrastructure
• Set-Top Box, Gateways And Routers
• Printers and Scanners
• μP and FPGA Controlled DC-DC Regulator
General Description
The MIC4600 is a 28V half bridge MOSFET driver
targeted for cost sensitive applications requiring high
performance such as set-top boxes, gateways, routers,
computing peripherals, telecom and networking
equipment.
The MIC4600 operates over a supply range of 4.5V to
28V. It has an internal linear regulator which provides a
regulated 5V to power the MOSFET gate drive and
operates up to 1.5 MHz switching frequency.
The MIC4600 uses an adjustable dead time circuit to
prevent shoot-through in the external high and low-side
MOSFETs.
The MIC4600 is available in a small 3mm × 3mm VQFN
package with a junction temperature range of –40°C to
125°C.
Package Types
MIC4600
3x3 VQFN
Top View
16 15 14 13
VIN 1
EN 2
HSI 3
LSI 4
EPAD
12 DH
11 SW
10 DL
9 PGND
56 78
2016 Microchip Technology Inc.
DS20005584A-page 1
1 page  
MIC4600
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym. Min. Typ.
Max. Units
Conditions
Temperature Ranges
Junction Temperature
Lead Temperature
TJ
— +150
—
°C —
— — 260 — °C Soldering, 10sec.
Junction Operating Temperature
Storage Temperature Range
TJ –40 —
TA –65 —
+125
+150
°C —
°C —
Package Thermal Resistances
Thermal Resistance, 3 x 3 VQFN-16Ld JA
—
59
— °C/W —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2016 Microchip Technology Inc.
DS20005584A-page 5
5 Page 
VDD
DL
EXTERNAL
FET
MIC4600
voltage across capacitor CB is applied to the gate of the
upper external MOSFET. As the upper MOSFET turns
on, voltage on the SW pin rises with the source of the
high-side MOSFET until it reaches VIN. As the SW and
BST pins rise, the diode is reverse biased preventing
capacitor CB from discharging.
PGND
FIGURE 4-2:
Low-Side Driver Circuit.
4.2.6
HIGH-SIDE DRIVER AND
BOOTSTRAP CIRCUIT
A block diagram of the high-side driver and bootstrap
circuit is shown in Figure 4-3. This driver is designed to
drive a floating N-channel MOSFET, whose source
terminal is referenced to the SW pin. The output
voltage of the DH pin equals VDD minus the external
bootstrap diode forward voltage drop. The high-side
gate drive voltage is typically 4.5V.
A low-power, high-speed, level-shifting circuit isolates
the low side (AGND pin) referenced circuitry from the
high-side (SW pin) referenced driver. Power to the
high-side driver is supplied by the bootstrap circuit.
VDD
BST
VIN
CB
LEVEL
SHIFT
EXTERNAL
FET
DH
FIGURE 4-4:
MIC4600 Driving a
Synchronous Buck Converter.
4.2.7 THERMAL SHUTDOWN
Thermal shutdown protects the driver from damage
due to excessive die temperature. If the die exceeds
the high temperature threshold, the output drive is
inhibited and the FAULT pin is asserted low. The driver
automatically resumes operation, and the FAULT pin is
de-asserted, when the die temperature cools below the
lower threshold, set by the circuit’s hysteresis. If
resumed operation results in reheating of the die above
the high threshold, another shutdown cycle occurs.
The switch continues thermal cycling until the condition
has been resolved.
4.2.8 FAULT PIN
The FAULT signal is an N-channel open drain output,
which is asserted low when the MIC4600 enters
thermal shutdown.
SW
FIGURE 4-3:
High-Side Driver and
Bootstrap Circuit.
The bootstrap circuit consists of an external diode and
external capacitor, CB. In a typical application, such as
the synchronous buck converter shown in Figure 4-4,
the SW pin is at ground potential while the low-side
MOSFET is on. During this time, the diode allows
capacitor CB to charge up to VDD-VF (where VF is the
forward voltage drop of the diode). After the low-side
MOSFET is turned off and the DH pin goes high, the
2016 Microchip Technology Inc.
DS20005584A-page 11
11 Page | ||
| Páginas | Total 26 Páginas | |
| PDF Descargar | [ Datasheet MIC4600.PDF ] | |
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