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PDF PS8601L1 Data sheet ( Hoja de datos )
| Número de pieza | PS8601L1 | |
| Descripción | 8-PIN PHOTOCOUPLER | |
| Fabricantes | NEC | |
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DATA SHEET
PHOTOCOUPLER
PS8601,PS8601L,PS8601L1,PS8601L2
HIGH SPEED ANALOG OUTPUT TYPE
8-PIN PHOTOCOUPLER
−NEPOC Series−
<R> DESCRIPTION
The PS8601 and PS8601L are 8-pin high speed photocouplers containing a GaAIAs LED on input side and a PN
photodiode and a high speed amplifier transistor on output side on one chip. The PS8601 is in a plastic DIP (Dual In-
line Package). The PS8601L is lead bending type (Gull wing) for surface mount.
The PS8601L1 is lead bending type for long creepage distance.
The PS8601L2 is lead bending type for long creepage distance (Gull-wing) for surface mount.
FEATURES
• High supply voltage
(VCC = 35 V MAX.)
• High speed response
(tPHL, tPLH = 0.8 µs MAX.)
• High isolation voltage
(BV = 5 000 Vr.m.s.)
• TTL, CMOS compatible with a resistor
• For Infrared reflow soldering
<R> • Ordering number of tape product : PS8601L-E3, E4: 1 000 pcs/reel
: PS8601L2-E3, E4: 1 000 pcs/reel
<R> • Safety standards
• UL approved: File No. E72422
• BSI approved: No. 8004, 8854
• DIN EN60747-5-2 (VDE0884 Part2) approved (Option)
APPLICATIONS
• Interface for measurement or control equipment
• Substitutions for relays and pulse transformers
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PN10262EJ02V0DS (2nd edition)
Date Published May 2006 NS CP(K)
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
1995, 2006
1 page  
PS8601,PS8601L,PS8601L1,PS8601L2
<R> ORDERING INFORMATION
Part Number
PS8601
PS8601L
PS8601L1
PS8601L2
PS8601L-E3
PS8601L-E4
PS8601L2-E3
PS8601L2-E4
PS8601-V
PS8601L-V
PS8601L1-V
PS8601L2-V
PS8601L-V-E3
PS8601L-V-E4
PS8601L2-V-E3
PS8601L2-V-E4
Order Number
Solder Plating
Specification
Packing Style
Safety Standard Application
Approval
Part Number*1
PS8601-A
Pb-Free
Magazine case 50 pcs
Standard products PS8601
PS8601L-A
(UL, BSI approved)
PS8601L1-A
PS8601L2-A
PS8601L-E3-A
Embossed Tape 1 000 pcs/reel
PS8601L-E4-A
PS8601L2-E3-A
PS8601L2-E4-A
PS8601-V-A
Magazine case 50 pcs
DIN EN60747-5-2
PS8601L-V-A
(VDE0884 Part2)
PS8601L1-V-A
Approved (Option)
PS8601L2-V-A
PS8601L-V-E3-A
Embossed Tape 1 000 pcs/reel
PS8601L-V-E4-A
PS8601L2-V-E3-A
PS8601L2-V-E4-A
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
<R>
<R>
Parameter
Diode Forward Current *1
Reverse Voltage
Power Dissipation
Detector Supply Voltage
Output Voltage
Output Current
Power Dissipation *2
Isolation Voltage*3
Operating Ambient Temperature
Storage Temperature
Symbol
IF
VR
PD
VCC
VO
IO
PC
BV
TA
Tstg
Ratings
25
5
45
35
35
8
100
5 000
−55 to +100
−55 to +100
Unit
mA
V
mW
V
V
mA
mW
Vr.m.s.
°C
°C
*1 Reduced to 0.25 mA/°C at TA = 25°C or more.
*2 Applies to output pin VO (collector pin). Reduced to 1.0 mW/°C at TA = 25°C or more.
*3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output.
Pins 1-4 shorted together, 5-8 shorted together.
Data Sheet PN10262EJ02V0DS
5
5 Page 
PS8601,PS8601L,PS8601L1,PS8601L2
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
180˚C
120˚C
120±30 s
(preheating)
(heating)
to 10 s
to 60 s
260˚C MAX.
220˚C
Time (s)
(2) Wave soldering
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
<R> (3) Soldering by soldering iron
• Peak temperature (lead part temperature) 350°C or below
• Time (each pins)
3 seconds or less
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
Data Sheet PN10262EJ02V0DS
11
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| PDF Descargar | [ Datasheet PS8601L1.PDF ] | |
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