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PDF MC100E310 Data sheet ( Hoja de datos )
| Número de pieza | MC100E310 | |
| Descripción | Low Voltage 2:8 Differential Fanout Buffer | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Low Voltage 2:8 Differential
Fanout Buffer
ECL/PECL Compatible
The MC100LVE310 is a low voltage, low skew 2:8 differential ECL
fanout buffer designed with clock distribution in mind. The device features
fully differential clock paths to minimize both device and system skew.
The LVE310 offers two selectable clock inputs to allow for redundant or
test clocks to be incorporated into the system clock trees. The
MC100E310 is pin compatible to the National 100310 device. The
MC100LVE310 works from a –3.3V supply while the MC100E310
provides identical function and performance from a standard –4.5V 100E
voltage supply.
MC100LVE310
MC100E310
LOW VOLTAGE
2:8 DIFFERENTIAL
FANOUT BUFFER
• Dual Differential Fanout Buffers
• 200ps Part–to–Part Skew
• 50ps Output–to–Output Skew
• Low Voltage ECL/PECL Compatible
• 28–lead PLCC Packaging
For applications which require a single–ended input, the VBB reference
voltage is supplied. For single–ended input applications the VBB
reference should be connected to the CLK input and bypassed to ground
via a 0.01µf capacitor. The input signal is then driven into the CLK input.
To ensure that the tight skew specification is met it is necessary that
both sides of the differential output are terminated into 50Ω, even if only
one side is being used. In most applications all nine differential pairs will
be used and therefore terminated. In the case where fewer than nine
pairs are used it is necessary to terminate at least the output pairs
adjacent to the output pair being used in order to maintain minimum skew.
Failure to follow this guideline will result in small degradations of
propagation delay (on the order of 10–20ps) of the outputs being used,
while not catastrophic to most designs this will result in an increase in
skew. Note that the package corners isolate outputs from one another
such that the guideline expressed above holds only for outputs on the
same side of the package.
FN SUFFIX
PLASTIC PACKAGE
CASE 776–02
The MC100LVE310, as with most ECL devices, can be operated from a positive VCC supply in PECL mode. This allows the
LVE310 to be used for high performance clock distribution in +3.3V systems. Designers can take advantage of the LVE310’s
performance to distribute low skew clocks across the backplane or the board. In a PECL environment series or Thevenin line
terminations are typically used as they require no additional power supplies, if parallel termination is desired a terminating voltage
of VCC–2.0V will need to be provided. For more information on using PECL, designers should refer to Motorola Application Note
AN1406/D.
7/95
© Motorola, Inc. 1996
4–1
REV 0.1
1 page  
MC100LVE310 MC100E310
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
Y BRK
-N-
B 0.007 (0.180) M T L –M S N S
U 0.007 (0.180) M T L –M S N S
D
Z
-L- -M-
WD
V
28 1
X
VIEW D-D
G1 0.010 (0.250) S T L –M S N S
A 0.007 (0.180) M T L –M S N S
H 0.007 (0.180) M T L –M S N S
Z
R 0.007 (0.180) M T L –M S N S
C
E
0.004 (0.100)
G
J
-T- SEATING
PLANE
G1 VIEW S
0.010 (0.250) S T L –M S N S
K1
K
F
VIEW S
0.007 (0.180) M T L –M S N S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 — 0.51 —
K 0.025 — 0.64 —
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y — 0.020 — 0.50
Z 2° 10° 2° 10°
G1 0.410 0.430 10.42 10.92
K1 0.040 — 1.02 —
ECLinPS and ECLinPS Lite
DL140 — Rev 3
4–5
MOTOROLA
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet MC100E310.PDF ] | |
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