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PDF LSM6DS33 Data sheet ( Hoja de datos )
| Número de pieza | LSM6DS33 | |
| Descripción | iNEMO inertial module | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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LSM6DS33
iNEMO inertial module:
always-on 3D accelerometer and 3D gyroscope
Datasheet - production data
LGA-16L (3 x 3 x 0.86 mm) typ.
Features
Power consumption: 0.9 mA in combo normal mode
and 1.25 mA in combo high-performance mode up to
1.6 kHz.
“Always-on” experience with low power
consumption for both accelerometer and gyroscope
Smart FIFO up to 8 kbyte based on features set
Compliant with Android K and L
±2/±4/±8/±16 g full scale
±125/±245/±500/±1000/±2000 dps full scale
Analog supply voltage: 1.71 V to 3.6 V
Independent IOs supply (1.62 V)
Compact footprint, 3 mm x 3 mm x 0.86 mm
SPI/I2C serial interface with main processor data
synchronization feature
Embedded temperature sensor
ECOPACK®, RoHS and “Green” compliant
Applications
Pedometer, step detector and step counter
Significant motion and tilt functions
Indoor navigation
Tap and double-tap detection
IoT and connected devices
Intelligent power saving for handheld devices
Vibration monitoring and compensation
Free-fall detection
6D orientation detection
Description
The LSM6DS33 is a system-in-package featuring a 3D
digital accelerometer and a 3D digital gyroscope
performing at 1.25 mA (up to 1.6 kHz ODR) in high-
performance mode and enabling always-on low-power
features for an optimal motion experience for the
consumer.
The LSM6DS33 supports main OS requirements,
offering real, virtual and batch sensors with 8 kbyte for
dynamic data batching.
ST’s family of MEMS sensor modules leverages the
robust and mature manufacturing processes already
used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using
specialized micromachining processes, while the IC
interfaces are developed using CMOS technology that
allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the
sensing element.
The LSM6DS33 has a full-scale acceleration range of
±2/±4/±8/±16 g and an angular rate range of
±125/±245/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the
LSM6DS33 the preferred choice of system designers
for the creation and manufacturing of reliable products.
The LSM6DS33 is available in a plastic land grid array
(LGA) package.
Table 1. Device summary
Part number
Temp.
range [°C]
Package
Packing
LSM6DS33
LSM6DS33TR
-40 to +85
-40 to +85
LGA-16L
(3 x 3 x 0.86 mm)
Tray
Tape &
Reel
October 2015
This is information on a product in full production.
DocID027423 Rev 4
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www.st.com
1 page  
LSM6DS33
Contents
9.54 INT_DUR2 (5Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
9.55 WAKE_UP_THS (5Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
9.56 WAKE_UP_DUR (5Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
9.57 FREE_FALL (5Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
9.58 MD1_CFG (5Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
9.59 MD2_CFG (5Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
10 Embedded functions register mapping . . . . . . . . . . . . . . . . . . . . . . . . . 69
11 Embedded functions registers description . . . . . . . . . . . . . . . . . . . . . 70
11.1 PEDO_THS_REG (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
11.2 SM_THS (13h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
11.3 PEDO_DEB_REG (14h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
11.4 STEP_COUNT_DELTA (15h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
12 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
13 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
13.1 LGA-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
13.2 LGA-16 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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LSM6DS33
1 Overview
Overview
The LSM6DS33 is a system-in-package featuring a high-performance 3-axis digital
accelerometer and 3-axis digital gyroscope.
The integrated power-efficient modes are able to reduce the power consumption down to
1.25 mA in high-performance mode, combining always-on low-power features with superior
sensing precision for an optimal motion experience for the consumer thanks to ultra-low
noise performance for both the gyroscope and accelerometer.
The LSM6DS33 delivers best-in-class motion sensing that can detect orientation and
gestures in order to empower application developers and consumers with features and
capabilities that are more sophisticated than simply orienting their devices to portrait and
landscape mode.
The event-detection interrupts enable efficient and reliable motion tracking and contextual
awareness, implementing hardware recognition of free-fall events, 6D orientation, tap and
double-tap sensing, activity or inactivity, and wakeup events.
The LSM6DS33 supports main OS requirements, offering real, virtual and batch mode
sensors. In addition, the LSM6DS33 can efficiently run the sensor-related features specified
in Android, saving power and enabling faster reaction time. In particular, the LSM6DS33 has
been designed to implement hardware features such as significant motion, tilt, pedometer
functions, and time stamping.
Up to 8 kbyte of FIFO with dynamic allocation of significant data (i.e. sensors, temperature,
step counter and time stamp) allows overall power saving of the system.
Like the entire portfolio of MEMS sensor modules, the LSM6DS33 leverages the robust and
mature in-house manufacturing processes already used for the production of
micromachined accelerometers and gyroscopes. The various sensing elements are
manufactured using specialized micromachining processes, while the IC interfaces are
developed using CMOS technology that allows the design of a dedicated circuit which is
trimmed to better match the characteristics of the sensing element.
The LSM6DS33 is available in a small plastic land grid array (LGA) package of
3 x 3 x 0.86 mm to address ultra-compact solutions.
DocID027423 Rev 4
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11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet LSM6DS33.PDF ] | |
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