|
|
PDF BU52058GWZ Data sheet ( Hoja de datos )
| Número de pieza | BU52058GWZ | |
| Descripción | Omnipolar Detection Hall IC | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de BU52058GWZ (archivo pdf) en la parte inferior de esta página. Total 18 Páginas | ||
|
No Preview Available !
Datasheet
Omnipolar Detection Hall IC
(Polarity detection for both S and N features dual outputs)
BU52058GWZ
●General Description
The BU52058GWZ is omnipolar Hall IC incorporating a
polarity determination circuit that enables operation
(output) on both the S- and N-poles, with the polarity
judgment based on the output processing configuration.
This Hall IC product can be in with movie, mobile phone
and other applications involving crystal panels to detect
the (front-back) location or determine the rotational
direction of the panel.
●Features
Omnipolar detection (polarity detection for both S
and N features dual outputs)
Micro power operation (small current using
intermittent operation method)
Ultra-compact CSP4 package (UCSP35L1)
Polarity judgment and output on both poles
(OUT1: S-pole output; OUT2: N-pole output)
High ESD resistance 8kV(HBM)
●Key Specifications
VCC voltage range:
Operate point:
Hysteresis:
Period:
Supply current (AVG):
Output type:
Operating temperature range:
1.65V to 3.6V
+/-3.0mT(Typ.)
0.9mT(Typ.)
50ms(Typ.)
5.0μA (Typ.)
CMOS
-40℃ to +85℃
●Package W(Typ.) x D(Typ.) x H(Max.)
UCSP35L1
0.80mm x 0.80mm x 0.40mm
●Applications
Mobile phones, notebook computers, digital video
camera, digital still camera, etc.
●Block Diagram, Pin Configuration and Pin Description
BU52058GWZ
VDD
B1
HALL
ELEMENT
×
TIMING LOGIC
0.1µF
Adjust the bypass capacitor value
as necessary, according to voltage
noise conditions, etc.
B2 OUT1
GND
VDD
A2 OUT2
The CMOS output terminals
enable direct connection to
the PC, with no external
pull-up resistor required.
A1
GND
PIN No.
A1
PIN NAME
GND
A2 OUT2
B1 VDD
B2 OUT1
FUNCTION
GROUND
OUTPUT
(respond the north pole)
POWER SUPPLY
OUTPUT
(respond the south pole)
COMMENT
A1 A2
A2 A1
B1 B2
Surface
B2 B1
Reverse
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed protection against radioactive rays
1/14
TSZ02201-0M3M0F413010-1-2
14.Feb.2013 Rev.001
1 page  
BU52058GWZ
●Typical Performance Curves -continued
Datasheet
20.0
18.0
VDD=1.8V
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
-60
-40 -20 0 20 40 60 80
AMBIENT TEMPERATURE [℃]
100
Figure 10. IDD – Ambient temperature
20.0
18.0 Ta = 25°C
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
1.4
1.8 2.2 2.6 3.0 3.4
SUPPLY VOLTAGE [V]
3.8
Figure 11. IDD – Supply
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0M3M0F413010-1-2
14.Feb.2013 Rev.001
5 Page 
BU52058GWZ
Datasheet
●Operational Notes
1) Absolute maximum ratings
Exceeding the absolute maximum ratings for supply voltage, operating conditions, etc. may result in damage to or
destruction of the IC. Because the source (short mode or open mode) cannot be identified if the device is damaged in this
way, it is important to take physical safety measures such as fusing when implementing any special mode that operates in
excess of absolute rating limits.
2) GND voltage
Make sure that the GND terminal potential is maintained at the minimum in any operating state, and is always kept lower
than the potential of all other pins.
3) Thermal design
Use a thermal design that allows for sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. Mounting errors, such as improper positioning
or orientation, may damage or destroy the device. The IC may also be damaged or destroyed if output pins are shorted
together, or if shorts occur between the output pin and supply pin or GND.
5) Positioning components in proximity to the Hall IC and magnet
Positioning magnetic components in close proximity to the Hall IC or magnet may alter the magnetic field, and therefore the
magnetic detection operation. Thus, placing magnetic components near the Hall IC and magnet should be avoided in the
design if possible. However, where there is no alternative to employing such a design, be sure to thoroughly test and
evaluate performance with the magnetic component(s) in place to verify normal operation before implementing the design.
6) Slide-by position sensing
Figure 21 depicts the slide-by configuration employed for position sensing. Note that when the gap (d) between the magnet
and the Hall IC is narrowed, the reverse magnetic field generated by the magnet can cause the IC to malfunction. As seen
in Figure 22, the magnetic field runs in opposite directions at Point A and Point B. Since the dual output Omnipolar
detection Hall IC can detect the S-pole at Point A and the N-pole at Point B, it can wind up switching output ON as the
magnet slides by in the process of position detection. Figure 23 plots magnetic flux density during the magnet slide-by.
Although a reverse magnetic field was generated in the process, the magnetic flux density decreased compared with the
center of the magnet. This demonstrates that slightly widening the gap (d) between the magnet and Hall IC reduces the
reverse magnetic field and prevents malfunctions.
Magnet
Slide
d
Hall IC
L
Figure 21
Flux
A
S
N
Figure 22
B
Flux
10
8
6
4
2
0
-2
-4
-6
-8
-10
0
Reverse
1 2 3 4 5 6 7 8 9 10
Horizontal distance from the magnet [mm]
Figure 23
7) Operation in strong electromagnetic fields
Exercise extreme caution about using the device in the presence of a strong electromagnetic field, as such use may cause
the IC to malfunction.
8) Common impedance
Make sure that the power supply and GND wiring limits common impedance to the extent possible by, for example,
employing short, thick supply and ground lines. Also, take measures to minimize ripple such as using an inductor or
capacitor.
9) GND wiring pattern
When both a small-signal GND and high-current GND are provided, single-point grounding at the reference point of the set
PCB is recommended, in order to separate the small-signal and high-current patterns, and to ensure that voltage changes
due to the wiring resistance and high current do not cause any voltage fluctuation in the small-signal GND. In the same way,
care must also be taken to avoid wiring pattern fluctuations in the GND wiring pattern of external components.
10) Exposure to strong light
Exposure to halogen lamps, UV and other strong light sources may cause the IC to malfunction. If the IC is subject to such
exposure, provide a shield or take other measures to protect it from the light. In testing, exposure to white LED and
fluorescent light sources was shown to have no significant effect on the IC.
11) Power source design
Since the IC performs intermittent operation, it has peak current when it’s ON. Please taking that into account and under
examine adequate evaluations when designing the power source.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0M3M0F413010-1-2
14.Feb.2013 Rev.001
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet BU52058GWZ.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| BU52058GWZ | Omnipolar Detection Hall IC | ROHM Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |