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Número de pieza | FPF1048 | |
Descripción | Slew-Rate-Controlled Load Switch | |
Fabricantes | Fairchild Semiconductor | |
Logotipo | ||
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FPF1048
IntelliMAX™ 3 A-Capable, Slew-Rate-Controlled Load Switch
with True Reverse Current Blocking
Features
Input Voltage Operating Range: 1.5 V to 5.5 V
Typical RDS(ON):
- 21 mΩ at VIN=5.5 V
- 23 mΩ at VIN=4.5 V
- 41 mΩ at VIN=1.8 V
- 90 mΩ at VIN=1.5 V
Slew Rate/Inrush Control with tR: 2.7 ms (Typ.)
3 A Maximum Continuous Current Capability
Low Off Switch Current: <1 µA
True Reverse Current Blocking (TRCB)
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >8 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC 61000-4-2 Contact Discharge: >8 kV
Applications
Smart Phones, Tablet PCs
Storage, DSLR, and Portable Devices
Description
The FPF1048 advanced load management switch
targets applications requiring a highly integrated
solution. It disconnects loads powered from the DC
power rail (<6 V) with stringent off-state current targets
and high load capacitances (up to 100 µF). The
FPF1048 consists of slew-rate controlled low-
impedance MOSFET switch (23 mΩ typical) and
integrated analog features. The slew-rate controlled
turn-on characteristic prevents inrush current and the
resulting excessive voltage droop on power rails.
The FPF1048 has a True Reverse Current Blocking
(TRCB) function that obstructs unwanted reverse
current from VOUT to VIN during both ON and OFF states.
The exceptionally low off-state current drain (<1µA
maximum) facilitates compliance with standby power
requirements. The input voltage range operates from
1.5 V to 5.5 VDC to support a wide range of applications
in consumer, optical, medical, storage, portable, and
industrial-device power management. Switch control is
managed by a logic input (active HIGH) capable of
interfacing directly with low-voltage control signal /
General-Purpose Input / Output (GPIO) without an
external pull-down resistor.
The device is packaged in advanced, fully “green”
compliant, 1.0 mm x 1.5 mm, Wafer-Level Chip-Scale
Package (WLCSP) with backside lamination.
Ordering Information
Part Number
Top
Mark
FPF1048BUCX RA
Switch RON
(Typical)
at 4.5VIN
23 mΩ
Input Output ON Pin
Buffer Discharge Activity
tR
CMOS
NA
Active
HIGH
2.7 ms
Package
6-Ball, WLCSP with
Backside Laminate, 2x3 Array,
0.5 mm Pitch, 300 µm Balls
© 2011 Fairchild Semiconductor Corporation
FPF1048 • Rev. 1.8
www.fairchildsemi.com
1 page Electrical Characteristics
Unless otherwise noted, VIN=1.5 to 5.5 V, TA=-40 to +85°C; typical values are at VIN=4.5 V and TA=25°C.
Symbol
Parameters
Conditions
Min. Typ. Max. Units
Basic Operation
VIN
IQ(OFF)
ISD
IQ
Input Voltage
Off Supply Current
Shutdown Current
Quiescent Current
VON=GND, VOUT=Open
VON=GND, VOUT=GND, TA= -40 to +85°C
IOUT=0 mA
VIN=5.5 V, IOUT=3 A(7)
VIN=5.5 V, IOUT=2 A(7)
1.5 5.5
1
0.2 4.0
11
22.0
21.5
V
μA
μA
μA
RON On Resistance
VIN=5.5 V, IOUT=1 A, TA=25°C
VIN=4.5 V, IOUT=3 A(7)
VIN=4.5 V, IOUT=2 A(7)
VIN=4.5 V, IOUT=1 A, TA=25°C
21.0 28.0
24.0
23.5
23.0 30.0
mΩ
VIN=3.3 V, IOUT=500 mA, TA=25°C
26.0
VIN=2.5 V, IOUT=500 mA, TA=25°C
30.0
VIN=1.8 V, IOUT=250 mA, TA=25°C
41.0
VIN=1.5 V, IOUT=250 mA, TA=25°C
90.0 110.0
VIH ON Input Logic High Voltage
VIN=1.5 V to 5.5 V
1.15 V
VIL ON Input Logic Low Voltage
ION ON Input Leakage
RON_PD Pull-Down Resistance at ON Pin
True Reverse Current Blocking
VIN=1.8 V to 5.5 V
VIN=1.5 V to 1.8 V
VON= VIN or GND
VIN= VON = 1.5 V to 5.5 V, TA= -40 - +85°C
6.38
7.65
0.65
0.60
1.0
8.86
V
V
μA
MΩ
VT_RCB RCB Protection Trip Point
VOUT - VIN
45 mV
VR_RCB
RCB Protection Release Trip
Point
VIN -VOUT
25 mV
RCB Hysteresis
ISD_OUT VOUT Shutdown Current
VON = 0, VOUT = 4.5 V, VIN = Short to GND
70 mV
2 μA
tRCB_ON RCB Response Time, Device ON VOUT - VIN=100 mV, VON = HIGH
4 µs
tRCB_OFF RCB Response Time, Device OFF VOUT - VIN=100 mV, VON = LOW
2.5 µs
Dynamic Characteristics
tDON
tR
tON
tDON
tR
tON
tDOFF
tF
tOFF
Turn-On Delay(8,9)
VOUT Rise Time(8,9)
Turn-On Time(8,9)
Turn-On Delay(8,9)
VOUT Rise Time(8,9)
Turn-On Time(8,9)
Turn-Off Delay(8,10)
VOUT Fall Time(8,10)
Turn-Off Time(8,10)
1.7 ms
VIN=4.5 V, RL=5 Ω, CL=100 µF, TA=25°C 2.7 ms
4.4 ms
VIN=4.5 V, RL=150 Ω, CL=100 µF,
TA=25°C
1.7 ms
1.5 ms
3.2 ms
VIN=4.5 V, RL=150 Ω, CL=100 µF,
TA=25°C
1.8 ms
34 ms
35 ms
Notes:
7. This parameter is guaranteed by design and characterization; not production tested.
8. tDON/tDOFF/tR/tF are defined in Figure 22.
9. tON=tR + tDON.
10. tOFF=tF + tDOFF.
© 2011 Fairchild Semiconductor Corporation
FPF1048 • Rev. 1.8
5
www.fairchildsemi.com
5 Page Physical Dimensions
0.03 C
2X
E AF
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.625
0.539
E
(Ø0.350)
SOLDER MASK
OPENING
A1
(Ø0.250)
Cu Pad
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.332±0.018
0.250±0.025
C SEATING PLANE D
SIDE VIEWS
0.50
0.005 C A B
Ø0.315 +/- .025
6X
1.00
0.50
C
B (Y) ±0.018
A
12
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 29. 6-Ball WLCSP, 2x3 Array, 0.5 mm Pitch, 300 µm Ball
Product-Specific Dimensions
Product
D
FPF1048BUCX
1460 µm ±30 µm
E
960 µm ±30 µm
X
230 µm
Y
230 µm
© 2011 Fairchild Semiconductor Corporation
FPF1048 • Rev. 1.8
11
www.fairchildsemi.com
11 Page |
Páginas | Total 13 Páginas | |
PDF Descargar | [ Datasheet FPF1048.PDF ] |
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