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PDF MX812 Data sheet ( Hoja de datos )

Número de pieza MX812
Descripción VSR CODEC
Fabricantes MX-COM 
Logotipo MX-COM Logotipo



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No Preview Available ! MX812 Hoja de datos, Descripción, Manual

DATABULLETIN
M X 8 1 2 VSR CODEC WITH
DRAM CONTROL
PRELIMINARY INFORMATION
Features and Applications
Half-Duplex Voice Storage and Retrieval
• Serial Bus µProcessor Control
• On-Chip DRAM Controller
• Up To 2 Minutes of High-Quality
Recorded Audio
• Answering Functions and Voice-
Notepad
• Low-Power 5-Volt CMOS
• Selectable Sample Rates and “Memory
Size”
MX812DW
28-pin SOIC
MX812J
28-pin CDIP
CLOCK
AUDIO OUT
VBIAS
AUDIO IN
EBIAS
VDD
VSS
CHIP SELECT
SERIAL CLOCK
COMMAND DATA
REPLY DATA
IRQ
CLOCK
GENERATOR
DEMOD
CVSD
CODEC
MOD
DRAM
CONTROL
POWER METER
STATUS REGISTER
SERIAL
C-BUS
INTERFACE
and
LOGIC
STORE/PLAY/WAIT COMMAND BUFFER
MODE REGISTER
Figure 1 - MX812 Voice Store and Retrieve Codec
WE
CAS
RAS1
A10/R2
A9
A8 EXTERNAL
A7 DRAM
A6
A5
1 or 2 x
A4 1Mbit
A3 DRAM
Chips
A2
A1 or
A0 1 x
D 4Mbit
DRAM
Chip
DGND
© 1997 MXCOM Inc.
www.mxcom.com Tele: 800 638-5577 910 744-5050 Fax: 910 744-5054
Doc. # 20480076.003
4800 Bethania Station Road, Winston-Salem, NC 27105-1201 USA All trademarks and service marks are held by their respective companies.

1 page




MX812 pdf
VSR CODEC with DRAM CONTROL
Application Information ......
+ 5.0V
5 MX812 PRELIMINARY INFORMATION
+ 5.0V
VDD WE
CAS
RAS1
A10/R2
A9
A8
A7
MX812 A6
A5
A4
A3
A2
A1
A0
DGND
D
VCC
W
CAS
RAS
A10
A9
A8
A7 4Mbit.
A6 DRAM
A5
A4
A3
A2
A1
A0
Q
D VSS
VDD WE
CAS
RAS1
A10/R2
A9
A8
A7
MX812 A6
A5
A4
A3
A2
A1
A0
DGND
D
VCC
W
CAS
RAS
A9
A8
A7 1Mbit.
A6 DRAM.
A5 No.1
A4
A3
A2
A1
A0
Q
D VSS
VCC
W
CAS
RAS
A9
A8
A7 1Mbit.
A6 DRAM.
A5 No.2
A4
A3
A2
A1
A0
Q
D VSS
Figure 4 - Example DRAM Connections
Choice of DRAM Devices
DRAM devices chosen should be standard 1,048,576 x 1 or 4,194,304 x 1 Dynamic Random Access
memories, with ‘CAS before RAS’ refresh, and a Row Address access time of 200 nano-seconds or less.
BANK A
SELECT
INPUTS
B
'HC04
'HC00
WE
CAS
RAS1
A10/R2
A9
A8
A7
MX812 A6
A5
A4
A3
A2
A1
A0
D
W
CAS
RAS
A10
A9
A8
A7
A6 4Mbit
A5 DRAM
A4 No. 1
A3
A2
A1
A0
Q
D
W
CAS
RAS
A10
A9
A8
A7
A6 4Mbit
A5 DRAM
A4 No. 2
A3
A2
A1
A0
Q
D
Figure 5 - Use of External Elements to Drive Two 4-MBit DRAM Chips
Driving Two 4-MBit DRAM Sections
By adding external logic circuitry, the MX812 can be configured
to drive two 4-MBit DRAM sections. This will have the effect of
doubling the available storage time. i.e. 4 minutes at 32kbps.
With reference to the circuitry shown in Figure 5:
With the Mode Register MS Bit set to “0” the MX812 treats the
DRAM sections as two 1-Mbit devices. The external logic makes
each 4-MBit DRAM appear as four 1-MBit banks selected by the
Bank Select lines ‘A’ and ‘B.’
Bank Select
Inputs
AB
00
10
01
11
DRAM No 1
Pages
0 – 1023
DRAM No 2
Pages
1024 – 2047
© 1997 MXCOM Inc.
www.mxcom.com Tele: 800 638-5577 910 744-5050 Fax: 910 744-5054
Doc. # 20480076.003
4800 Bethania Station Road, Winston-Salem, NC 27105-1201 USA All trademarks and service marks are held by their respective companies.

5 Page





MX812 arduino
VSR CODEC with DRAM CONTROL
11 MX812 PRELIMINARY INFORMATION
Specifications
Absolute Maximum Ratings
Exceeding the maximum rating can result in device
damage. Operation of the device outside the operating
limits is not suggested.
Supply Voltage
Input Voltage at any pin
(ref VSS = 0V)
Sink/source current (supply pins)
(other pins)
Total device dissipation
@ TAMB 25°C
Derating
Operating Temperature
Storage Temperature
-0.3 to 7.0 V
-0.3 to (VDD+0.3V)
±30mA
±20mA
800mW Max.
10mW/°C
-40°C to +85°C
-55°C to +125°C
Operating Limits
All devices were measured under the following
conditions unless otherwise noted.
VDD = 5.0V
TAMB = 25°C
Xtal/Clock f = 4.00MHz
0
Audio Level 0dB ref = 308mVrms @ 1kHz
Reply Data Line loaded with 50pF/200kto VSS
Characteristics
Static Values
Supply Voltage
Supply Current
Enabled
Powersaved
Analog Input Impedance
Analog Output Impedance (Decode)
Analog Output Impedance
(Encode or Powersave)
See Note
1
1
Min.
4.5
Typ.
5.0
3.0
1.0
100
1.0
500
Max.
5.5
Unit
V
mA
mA
k
k
k
DRAM Interface
Input Logic “1”
Input Logic “0”
Output Logic “1” (at Io = -120µA)
Output Logic “0” (at Io = 120µA)
Input Leakage Current (at VIN = 0 to VDD)
Input Capacitance
2
2
3
3
4
2
3.5 –
– – 1.5
2.7 –
– – 0.4
-1.0 – 1.0
– 10.0 –
V
V
V
V
µA
pF
Digital Interface
Input Logic “1”
Input Logic “0”
IIN (logic “1” or “0”)
Output Logic Levels
Output Logic “1” (-120µA)
Output Logic “0” (360µA)
I Out Tri-state
(logic “1” or “0”)
Input Capacitance
IOX (VOut = 5V)
5
5
5
6
7
6
5
8
3.5 –
––
-1.0 –
4.6 –
––
-4.0 –
––
––
–V
1.5 V
1.0 µA
–V
0.4 V
4.0 µA
7.5 pF
4.0 µA
© 1997 MXCOM Inc.
www.mxcom.com Tele: 800 638-5577 910 744-5050 Fax: 910 744-5054
Doc. # 20480076.003
4800 Bethania Station Road, Winston-Salem, NC 27105-1201 USA All trademarks and service marks are held by their respective companies.

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