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PDF CPC2907B Data sheet ( Hoja de datos )
| Número de pieza | CPC2907B | |
| Descripción | Relay | |
| Fabricantes | IXYS | |
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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
60
2
0.15
Units
VP
Arms / ADC
Features
• Dual Relays
• Low On-resistance: 150m Max
• 2 Amp Load Current; Single-Pole Operation
• 4000Vrms Input/Output Isolation
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• 8-Pin SOIC Surface Mount Package
• Flammability Rating UL 94 V-0
Applications
• Security
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment-Patient/Equipment Isolation
• Industrial Controls
CPC2907B
Dual 60V Single-Pole
Normally Open OptoMOS® Relay
Description
CPC2907B is a dual, normally open (1-Form-A) Solid
State Relay that comprises two independent, optically
coupled MOSFET switches. The combination of highly
efficient LEDs and photovoltaic die makes possible an
input to output isolation of 4000Vrms.
The optically coupled output driver, which uses the
patented OptoMOS architecture, is controlled by a
highly efficient infrared LED.
Dual OptoMOS relays provide a more compact design
solution than discrete single-pole relays in a variety of
applications, saving board space by incorporating both
switches in a single 8-pin package.
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part #
CPC2907B
Description
8-Pin Power SOIC (25/Tube)
Pin Configuration
1
+ Control - Switch #1
2
– Control - Switch #1
3
+ Control - Switch #2
4
– Control - Switch #2
8
Load - Switch #1
7
Load - Switch #1
6
Load - Switch #2
5
Load - Switch #2
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
DS-CPC2907B-R02
www.ixysic.com
1
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INTEGRATED CIRCUITS DIVISION
CPC2907B
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC2907B
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
CPC2907B
Classification Temperature (Tc)
245ºC
Dwell Time (tp)
30 seconds
Max Reflow Cycles
3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R02 www.ixysic.com
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC2907B.PDF ] | |
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