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PDF CPC2017N Data sheet ( Hoja de datos )
| Número de pieza | CPC2017N | |
| Descripción | Relay | |
| Fabricantes | IXYS | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC2017N (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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INTEGRATED CIRCUITS DIVISION
CPC2017N
Dual Normally Open
8-Pin SOIC OptoMOS® Relay
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
LED Current to operate
Rating
60
120
16
1
Units
VP
mArms / mADC
mA
Features
• Designed for use in Security Systems Complying
with EN50130-4
• 1500Vrms Input/Output Isolation
• TTL/CMOS Compatible Input
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• SMD Pick & Place, Wave Solderable
• Tape & Reel Version Available
• Small 8-Pin SOIC Package
Applications
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Description
The CPC2017N is a miniature device with two
independent 1-Form-A solid state relays in an
8-Pin SOIC package that employs optically coupled
MOSFET technology to provide 1500Vrms of
input/output isolation.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient GaAIAs infrared LED.
The CPC2017N uses IXYS Integrated Circuits
Division’s state of the art, double-molded, vertical
construction packaging to produce one of the world’s
smallest relays. The CPC2017N offers substantial
board space savings over the competitor’s larger 8-Pin
SOIC relay.
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC2017N
CPC2017NTR
Description
8-Pin SOIC (50/tube)
8-Pin SOIC (2000/reel)
Pin Configuration
1
+ Control
2
– Control
3
+ Control
4
– Control
8
Load
7
Load
6
Load
5
Load
Switching Characteristics
of Normally Open (Form A) Devices
Form-A
Pb
DS-CPC2017N-R03
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INTEGRATED CIRCUITS DIVISION
CPC2017N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC2017N
Moisture Sensitivity Level (MSL) Rating
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC2017N
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC2017N.PDF ] | |
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